Speakers
Laith Altimime
President, Semi Europe
Laith Altimime
President, Semi Europe
As President of SEMI Europe, Laith Altimime leads SEMI’s activities in Europe and Middle East and Africa (EMEA). Altimime has P&L responsibility as well as ownership of all Europe region programs and events, including SEMICON Europa.
He is responsible for establishing industry Standards, advocacy, community development, expositions, and programs. He provides support and services to SEMI members worldwide that have supply chain interests in Europe. He manages and nurtures relationships with SEMI members in the region and globally as well as with local association and constituents in industry, government, and academia.
Altimime has over 35 years of international experience in the semiconductor industry. Prior to joining SEMI in 2015, He held senior leadership positions at NEC, KLA-Tencor, Infineon, Altis, Qimonda and imec.
Abstract:
Global industry growth mega trends, headwinds and opportunities for global Private-Public collaborations.
Stefan Finkbeiner
CEO and GM, Bosch Sensortec GmbH
Stefan Finkbeiner
CEO and GM, Bosch Sensortec GmbH
Bio:
Stefan Finkbeiner received his Diploma in Physics from University of Karlsruhe in 1992. He then joined Max-Planck-Institut in Stuttgart and there received his PhD in Physics in 1995.
He joined Robert Bosch GmbH in 1995 and has been working in different positions related to the research, development, manufacturing, and marketing of sensors for more than 20 years. Senior positions at Bosch have included Director of Marketing for sensors, Director of Corporate Research in microsystems technology, and Vice President of Engineering for sensors.
In 2015, Dr. Finkbeiner was awarded with the prestigious lifetime achievement award from the MEMS & Sensors Industry Group.
Abstract:
Tiny sensors are catalysts for addressing major modern challenges: Enhancing air quality and elevating human well-being. Clean air is vital for well-being. Innovative MEMS technology measures health-damaging pollutants in the air and can help improve air quality. To further enhance well-being, MEMS sensors can track full-body motion, coupled with AI-driven personalization, providing real-time qualitative and quantitative feedback to users.
These examples underscore the synergy between MEMS sensors and smart algorithms, unlocking vast potential across diverse fields. This presentation emphasizes the transformative power of MEMS sensors, envisioning a world where technology not only enhances devices but also transforms lives. The presentation concludes with an outlook on innovative use cases ahead.
Theodore Sizer
EVP, Optical Research, Nokia Bell Labs
Theodore Sizer
EVP, Optical Research, Nokia Bell Labs
Bio :
Dr. Theodore (Tod) Sizer leads the Optical System and Device Research Lab in Nokia Bell Labs, leading teams innovating in all aspects of optical systems and devices for access, core, submarine, satellite, and data center communications. Prior to his current role, Tod lead Wireless Research in Nokia Bell Labs for eight years driving the vision and research of 5G. Tod graduated from Amherst College, and received his Masters and Doctorate in Optics from the Institute of Optics at the University of Rochester. In 2012 he received the Popular Science Breakthrough Innovation award for the lightRadio invention. Tod is a Fellow of Bell Labs, WWRF, and IEEE. He is the author of 55 US patents and a member of the IEEE and Optica.
Abstract :
Outside of the first 100m which might be carried over WiFi or 5G, nearly all communications are over optical fiber whether it is subsea, terrestrial, fiber to the home, or in the data center. This reality, however, is facing significant challenges due to fundamental limits we have reached in fiber communications. Managing the continued massive growth in communication requires new innovation to overcome the limits with new architectures, systems, and devices. For the optoelectronic semiconductor industry the challenge is to increase speed and parallelism in our devices while reducing the cost and energy per bit carried. In this talk we will share more on the challenge as well as the ways we are addressing in inside Nokia Bell Labs, particularly with research at the III-V Lab joint venture celebrating its 20th anniversary this year.
Fabio Gualandris
President, Quality, Manufacturing & Technology, STMicroelectronics
Fabio Gualandris
President, Quality, Manufacturing & Technology, STMicroelectronics
Bio :
Fabio Gualandris is STMicroelectronics’ President, Quality, Manufacturing, and Technology and has held this position since July 2023. He was responsible for the company’s Back-End Manufacturing & Technology organization since 2016 and also led the Company’s Testing Council, alongside its manufacturing strategy in Asia and efforts in System-in-Package technology. Gualandris is a member of ST’s Executive Committee.
Gualandris joined SGS Microelettronica (now ST) R&D in 1984. He became R&D Director of Operations in 1989 and became Automotive BU Director in 1996. After two years as President and CEO of Semitool, he rejoined ST in 2000 as Group VP responsible for memory products including the RAM/PSRAM and Automotive Flash. In 2005, Gualandris was appointed CEO of ST Incard, an ST smart-card subsidiary. In 2008-2010, he served as VP and Supply Chain General Manager at ST’s memory JV with Intel. In 2011, Gualandris was appointed ST’s Executive Vice President, Product Quality Excellence.
Gualandris has authored several technical and managerial papers and holds multiple international patents. He serves as Chairman of STS, ST's manufacturing JV in China.
Fabio Gualandris was born in Bergamo, Italy, in 1959. He holds a Master’s degree in Physics from the University of Milan.
Abstract:
Since ils inception in 1958, semiconductor technology has undergone rapid growth and innovation, positioning itself as one of the most dynamic segments in technological advancement. Following Moore's Law on technology evolution, and then transitioning to "More than Moore" approaches, the technology has progressed towards Soc and SiP architectures, ultimately leading to heterogeneous integration and chipie! technologies.New materials such as SiC and GaN have aise been introduced, complementing Silicon, which still remains indisputably the main actor.Alongside these materials, new manufacturing techniques including SOI, W2.W bonding, PLP, Fan-ln-Fan-Out, DCI, PCM, FD-SOI, and li-VI quantum dots have emerged. The advancement of semiconductor technology moved hand in hand with increasing in volumes, data processing capabilities, and automation, paving the way for Edge Al applications that leverage deep learning and ML algos. To sustain complexity and innovation, we implement edge-to-edge technology governance with integrated planning,
data-driven decisions, and multidimensional organizational structures.Specific examples will clarify these concepts.
Sanjay Natarajan
SVP & GM, Components Research, Intel
Sanjay Natarajan
SVP & GM, Components Research, Intel
Bio :
Sanjay Natarajan is a Senior Vice President and General Manager of Intel Foundry Technology Research & External R&D Engagements group at Intel Corporation. He is responsible for Intel's internal semiconductor research, external engagements with Universities and Consortia, and government engagements worldwide related to semiconductor R&D. During his 31-year career in the semiconductor R&D industry, Sanjay led the development of Intel's 14nm process technology, and prior to that, he led development of Intel's industry-leading 32nm process technology. In addition to Intel, Sanjay has held senior executive positions at Applied Materials, where he led a group developing new types of semiconductor equipment focused on extending Moore’s Law. Outside of work, Sanjay is a Research Professor in the Department of Mechanical & Materials Engineering at Portland State University. He also serves on the Advisory Boards to the Deans of Engineering at Portland State University and Carnegie Mellon University and serves on the Advisory Council for the National Science Foundation Engineering Directorate. He is an IEEE member and received his BS, MS, PhD in Electrical Engineering from Carnegie Mellon University.
Abstract :
For nearly 60 years, Moore’s Law has exponentially increased our ability to compute and has transformed the way we live. Today we live in a world in which nearly every aspect of our lives is touched by technology, including technology itself - which now finds itself in a virtuous cycle of increasing demand driven by increasing capability.
As graphics and AI applications create new and taxing compute workloads, storage needs and power-hungry data transfer rates, advancing Moore’s Law has become more relevant than ever.
Continued dimensional scaling, additional new materials, novel architectures and disruptive innovation at all levels of the compute system drive Intel’s research on the fundamentals of semiconductor technology in our relentless pursuit of Moore’s Law.
Laura Matz
CSTO, Merck
Laura Matz
CSTO, Merck
Bio :
Dr. Laura Matz serves as the Chief Science and Technology Officer at Merck KGaA Darmstadt, Germany, a role that entails spearheading the innovation agenda of a distinguished science and technology enterprise with a heritage exceeding 350 years in chemistry, biotechnology, and integrated materials solutions.
In her capacity, Laura collaborates closely with the Company Board and partners with Innovation Heads across Merck KGaA's three leading industry verticals: Life Science, Healthcare, and Electronics. Her visionary leadership is instrumental in shaping the future of the enterprise, leveraging digital and AI/ML technologies to drive innovation, exploring new markets, fostering strategic partnerships, and developing cutting-edge capabilities and digital business models to deliver groundbreaking solutions. A recent notable achievement includes her role as CEO in launching Athinia™, a joint venture with Palantir, which introduced a pioneering data collaboration platform for the semiconductor ecosystem.
Prior to assuming the role of CSTO, Laura held the position of Senior Vice President within EMD Electronics, previously Versum Materials and Air Products Electronics division. With over 20 years of experience in semiconductor manufacturing and a decade dedicated to running semiconductor materials businesses, she has been a driving force in advancing semiconductor materials development, emphasizing robust R&D initiatives to fuel business growth.
Laura is well-recognized for her leadership style, fostering diverse teams to innovate and solve complex challenges facing humanity. She advocates for the empowerment of young talent in science and engineering, recognizing their potential to drive meaningful change.
Beyond her role at Merck KGaA, Laura serves on the Board of Directors of transformative organizations. She is a board member of AIChE (American Institute of Chemical Engineers), championing a mission to inspire a safe, connected, and inclusive community of chemical engineering professionals worldwide. She contributes on the Board of SEMI Impact for Skills, a governance program focused on upskilling and reskilling initiatives, talent attraction, and accessing funding opportunities. Laura also serves as Director on the board of AION Labs, a Venture Studio pioneering a novel AI-based paradigm to drug innovation.
With her extensive industry experience, Laura is well regarded as a thought leader at the intersection of science, technology, innovation, and business.
Abstract :
Merck, a leading global Science and Technology company, operates across life science, healthcare, and electronics. With over 350 years ability in chemistry, biotechnology, and integrated materials solutions, Merck is at the forefront of leveraging data and digital technologies to drive innovation. By actively exploring new markets and developing its digital business models, Merck is leveraging its capabilities to deliver groundbreaking solutions to customers and patients.
In this presentation, Laura Matz, Merck's Chief Science and Technology Officer, will discuss the challenges faced by the Healthcare and Semiconductor industries and highlight how Merck utilizes digital business models and tools to provide solutions. Using AI as an example, she will showcase the benefits of data collaboration platforms in both Semiconductor and Healthcare industries as well as how AI is transforming drug discovery for proactive patient care.
Bernhard Quendt
CTO, Thales Group
Bernhard Quendt
CTO, Thales Group
Dr. Bernhard Quendt holds engineering degrees from the University of Stuttgart and Télécom Paris (ENST), and completed a PhD at the Technical University of Munich, where he was awarded the Rohde & Schwarz Prize.
Formerly Chief Technical Officer for Siemens Digital Industries, he joined the Siemens Communications division in 1999, before being appointed Vice President, R&D for Siemens Rail Automation in 2005. In 2011, he took charge of platform activities and R&D, as Vice President for Siemens Industrial Automation Systems, and, from 2015, held the position of Chief Technical Officer at Siemens Digital Industries.
Bernhard Quendt joined Thales in 2020 as Chief Technical Officer and Senior Vice President.
Jean-Philippe Fricker
Founder & Chief System Architect, Cerebras Systems
Jean-Philippe Fricker
Founder & Chief System Architect, Cerebras Systems
Jean-Philippe (J.P.) is Chief System Architect at Cerebras Systems. Before co-founding Cerebras, J.P. was Senior Hardware Architect at rack-scale flash array startup DSSD (acquired by EMC). Prior to DSSD, J.P. was Lead System Architect at SeaMicro where he designed three generations of fabric-based computer systems. Earlier in his career, J.P. was Director of Hardware Engineering at Alcatel-Lucent and Director of Hardware Engineering at Riverstone Networks. He holds an MS in Electrical Engineering from École Polytechnique Fédérale de Lausanne, Switzerland, and has authored 24 patents.
David Anderson
President, NY CREATES
David Anderson
President, NY CREATES
Bio :
David Anderson was appointed president of the New York Center for Research, Economic Advancement, Technology, Engineering and Science (NY CREATES) in April 2022.
He joined NY CREATES after most recently serving as President for SEMI Americas, the leading global industry association for the electronics manufacturing and design supply chain.
Anderson has a BS in Materials Engineering, an MBA and completed doctoral studies in Industrial Engineering and Management of Technology.
David Anderson has extensive experience in technology development, process engineering, operations management, supply chain, international marketing, government relations and strategy. He is an influential thought leader in articulating new technology business strategies, building high-performing executive teams, and rallying stakeholders around critical industry initiatives.
As President of NY CREATES, Anderson provides strategic leadership to the organization to grow and achieve its mission of accelerating new semiconductor technology research, workforce development and training, and fostering innovation that leads to regional economic advancement, creating strong partnerships with industry, academia, and state/federal government for research, education, and economic development programs.
Prior to NY CREATES, he was President of SEMI Americas, leading SEMI’s programs and visibility in the Americas with ownership of all Americas regional initiatives, projects and event. Before joining SEMI, Anderson was the Founder and CEO for Novati Technologies, Inc., which provided customized technology development and product commercialization services for semiconductor and bio/med-technologies in support of telecom, consumer, aerospace/defense and life sciences applications.
Before that, he held executive positions for development foundries ATDF and SVTC Technologies. Anderson also held leadership positions at Fairchild Semiconductor, National Semiconductor, and SEMATECH.
He has published numerous articles and industry presentations and has a BS degree from Purdue University in Materials/Metallurgical Engineering and a Master in Business Administration from Nasson College. He completed doctoral studies in Industrial Engineering/Management of Technology at Arizona State University. Anderson has served on several boards and was awarded the 2014 Innovator of the Year by EE Times and Electronic Design News (EDN) news media.
Sébastien Dauvé
CEO, CEA-Leti
Sébastien Dauvé
CEO, CEA-Leti
Bio:
Sébastien Dauvé was named CEO of CEA-Leti effective on July 1, 2021, after more than twenty years of experience in microelectronics technologies and their applications, including clean mobility, medicine of the future, cybersecurity, and power electronics.
Sébastien Dauvé started his career at the French Armament Electronics Center, where he worked on developing synthetic-aperture radar. In 2003, he joined CEA-Leti as an industrial transfer manager and supervised several joint research laboratories, in particular with the multinational Michelin.
In 2007, Sébastien Dauvé became a laboratory manager, then head of an R&D department in the area of sensors applied to the Internet of things and electric mobility. During this time, he supported the dissemination of new technologies in industry, including the automotive industry (Renault), aeronautics, national defense (SAFRAN), and microchips with the industry leader Intel. He played an active role in the creation of start-ups in application fields ranging from health to infrastructure security, leading to dozens of new jobs. In 2016, he became Director of the CEA-Leti Systems Division.
From sensors to wireless communication, Sébastien Dauvé has played an active role in the digital transformation, focused on coupling energy frugality and performance. He has made cross-disciplinary approaches central to innovation by harnessing the expertise of talented teams with diverse backgrounds. Their goal is to provide technological tools for meeting the major societal challenges of the future.
Sébastien Dauvé is a graduate of the French Ecole Polytechnique and the National Higher French Institute of Aeronautics and Space (ISAE-SUPAERO).
Michael Tchagaspanian
EVP Strategic Partnerships, CEA-Leti
Michael Tchagaspanian
EVP Strategic Partnerships, CEA-Leti
Electronics & Sustainability
Léa Di Cioccio
Eco-Innovation Program Manager, CEA-Leti
Léa Di Cioccio
Eco-Innovation Program Manager, CEA-Leti
Léa Di Cioccio is Director of Research at CEA-Leti. She is currently in charge of the CEA-Leti Eco innovation program.
Since 1990, when she joined the organization, she has conducted research activities in materials, epitaxy, direct bonding, etc. in the fields of 3D integration and power components in the frame of collaborations with STmicrolectronics, SOITEC and in lots European projects. She is the author of more than 200 publications, 5 book chapters and 40 patents. Concerned by the socio-ecological transitions underway, she is working to introduce these new paradigms into the organization's research methodologies and strategy.
Laurent Pain
Sustainable Electronics Program Director, CEA-Leti
Laurent Pain
Sustainable Electronics Program Director, CEA-Leti
Bio:
Laurent Pain is graduated from the Ecole Nationale Supérieure de Physique de Grenoble in 1992. He received his Ph D after his work on DUV resists study. He joined CEA-Leti in 1996 to work on infra-red technology, and then came back to STmicroelectronics in 1999 working on 193nm and e-beam lithography technologies.
From 2008 to 2014, Laurent Pain leaded the lithography laboratory of the silicon technology division of CEA-Leti. He was also managing in parallel the industrial consortium IMAGINE dedicated to the development of multibeam lithography with MAPPER lithography BV.
Since July 2014, within the CEA-Leti Silicon Technology Division, he is now in charge of the business and the partnerships developments of the Silicon Technologies Platform Division.
David Medeiros
Senior Director, Engineering, Entegris
Jean-Marc Girard
CTO & Sr VP. Manuf. Technologies, Air Liquide
Jean-Marc Girard
CTO & Sr VP. Manuf. Technologies, Air Liquide
Bio :
Jean-Marc Girard, Ph.D. is the CTO and Sr. VP of Manufacturing Technologies at Air Liquide Advanced Materials (ALAM), which is a leading supplier of dry deposition materials and low GWP etching gases. Jean-Marc leads ALAM’s R&D in the EU, US and Japan and oversees strategic partnerships with chip makers, equipment companies, and research institutes.
He graduated from Ecole Normale Superieure de Lyon in physical chemistry, and holds a Ph.D. (1994) from CEA - Université Paris-Sud in Plasma Physics. He joined Air Liquide in 1994 and held several positions of growing responsibilities in France and Japan, serving the semiconductor industry.
Abstract :
Fluorinated gases represent up to 80% of a fab's carbon footprint, and as such, harnessing their emission is key for our customers to meet their climate objectives. Among the other actions undertaken around abatement technologies, substitution -or anticipated substitution- of the highest impact gases is making rapid progresses at advanced nodes. However, installed capacity and legacy nodes manufacturing fabs are mildly receptive to process changes and new ways of collaboration must be developed to decrease the barrier to change.
Isabelle Servin
Sustainability advisor and eco-design engineer, CEA-Leti
Isabelle Servin
Sustainability advisor and eco-design engineer, CEA-Leti
Bio:
Isabelle SERVIN is a research scientist at CEA-Leti, Grenoble (France). Since 2022, she has joined the eco-innovation program, as sustainability advisor for Technological Silicon Platform. She evaluates the environnemental impacts of processes in clean room through The Life Cycle Assessment (LCA) methodology for IC industry. She has 20 years of experience in the development of lithography processes for microelectronics, both in industry and R&D. She received her PhD on polymer chemistry from University Pierre & Marie Curie (Paris, France) in 1998.
Abstract:
In semiconductor industry, energy efficiency and water management are crucial to reduce the environmental impacts of chips manufacturing.
CEA-Leti will propose ways to improvement energy efficiency both to infrastructure and production equipment.
Additionally, techniques such as water reuse and adoption of advanced technologies for water treatment and purification are currently implemented to reduce water usage in cleanrooms, contributing thus to sustainable management of resources.
François Marty
In charge of star monitoring, Team for the Planet
François Marty
In charge of star monitoring, Team for the Planet
Bio :
François has been working in the entrepreneurship and energy transition sectors for 10 years. Jack of all trades in a company, he invests in and advise TFTP’s stars, startups contributing to the transition.
Abstract :
Entrepreneurship is a powerful tool to change the world. Embark with Team for the Planet on a transformative journey to massively tackle CO2 emissions while redefining the paradigms of growth.
Elise Chaumat
Research Engineer – Eco-Innovation and LCA, CEA-Leti
Elise Chaumat
Research Engineer – Eco-Innovation and LCA, CEA-Leti
Bio:
Elise Chaumat is Life Cycle Assessment (LCA) and Eco-Design specialist at CEA-Leti. Elise is graduated from CentralSupelec (2020) and Arts & Métiers ParisTech on Change Management and Sustainable Innovation (2020). She works on environmental assessment and the sustainability of Power Electronic systems.
Abstract:
If many environmental impacts arise from electronics, the management of current and future e-waste has become a priority. With only 17% of the 53.6Mt e-waste generated per year being properly collected and recycled, a better management of electronics systems at their end-of-usage is imperative to reduce pollutions and recover part of strategic and scarce material sources. In this context, the EECONE European project aims at reducing e-waste on an European scale. Within the scope of this project, CEA-Leti, in collaboration with other academic and industrial partners, ambitions to develop a solution enabling the design of more circular and sustainable electronic systems. This talk will present a status of the current development of this solution.
Fabien Chêne
Head of Sustainability Business Europe, Schneider Electric
Fabien Chêne
Head of Sustainability Business Europe, Schneider Electric
Bio:
After finishing his studies - Engineer & Master's Innovation & Technology Management - EM Lyon- Fabien has joined Schneider Electric as a Business Development Manager where he has occupied the role of Director & Principal for Energy & Sustainability services before developing the solutions division of Business.
As the Head of Schneider Sustainability Business Europe, Fabien is at the forefront of advancing the company's commitment to sustainability and energy efficiency .
Fabien both crafts and ensures the adequate execution of strategies that aid global companies reduce their environmental impact & achieve their sustainability goals.
Fabien joined Schneider Sustainability Business in 2013 and has occupied diverse roles gaining a well-rounded and thorough understanding of each sector of operations to best lead the business.
Fabien is an expert advisor specializing in climate change strategy & guiding decarbonization efforts, dedicated to assisting Commercial & Industrial client on their path to Energy Efficiency & Electrification .
Abstract:
Minimizing the carbon footprint of the semiconductor industry is a key priority, particularly with scope 3 posing significant challenges. Decarbonizing the entire value chain effectively demands robust partnerships and industry-wide collaboration. Join us in this session to discover how forming the right partnerships can help reduce the carbon footprint of the semiconductor industry as a whole!
Tech for Health
Nadège Nief
Deputy head of Healthcare Division, CEA-Leti
Nadège Nief
Deputy head of Healthcare Division, CEA-Leti
Bio:
Biotechnology engineer by education, with additional skills in partnerships development, finance and cross functional management, Nadège spent 10 years in the pharmaceutical CDMO industry before joining CEA-Leti Health in 2017 as Deputy Head. CEA-Leti is a world leading Technological Research Institute specialized in microelectronics and information treatment. Its Healthcare division develops disruptive micro & nano technologies and integrated smart devices with a key mission to create innovation and to transfert it to industrials partners (and/or to create start ups) in the fields of medtech, biotechnology & bioproduction, and environmental monitoring.
Aurore Lepecq
Deputy Head of Energy Electronics & Sensors Systems Department in System Division, CEA-Leti
Aurore Lepecq
Deputy Head of Energy Electronics & Sensors Systems Department in System Division, CEA-Leti
Bio:
With a degree in Physical Sciences and an engineering background, I spent the first 14 years of my career at ST Microelectronics, a worldwild company, where I contributed to several projects in the areas of electronics, microelectronics, and optics. In 2019, I joined CEA--Leti in Grenoble as a Laboratory Manager in the field of Health Technologies (Medical Devices). Since 2023, I'm Deputy Head of the Sensors Systems and Electronic for Energy department at CEA-Leti. The department develop innovative systems that are both high-performing and sustainable. Our services primarily concentrate on three areas: autonomy of sensor systems, power conversion based on wide bandgap transistors, and predictive maintenance of systems.
Philippe Andreucci
Co-founder, CEO & Member Board Of Directors, Injectpower
Selim Olcum
VP of Engineering, Travera
Selim Olcum
VP of Engineering, Travera
Bio :
Dr. Olcum is a co-founder of Travera, a pioneering biotechnology company in functional precision medicine in cancer. He is one of the inventors of Travera’s 2-day Rapid Therapy Guidance Test that measures the ex vivo growth response of live tumor cells to treatment. Dr. Olcum, earned his Ph.D. degree in electrical engineering from Bilkent University. He has completed his post-doctoral training in Biological Engineering at MIT and served as a research scientist at the Koch Institute for Integrative Cancer Research. He is a Ph.D. technologist, has co-authored over 50 papers, is an inventor of 15 issued and pending patents in bioinstrumentation, medical devices, microfluidics, sensors, micro-devices, and their biotechnology and healthcare applications.
Abstract :
Functional precision medicine offers a promising complement to genomics-based cancer therapy guidance by directly testing drug efficacy on patient tumor cells. Travera's test, delivering therapy guidance in just two days, boasts over 80% predictive accuracy across multiple cancers, tissue types and therapies. This talk details Travera's methodology, which integrates single-cell mass measurements with linked brightfield imaging, and discusses linked single-cell volume, density, and morphology and their utilization for improving the predictive accuracy and in broader single-cell data landscape.
Christine Dufour
Silicon Microfluidics Program Manager, X-FAB
Kalyan Handique
Chief Innovation Officer, CDG, Bio-Rad Laboratories
Kalyan Handique
Chief Innovation Officer, CDG, Bio-Rad Laboratories
Bio:
Dr. Kalyan Handique is one of the most prolific biotech and medical device innovators from Michigan with over 400 world wide patents. He is the founder of two successful healthcare start-ups Handylab and Celsee Inc. He currently serves as the Chief Innovation Officer,CDG at BioRad Laboratories, a leader in global life sciences and clinical diagnostics markets. Kalyan joined BioRad through the successful acquisition of Celsee in April 2020. Celsee focused on developing innovative tehnologies for rare cell and single cell analysis. Before Celsee, Handy was a founder of HandyLab, a molecular diagnostics startup based in Ann Arbor, MI that was sold to Becton Dickinson for $300M+ in late 2009. He serves as an advisor, mentor and board member to many startups and seed funds in the Michigan Biotech Region. Handy holds a PhD in Chemical Engineering from the University of Michigan.
Abstract :
Microfluidics has been at the core of numerous molecular diagnostic tests developed for the research and clinical markets over the past few decades. This technology has enabled the development of portable integrated instruments that can analyze a few biomarkers, such as DNA, RNA, or proteins. These instruments are now available for use at the point of care. However, analyzing multiple biomarkers simultaneously using technologies such as next-gen sequencing comes with its own set of challenges. Interrogation of hundreds to thousands of biomarkers requires complicated sample preparation steps and is cost-prohibitive to run in decentralized settings. New approaches for further miniaturization of sample prep technologies and advanced manufacturing methods are still needed to harness the true power of molecular diagnostics. Advances in microfluidic technology may be the answer.
Enrico Alessi
R&D Manager, STMicroelectronics
Enrico Alessi
R&D Manager, STMicroelectronics
Bio :
After graduating from the University of Catania (Italy) in 1997 with a degree in Electronics Engineering, Enrico's professional career started with IBM and Wind Telecommunications working on ICT and telecommunication standards. In 2000 he joined ST to work on sensors for smart applications and later in the medical segment as R&D Manager and led a strategic project focused on human DNA analysis. During this time, he worked on building semiconductor chips and hybrid silicon-plastic devices, hardware, software and instrumentation for In Vitro Diagnostics, maturing experience in design for manufacturing, technical standards and medical certifications. Today, Enrico is contributing ST to develop the next wave of devices for vital signs monitoring. Focusing on both integrated and system-in-package solutions, he and his team are working on developing devices and methods, platforms and solutions for monitoring vital signs and human physiological parameters for transversal applications from medical field to mobile phones and wearable devices for virtual and augmented reality. Enrico holds a second degree in Computer Science at the University of Catania in 2006.
Abstract :
Vital signs monitoring (VSM) technologies are of great benefit for human life since they can predict heart failures, organs and tissues malfunctions, and metabolic pathways disorders. They represent a convergence of technological advances in materials science, sensors, biosensors, electronics, microfluidic, and artificial intelligence. In this context ST is developing next wave of devices for VSM focusing on integrated and system-in-package solutions, modules and platforms for monitoring physiological parameters targeting transversal applications from medical to consumer fields.
Abdelmadjid Hihi
Deputy Director, CEA-Leti
Abdelmadjid Hihi
Deputy Director, CEA-Leti
Bio :
Dr. Abdelmadjid Hihi is Deputy Director for clinical innovation at DTIS, CEA-Leti’s innovative health technologies division. He is a member of CEA-Leti’s Internal Scientific Council, and is responsible for coordinating international public-private partnerships funded by the European Commission and DARPA in particular for medical devices, biomedical research, and neurotechnologies. Before joining Leti, Madjid was at Génome Québec as Scientific Program Manager; and at Chronogen Inc. (Montreal, Quebec) as R&D group leader. Madjid holds a Ph.D in biological sciences from Lausanne University (1999). He is a former Swiss National Fund postdoctoral fellow, and a McGill University postgraduate alumni.
Abstract :
Integrated medical device development platforms are a must to facilitate the connection between technology R&D and clinical deployment of innovative medical devices. In addition to clinical operability, such platforms may ensure an early compliance to industrial norms and regulatory constraints. These elements are key to successfully bring novel medical devices to the real world. Examples will be discussed based on Leti's cuting-edge research with a focus on brain-computer interfaces to compensate motor handicap, as well as on non-pharmacological therapies for neurodegenerative diseases based on photobiomodulation.
3D Heterogeneous Integration
Sylvie Joly
3D Integration and Packaging Partnerships Manager, CEA-Leti
Sylvie Joly
3D Integration and Packaging Partnerships Manager, CEA-Leti
BIO:
Sylvie Joly is currently working as 3D integration and packaging Partnerships Manager at CEA-Leti. Sylvie received M.Sc. in Microelectronics from ISEP "Institut Supérieur d'Electronique de Paris" in 1989. She completed her education with a Master in Marketing and Innovation at the Grenoble Ecole de Management (GEM) in 2001. Prior to this position, she worked for more than 8 years as display business developer at CEA-Leti. In 2004 as Sr. Marketing Engineer in the CEA's Technology Transfer Department, she built a strong experience in setting up and managing technical marketing surveys. Before joining CEA, she spent 10 years in the industry as an R&D engineer, and 8 years as Sales engineer in several companies including Hewlett Packard and Ericsson.
Pascal Vivet
Scientific Director, CEA-List
Pascal Vivet
Scientific Director, CEA-List
Bio:
Pascal Vivet is Scientific Director of the Digital Systems and Integrated Circuits Division in CEA-List, Grenoble, France, and co-director of the IRT Nanoelec Smart Imager program. He received his PhD from Grenoble Polytechnical Institute in 2001, designing an asynchronous microprocessor. After 4 years within STMicroelectronics, he joined CEA-Leti in 2003 in the digital design lab. His research interests covers wide aspects of circuit and system level design, ranging from system integration, multi-core architecture, Network-on-Chip, energy efficient design, related CAD design aspects, and in strong links with advanced technologies such as 3D integration, Non-Volatile-Memories, photonics. He was project leader on 3D circuit design and integration since 2011. He participates to various TPC such as ASYNC, DATE, 3DIC, ISLPED conferences. He served as a member of the organizing committee of the 3D workshops series at DATE from 2013 to 2015, and to the D43D workshops since 2011, and to the 3DIC conference. He has authored and co-authored more than 120 papers and holds several patents in the field of digital design. He is member of IEEE.
Jean-Philippe Fricker
Founder & Chief System Architect, Cerebras Systems
Jean-Philippe Fricker
Founder & Chief System Architect, Cerebras Systems
Jean-Philippe (J.P.) is Chief System Architect at Cerebras Systems. Before co-founding Cerebras, J.P. was Senior Hardware Architect at rack-scale flash array startup DSSD (acquired by EMC). Prior to DSSD, J.P. was Lead System Architect at SeaMicro where he designed three generations of fabric-based computer systems. Earlier in his career, J.P. was Director of Hardware Engineering at Alcatel-Lucent and Director of Hardware Engineering at Riverstone Networks. He holds an MS in Electrical Engineering from École Polytechnique Fédérale de Lausanne, Switzerland, and has authored 24 patents.
Denis Dutoit
Program manager, CEA-List
Denis Dutoit
Program manager, CEA-List
Bio:
Denis Dutoit is senior program manager for advanced computing and digital architectures at CEA-List. He coordinated the European ExaNoDe project that developed a computer node demonstrator combining chiplets, an active interposer, and bare dies in a System-in-Package (SiP). He has also contributed to the architecture of the European Processor Initiative (EPI). His current focus is on architecture pathfinding into chiplet-based designs for computing applications including automotive electronics. Before joining CEA, he was a system-on-chip architect at ST Microelectronics and ST Ericsson. He has authored or coauthored more than 20 articles, including invited talks and tutorials at IEEE conferences.
Abstract:
Automotive E/E architecture is going towards centralized computing platforms running a rich set of compute intensive
applications with an increased number of sensors with high data traffic for fusion. Such a computing architecture requires
scalability to cover the needs of all vehicle platforms with a reasonable power consumption and cost. Either software
solutions optimized for flexibility or specialized ASIC solutions optimized for cost and power are not fully satisfactory to
answer centralized automotive platforms. This presentation will show how chiplet-based architectures combined with a
model-based design flow for architecture exploration could answer automotive needs.
Jean Charbonnier
Expert in 3D integration, CEA-Leti
Jean Charbonnier
Expert in 3D integration, CEA-Leti
Bio :
Jean Charbonnier, is graduated from National School of Physics of Grenoble in 2001 and obtained his Phd degree in crystallography from University Joseph Fourier of Grenoble in 2006. He joined the 3D wafer level packaging group of CEA-Leti in 2008. He has been working for more than 15 years in Through silicon vias, 3D interconnections and silicon interposers technology. His research interests include High Performance computing, Silicon Photonics Interposer as well as cryo-packaging for Quantum architecture applications. He is currently in charge of coordinating the High Density 3D Integration group within the 3D Integration Technologies Laboratory of CEA-Leti.
Abstract :
Due to the increasing costs of advanced nodes and the difficulties of shrinking analog and circuit input-output signals (IOs), alternatives to single die architectures are becoming mainstream. Scalable modular architectures and function partitioning paves the way for new system approaches using 3D technologies. 3D interconnects offers a breakthrough in terms of density, bandwidth, and limit overall power consumption. CEA-Leti’s advanced heterogeneous packaging research leverages expertise in 3D integration by means of Through Silicon Via (TSV) and Hybrid Bonding (HB) technologies developments since more than 15 years. This presentation will exposed the synergy of these key enablers through two meaningful examples for edge IA sensors and HPC applications.
Emilie Bourjot
Project manager in 3D & BEOL integration, CEA-Leti
Emilie Bourjot
Project manager in 3D & BEOL integration, CEA-Leti
Bio:
Emilie Bourjot is Project Manager and responsible of hybrid bonding integration team in 3D & packaging laboratory at CEA-Leti since 2018. Her current activities involve developing advanced hybrid bonding schemes for 3D integration in wafer to wafer and die to wafer approaches. Prior to joining CEA-Leti, she worked within Microelectronics foundries and R&D centers on the development of advanced FDSOI technologies and sub-3nm nodes. Her area of expertise includes contact, BEOL and hybrid bonding integration.
Abstract :
Due to the increasing costs of advanced nodes and the difficulties of shrinking analog and circuit input-output signals (IOs), alternatives to single die architectures are becoming mainstream. Scalable modular architectures and function partitioning paves the way for new system approaches using 3D technologies. 3D interconnects offers a breakthrough in terms of density, bandwidth, and limit overall power consumption. CEA-Leti’s advanced heterogeneous packaging research leverages expertise in 3D integration by means of Through Silicon Via (TSV) and Hybrid Bonding (HB) technologies developments since more than 15 years. This presentation will exposed the synergy of these key enablers through two meaningful examples for edge IA sensors and HPC applications.
Due to the increasing costs of advanced nodes and the difficulties of shrinking analog and circuit input-output signals (IOs), alternatives to single die architectures are becoming mainstream. Scalable modular architectures and function partitioning paves the way for new system approaches using 3D technologies. 3D interconnects offers a breakthrough in terms of density, bandwidth, and limit overall power consumption. CEA-Leti’s advanced heterogeneous packaging research leverages expertise in 3D integration by means of Through Silicon Via (TSV) and Hybrid Bonding (HB) technologies developments since more than 15 years. This presentation will exposed the synergy of these key enablers through two meaningful examples for edge IA sensors and HPC applications.
Heiko Dudek
Technical Account Manager, 3D-IC & Heterogeneous IC Packaging, Siemens EDA
Heiko Dudek
Technical Account Manager, 3D-IC & Heterogeneous IC Packaging, Siemens EDA
Bio:
Heiko Dudek joined Siemens in 2021, M.Sc. Electrical Engineering, 26 years in EDA in various positions, including application engineering, R&D, services and technical sales, looking after solutions around advanced IC Packaging and signal and power integrity analysis.
Michael Campbell
Senior Engineer - Collaboration Spokesperson, CERN
Michael Campbell
Senior Engineer - Collaboration Spokesperson, CERN
Bio:
Michael Campbell is a senior engineer at CERN. He is spokesperson of the Medipix Collaborations which seek to disseminate pixel detector technology from High Energy Physics to many different fields. The work of the Collaborations has enabled new approaches in diverse domains ranging from dosimetry in space to radiation detection in classrooms and from industrial X-ray applications all the way through to spectroscopic medical X-ray imaging. The Collaborations have also pioneered the development of high granularity timing detectors used both at CERN experiments and in various quantum imaging applications.
Abstract:
We have developed large area ASIC's which can be processed with Through Silicon Vias and combined with an appropriate sensor to cover a large sensitive area seamlessly. The presentation will focus on the ASIC design and how we approached the challenge of creating a device which can be tiled on 4 sides. We will report on recent progress in constructing a large area device.
Séverine Cheramy
Product Line Manager, Aledia
Séverine Cheramy
Product Line Manager, Aledia
Bio:
Séverine Chéramy holds an engineering degree having specialized in material science.
She has spent over eight years at GEMALTO, a leading smart-card company developing technologies for secure solutions such as contactless smart cards & electronic passports.
In 2008, she joined CEA-Leti and for 11 years occupied various roles related to semiconductor 3D integration, as project and team leader,.In January 2017, she took the responsibility for 3D integration strategy and related business development. She was also director of the 3D project of ITR (Institute of Technological Research) Nanoelec from 2012 to 2020.
In 2021, she joined ALEDIA, spin-off of CEA-Leti, as product line manager for Smart-Pixel line. She coordinates the products life from specification to commercialization and manages the roadmap , matching customers’ needs and production’s requirements.
Abstract :
Aledia has developed a unique GaN-on-Silicon 3D µLED technology enabling the use of standard large-area silicon wafers. This cost-effective technology combines the interest of high manufacturability together with easy integration of electronics, and therefore enables access to completely new display formats based on µLEDs.
The talk will focus on heterogeneous integrations developped at Aledia which combine the emission function and the CMOS driver.
Abstract :
Aledia has developed a unique GaN-on-Silicon 3D µLED technology enabling the use of standard large-area silicon wafers. This cost-effective technology combines the interest of high manufacturability together with easy integration of electronics, and therefore enables access to completely new display formats based on µLEDs.
The talk will focus on heterogeneous integrations developped at Aledia which combine the emission function and the CMOS driver.
Frederic Devriere
Collaborative R&D Manager, Teledyne e2v
Frederic Devriere
Collaborative R&D Manager, Teledyne e2v
Bio :
Frederic Devriere is responsible at Teledyne e2v for the collaborative projects, and public affairs.
After 15 years of technical positions at Alcatel or Philips, were he was successively electronics or asic designers, then project manager, he joined Teledyne e2v (at that time Atmel), in 2003.
He occupied various roles, from which product manager and strategic marketing manager.
he is graduated from Ecole Supérieure d'Electricité in France in 1992.
Abstract :
Assembly capabilities for low and medium volumes
Teledyne e2v is leading one of the 68 projects of the IPCEI ME/CT, with the aim to develop assembly capabilities for small and medium volumes. This will benefit to the whole ecosystem, who has now an european source for high reliabilty advanced packaging, including System-in-package and flip-chip on organic substrates.
Jean-Stéphane Mottet
Technical Product & Sales Manager, SET
Dale McHerron
Chief Strategist, Chiplets & Advanced Packaging, IBM Research
Dale McHerron
Chief Strategist, Chiplets & Advanced Packaging, IBM Research
Bio :
Dale is currently the Chief Strategist for IBM Research Chiplet and Advanced Packaging Group based in Albany, New York. Prior to his current role, Dale was Senior Manager and Senior Technical Staff Member at IBM Research with responsibility for developing and leading IBM’s Heterogeneous Integration Research Program and principal investigator in the IBM AI Hardware Research Center. Over his 30 + year career at IBM, Dale has held various technical, managerial, and business development positions in both advanced packaging and CMOS logic R&D. Dale received his PhD in Chemical Engineering from Virginia Tech with a focus on polymeric materials. Dale has co authored numerous research papers and holds multiple patents in the field of microelectronics.
Abstract :
High performance computing (HPC) and AI applications are driving capacity and complexity of computational workloads at an ever increasing rate. In order to sustain these trends and improve energy efficiency, new hardware technologies and architectures are required. Silicon scaling and design innovations will not be sufficient to meet this challenge. Innovations in advanced packaging, heterogeneous integration, and chiplet architectures hold great promise to deliver system level performance improvements for these critical workloads and provide energy efficiency improvements for the next decade and beyond. In particular, the ability to package multiple silicon chips with a variety of computational functions and technologies in a small form factor will be critical. Furthermore, these technologies must also deliver significant gains in chip to chip communication bandwidth and latency to realize the system level improvements required to sustain these trends and meet the needs of future applications. This talk will discuss trends in workload requirements for HPC / AI and how innovations in packaging and heterogenous integration can enable new hardware architectures to meet the needs of the future.
Darius Bunandar
Chief Scientist, Lightmatter
Darius Bunandar
Chief Scientist, Lightmatter
Bio:
Darius Bunandar is a co-founder and the Chief Scientist at Lightmatter, where his team is leading the evolution of computing, reducing its impact on our planet, and enabling the next great leaps in human progress through silicon photonics. Prior to founding Lightmatter, he obtained his PhD in physics at MIT studying quantum computation and communication using compact nanophotonic circuits. He previously earned his Bachelor of Science degrees in both Physics and Mechanical Engineering from the University of Texas at Austin.
Abstract:
Lightmatter is combining electronics, photonics, and new algorithms to create the next-generation AI/ML supercomputers. In this talk, I will introduce one of our products: Passage. Passage is a wafer-scale programmable photonic interconnect that uses silicon waveguides to enable heterogeneous chiplets to communicate with unprecedented bandwidth.
Thomas Finateu
VP Sensor, Prophesee
Thomas Finateu
VP Sensor, Prophesee
Bio :
Thomas Finateu received the Master’s degree from the Electrical Engineering School of Bordeaux (ENSEIRB), France, in 2004 and the Ph.D. degree in electrical engineering in 2008. His dissertation was done at STMicroelectronics about, Crolles, France.
In 2008, he joined STMicroelectronics, Belgium as an analog engineer where he pursued his analog and RF work for Bluetooth transmitters mobile products.
In 2011, he joined SoftKinetic in Brussels, Belgium, now Sony DepthSensing Solutions. He has been working on Time Of Flight pixels and sensors as analog designer and project leader.
In 2015, he joined Prophesee, as senior analog designer and project leader. He has been working on bio-inspired pixels and sensors pushing further on-chip integration of analog and digital IPs, deeply involved in the joint development with Sony to mature the technology and make it ready for mass production. He is now VP sensor, with more than 20-year experience in the semiconductor industry and IC design.
Abstract :
After an overview on event-based sensors, upcoming trends regarding application domains will be introduced. It will justify the benefits of 3D integration while highlighting the challenges to face. But technology challenges are fortunately not the only ones, design and architecture challenges are arisen too such as edge-AI, multi-modality, multi-layer, pixel shrink, etc... Triple-layer stack and neural network such as GNNs can fill some of these gaps !
Sense & Act
Vincent Destefanis
Optical Sensors Industrial Partnerships Manager, CEA-Leti
Vincent Destefanis
Optical Sensors Industrial Partnerships Manager, CEA-Leti
Bio:
Vincent Destefanis received a Master’s and a Ph.D. degrees in Materials Science in 2009. During his PhD, Vincent worked for STMicroelectronics on advanced epitaxial techniques for SiGe alloys grown on alternative Si substrates, this for advanced CMOS devices.
He then worked in the US as a CEA-Leti assignee at IBM, NY, working on sub-22 nm CMOS technologies. Vincent has been working in the photonics industry since 2010, first as a R&D Engineer, then as a technical expert on infrared imaging manufacturing technologies for SOFRADIR. He moved to a project and partnership manager position at LYNRED in 2020. During in career, Vincent was involved in several national, industrial and collaborative projects (H2020, Horizon Europe, CNES, IPCEIs…) as a technical expert and a project manager.
He recently joined the CEA-Leti in 2023 and is now dedicated to developing new partnerships and business opportunities in optical and photonics technologies, especially for sensing applications.
Pierre-Damien Berger
MEMS Industrial Partnerships Manager, CEA-Leti
Pierre-Damien Berger
MEMS Industrial Partnerships Manager, CEA-Leti
Bio:
CEA LETI is a leading MEMS R&D lab working for industry, with more than 150 people working on this topics – world’s largest MEMS R&D institute.
Pierre-Damien was previously the MinaSmart (European Digital Innovation Hub) director at Minalogic. He worked before as CPS European projects manager, Head of Smart Devices Program, Industrial Partnership Manager and VP Business Development & Communication at CEA-Leti.
With more than 20 years of experience, 10 years in industry, 15 years in R&D serving industry, his experience has allowed him to master the right balance between business and innovation - Understand and listen to needs, identify and select innovative solutions, enhance the functions that meet expectations, communicate to radiate.
Stephen Bart
Senior Director of Advanced Technology, TDK
Stephen Bart
Senior Director of Advanced Technology, TDK
Bio:
Dr. Bart received the B.S., M.S., and Ph.D. degrees from the Massachusetts Institute of Technology, Cambridge, Massachusetts. He did his doctoral research with Professors Senturia and Lang on analysis and design of the first microfabricated electrostatic motors and pumps. After his PhD work, Dr. Bart joined Analog Devices, Inc., where he designed the MEMS sensor in the well-known Analog Devices, Inc. ADXL150 family of airbag accelerometers, which has over 500 million sensors in the field. From 1996 to 2002 he held several positions at Coventor, Inc., a developer of physical design tools for MEMS systems. Dr. Bart returned to Analog Devices as a Senior Product Development Leader, working on inertial MEMS sensors for the commercial marketplace. Dr. Bart then joined MKS Instruments to develop high-performance, vacuum absolute-pressure sensors for semiconductor and industrial applications. Today, Dr. Bart leads the Advanced Technology group at TDK, where he is developing advanced gas sensors, ultrasonic and acoustic sensors and advanced machine learning and circuit architectures. Dr. Bart's research interests include the design, modeling, and simulation of complex electromechanical systems and Machine Learning methods for sensor data fusion. Dr. Bart holds 11 patents in the microsystems area.
Abstract:
Sensor technology is becoming increasingly sophisticated, affordable, and ubiquitous. Sensors are becoming the human interface to the digital world and, when combined with machine learning (ML), make systems or devices more aware of what the human is doing, about to do, or has just done. As the variety and capabilities of sensors grow, technology has the opportunity to disappear into the background, assisting everyone to be better connected, track their internal health and well being and their external environment, and be enabled with more leisure time. Finally, sensors can optimize the power we consume with all devices, delivering a great experience at the lowest consumption of resources. I will explore these themes, show examples of developments at TDK, and inspire a future vision of smarter sensors.
Joost van Beek
Head of Process Development & Integration, Philips MEMS foundry
Joost van Beek
Head of Process Development & Integration, Philips MEMS foundry
Bio:
Joost van Beek (1969) has been active in MEMS and Micro Systems technology for over 20 years. During his career, he held scientific positions related to these fields at the Massachusetts Institute of Technology, University of California at Berkeley, Philips Research Laboratories, and NXP Semiconductors. Apart from his extensive research experience, he also had the opportunity at Philips and NXP to gain expertise in MEMS process and product release for large volume manufacturing. At NXP and Philips, he was leading projects on RF-Passives, RF-MEMS, MEMS timing devices, Ultrasound Sensing, and others. Currently, he is a member of the management team of the Philips MEMS Foundry in Eindhoven where he is leading the Process Development & Integration group.
Joost received a MSc degree in Applied Physics from the Technical University Eindhoven, and a PhD degree in Electrical Engineering from the Catholic University Leuven. He is co-author of over 50 scientific papers and holds 25 granted patents.
Abstract:
Philips operates a state-of-the-art 2650 m2 pure-play MEMS Foundry on the High Tech Campus in Eindhoven, the Netherlands. This MEMS Foundry is specialized in medium volume custom MEMS manufacturing. An important focal area is the co-development of manufacturing processes for its bio-medical customers. It is thereby uniquely acting as a European pilot line for emerging medical applications.
This presentation will elaborate several on-going MEMS manufacturing activities for various bio-medical applications, such as cell-sorting, neural probing, micro optical tomography and ultrasound imaging.
Lia Li
CEO & Founder, Zero Point Motion
Lia Li
CEO & Founder, Zero Point Motion
Bio:
Dr. Ying Lia Li (Lia), CEO and Founder of Zero Point Motion, is a trailblazer in chip-scale optical inertial sensors. Recognized with the 2021 Institute of Physics Clifford Paterson Medal, the 2022 Innovate UK Women in Innovation Award and named as Sensors Converge ‘Woman of the Year’ 2023, Lia's groundbreaking work redefines sensing using light. A physics graduate from Imperial College, she earned her Ph.D. at University College London, developing optical sensors with applications in macroscopic quantum state preparation. With a track record of coupling optical resonances to mechanical motion, she achieved displacement sensing over 1000x smaller than a single atom. Post-Ph.D., she secured prestigious fellowships from EPSRC and the Royal Academy of Engineering before founding Zero Point Motion in 2020, raising over £6.3M to date.
Abstract:
Zero Point Motion has been developing optomechanical accelerometers and gyroscopes using standard MPW offerings in micro-electro-mechanical systems (MEMS) and photonic integrated circuit (PIC) platforms. By exploiting the coupling between mechanical motion and the evanescent field of optical resonators, exceptional inertial sensing noise floors are demonstrated. In this talk we present progress in our proof-of-concept devices and how we are tackling challenges on creating a compact and low cost system architecture. We are exploring a number of ways to integrate lasers and detectors, capitalizing on emerging capabilities such as heterogeneous solutions.
Philippe Robert
Business Development Manager, CEA-Leti
Philippe Robert
Business Development Manager, CEA-Leti
Bio :
Philippe Robert is business development manager and senior expert at CEA-Leti for MEMS sensors and actuators activities. He is currently in the process of creating a spin-off from CEA-Leti to produce and commercialize a new generation of high-performance MEMS/NEMS sensors (including accelerometers, gyroscopes, and pressure sensors) for the automotive, consumer, and high-end markets.
After holding various positions in the sensor industry, he joined CEA-Leti in 2001 as a project manager for RF-MEMS research. He was promoted to manager of the MEMS Sensors Group from 2003 to 2013, and served as head of the Microsystems Department from 2013 to 2019.
He holds a PhD in Electrical Engineering and a M.Sc. degree in Optical Electronics from Grenoble-INP.
Abstract :
Introducing NG.Sense, a burgeoning startup poised to lead the market in high-performance MEMS sensors designed for inertial and pressure sensing applications. With a groundbreaking technological approach, NG.Sense aims to disrupt the sensor landscape across automotive, industrial, and defense sectors. Our mission is to deliver cost-effective, superior solutions to meet the demands of cutting-edge applications, such as autonomous navigation for vehicles, drones, robots… as well as for accurate activity tracking.
Marc Sansa Perna
Project Manager, CEA-Leti
Marc Sansa Perna
Project Manager, CEA-Leti
Bio:
Marc Sansa obtained his Ph.D. degree in electronic engineering from the Universitat Autònoma de Barcelona, Barcelona, Spain, in 2013. He is an expert in microelectromechanical system (MEMS) sensors, RF MEMS and optomechanics, having co-authored over 50 publications and several patents. He is currently a project manager at the Sensors and Actuators Laboratory of CEA-Leti.
Abstract :
Electrical microsensors (MEMS) have been gaining maturity and performance during the last 40 years, and they are nowadays ubiquitous in our everyday life. Recently, the combination of MEMS and silicon photonics has given birth to optomechanical MEMS (optically transduced microsensors), enabling a jump in performance in terms of readout sensitivity and frequency of operation.
In this talk I will present the advantages of optomechanics for high-efficiency sensing, and how CEA-Leti’s developments have enabled novel applications in the fields of biosensing, environment/biological monitoring, high-speed AFM and clocks.
Marc Chaigneau
Semiconductors Market Manager, Horiba
Pierre Jallon
Director of technology & innovation, eLichens
Pierre Jallon
Director of technology & innovation, eLichens
Bio:
Pierre Jallon is the Chief Technology Officer of eLichens. He oversees technology development, new products prototyping and strategic marketing for the gas sensor startup. Prior to joining eLichens, Pierre was working with CEA-Leti -one of the most innovative European research centers– as head of laboratory. He was leading a team specialized on innovative medical devices and wearables development.
Abstract :
According to IEA (International Energy Agency), the “methane is responsible for around 30% of the current rise in global temperature”. Reaching climate neutrality in 2050 and meet the European Green Deal objectives requires to reduce methane emissions and track gas leak on production, processing and distribution sites.
An innovative solution will therefore be presented. This solution is being developed in collaboration by eLichens , CEA-Leti and GRDF and includes the development of an innovative new component.
Andreja Erbes
Director, Technology Scouting and R&D Partnerships, STMicroelectronics
Andreja Erbes
Director, Technology Scouting and R&D Partnerships, STMicroelectronics
Bio :
Andreja Erbes received the M.Eng., M.A., and Ph.D. degrees from the Department of Engineering, University of Cambridge, in 2011, 2014, and 2015, respectively, in electrical and electronic engineering. In 2009, he spent one year abroad at the Massachusetts Institute of Technology (Cambridge-MIT Exchange Program) and took part in an undergraduate-research opportunity program with the Weinstein Research Group, where he worked on novel RF MEMS. Since 2022, he is the Director of Technology Scouting and R&D Partnerships at STMicroelectronics within the Analog, Power & Discrete, MEMS and Sensors group.
Cyril Herrier
Manager R&D, Aryballe
Cyril Herrier
Manager R&D, Aryballe
Bio :
Cyril obtained his PhD in Materials Chemistry in 2011. During 8 years of academic research (IS2M Mulhouse, ISCR Rennes, IM2NP Marseille, CEA Grenoble), he acquired a strong expertise in structuration, functionalization, and characterization of surfaces at nanometer scale for applications in microbiotechnologies. He joined Aryballe in 2015 as the first research engineer. He is co-author of 19 international papers and co-inventor of 11 patents families.
Abstract :
Mimicking artificially the sense of smell is a technical and intellectual challenge that drives innovative applications development at Aryballe.
In collaboration with the CEA-Grenoble, Aryballe has developed a selective VOC sensor capable of real-time detection and identification. This breakthrough technology enables the generation of large datasets, which can be analyzed using either simple algorithms or more sophisticated machine learning models.
Solutions embedding this type of versatile gas sensor can adress large spectrum of markets, from environment monitoring to consumer domotic. It stimulate also a lot of expectations for Health and Wellness market.
Christina Strohrmann
Director Advanced Engineering, Bosch Sensortec GmbH
Christina Strohrmann
Director Advanced Engineering, Bosch Sensortec GmbH
Bio :
Dr. Christina Strohrmann holds a PhD in Electrical Engineering from ETH Zurich, Switzerland, and an MSc in Information Technology from the University of Kaiserslautern, Germany. She joined Bosch Sensortec GmbH in 2013 and since then works in R&D for sensors in consumer electronics, namely smartphones, wearables, and hearables. She heads the department for advanced engineering, responsible for product pre-development, system architecture, technology and IP Management.
Abstract :
In 2006, Bosch Sensortec released the world's smallest barometric pressure sensor. Since then, we have expanded our portfolio of environmental sensors by humidity sensors, gas sensors, media-robust sensors, and lately particle sensors. All targeting to improve our daily lives and designed for handheld, battery-powered devices. This presentation will provide an overview on applications, use cases, and technologies.
New Materials for Computing
François Andrieu
Head of Memory & Computing Laboratory, CEA-Leti
François Andrieu
Head of Memory & Computing Laboratory, CEA-Leti
Dr. François Andrieu is CEA fellow and the head of Laboratory “Nano-devices for Memory and Computing” at CEA-Leti, Grenoble, France.
He has been strongly involved in the development of the Fully-Depleted-Silicon-On-Insulator (FD-SOI) CMOS technology at Leti and with STMicroelectronics, where he was assigned between 2012-2015 in the process-integration and technology-to-design groups. His fields of interest are: NVM Resistive-RAM, In-Memory-Computing, advanced CMOS transistors, 3D-sequential integration.
He is the author or co-author of more than 34 patents, 240 conference abstracts or refereed journal articles, 11 invited papers and 3 book chapters. He received the IEEE senior grade in 2018, the European ERC consolidator grant in 2019 and the IEEE/SEE Brillouin award in 2018.
Philippe Rodriguez
Head of Laboratory, CEA-Leti
Philippe Rodriguez
Head of Laboratory, CEA-Leti
Bio:
Philippe Rodriguez is a research engineer and laboratory manager at CEA-Leti in the Semiconductor Platforms Division.
He received his Ph.D. in 2007 from the University of Lyon 1 in Materials Chemistry for his work on metal organic vapor phase epitaxy growth of B(In)GaAs epilayers. From 2007 to 2009, he worked at the CNRS (French National Center for Scientific Research) developing deposition methods on structured substrates for process intensification applications. In 2009, he started his career at the CEA (French Alternative Energies and Atomic Energy Commission). First, he worked on the coating and fluidization of dense powders by fluidized bed metal-organic chemical vapor deposition for the development of new nuclear fuels (2009 - 2011). Then, he developed silica permeation barriers by magnetron sputtering for laser megajoule gas targets (2011 - 2013). Finally, he joined CEA-Leti in Oct. 2013. His research activity is mainly focused on advanced contact technologies for electronics and photonics applications. He develops contact metallization for advanced CMOS and photonics devices (Si, Ge(Sn), III-V and GaN materials) and also deals with surface preparation and interface modulation prior to metallization. He led the contact team at CEA-Leti between 2017 and 2020 and became head of the Advanced Materials Deposition Laboratory in February 2020. In Sept. 2022, he joined the Surface and Interface Science and Engineering Department and since Jan. 2023, he is in charge of the Laboratory of Wet Surface Preparation, Epitaxy and Thermal Treatment Processes.
He is the author and co-author of approximately 100 peer-reviewed journal articles, 115 international conference papers, 2 book chapters, and 15 patents.
Uygar Avci
Group leader of Novel Devices and Memory Research, Intel
Lucie Le Van Jodin
Research scientist, CEA-Leti
Lucie Le Van Jodin
Research scientist, CEA-Leti
Bio :
Lucie Le Van-Jodin, Ph.D. is a project manager and a team leader for 2D material transfer at CEA-Leti. Lucie started her scientific carrier studying thermoelectricity during her Ph.D research. She worked at CEA from 2003 on carbon nanotubes for chemtronics, developing growth and characterization of this material. She spent more than 10 years in the CEA’s microbatteries Lab. There, she studied the relationship between the structural and electrical properties of the inorganic electrolyte. In 2018, she joined the film transfer Lab (LIFT). She is working on transfer of various materials as silicon, III-V, piezoelectric, wide gap materials… mainly by SmartCut™ technology. Recently, she focused her works on 2D material transfer for microelectronics applications.
Abstract :
Since the discovery of graphene and more generally of 2D materials, numerous studies have demonstrated the potential of these materials that allow a drastic devices size reduction, performances improvement, low power, new properties… That is why they are seen as the ultimate materials for the microelectronics of the future.. Nowadays, they can be found at several levels, in a wide variety of applications such as transistors, sensors, memories, RF switches...
However, the transition from lab to fab remains challenging. The implementation of 200 and 300 mm characterization capability for 2D materials at CEA enables us to work on this transition to industrial processes. Wafer scale growth, transfer such as integration and van der Waals interfaces preservation are intensively studied since they are key points for the successful manufacturing of industrial 2D materials devices.
Andrea Illiberi
Team leader, ASM CORPORATE R&D
Andrea Illiberi
Team leader, ASM CORPORATE R&D
Bio:
Andrea is head of the "Active Layers and Exploratory Materials" team at ASM Corporate R&D, based in imec.
Andrea received a Ph.D. in Astrophysics and Plasma Physics from the University of Milano. As post-doctoral researcher at the Eindhoven University of Technology, he worked on plasma based deposition of semiconducting thin films. As Sr. Research Scientist at TNO, he pioneered the development of the Spatial ALD technology for which he received the Paul H. Holloway Young Investigator Award by the American Vacuum Society.
At ASM Andrea works on atomic layer deposition of new dielectric and semiconductive oxides for logic and memory applications.
Abstract:
The architectures of integrated logic and memory devices have shifted from 2D to 3D layouts, enabling a continued scaling of device densities. Atomic layer deposition allows the conformal deposition of thin films with sub-nm thickness control on high aspect ratio 3D structures. ALD has become the technique of choice for the synthesis of an increasing number of materials in advanced logic and memory devices. After reviewing some of the key ALD processes which enable the fabrication of state-of-the-art 3DNAND and DRAM, we will present the ALD of ferroelectric materials in industrial scale ASM reactors
Milan Pešić
Senior Member of the Technical Staff and Director of Technology development, Applied Materials Inc.
Milan Pešić
Senior Member of the Technical Staff and Director of Technology development, Applied Materials Inc.
Bio:
Milan D. Pešić received a Ph.D. from the Technical University of Dresden, Germany, and is currently a Senior Member of the Technical Staff and Director of Technology development at Applied Materials Inc. He is leading a device and reliability team and overseeing device and cell physics and research activities in the field of advanced logic, (emerging) (non)volatile memories and devices. Previously, he was with MDLSoft Inc., Santa Clara, USA, Ferroelectric Memory Company, Dresden, and NaMLab, Dresden. Up to now, he has given 12 invited talks and (co)authored over 70 technical papers, four book chapters, and filed over 30 patents.
Abstract :
Only understanding of the materials and underlying physical mechanism can help us engineer novel superior devices of the future. Lead by this principle, we will look at ferroelectric (the most efficient memory material) and oxide-semiconductor materials and devices. We'll review what challenges they need to overcome to be integrated into logic and memory architectures. We will look in detail at the material phases, defects, vacancies, material changes, and underlying physical mechanisms governing mobility, variability, reliability, and others figures of merit of the devices they are integrated to.
Abstract:
Only understanding of the materials and underlying physical mechanism can help us engineer novel superior devices of the future. Lead by this principle, we will look at ferroelectric (the most efficient memory material) and oxide-semiconductor materials and devices. We'll review what challenges they need to overcome to be integrated into logic and memory architectures. We will look in detail at the material phases, defects, vacancies, material changes, and underlying physical mechanisms governing mobility, variability, reliability, and others figures of merit of the devices they are integrated to.
Toshiro Hiramoto
Professor, The University of Tokyo
Toshiro Hiramoto
Professor, The University of Tokyo
Bio :
Toshiro Hiramoto received the Ph.D. degree in electronic engineering from the University of Tokyo in 1989. He joined Institute of Industrial Science, the University of Tokyo in 1994, where he has been a Professor since 2002. His research interests are various scaled silicon devices including FDSOI and nanowire FET as well as their statistical characteristics.
Abstract :
We have fabricated nanosheet oxide semiconductor FETs with sub-100nm gate length and the statistical variability data were compared with those of bulk planar Si MOSFET.
Milind Weling
Head of Lab-to-Fab-to-Product Realization, Merck
Milind Weling
Head of Lab-to-Fab-to-Product Realization, Merck
Bio :
Milind Weling is the Head of Lab-to-Fab-to-Product Realization and co-founder of the Neuro-inspired Computing Incubator of the Electronics business of Merck KGaA, Darmstadt, Germany, and for EMD Electronics in the U.S. and Canada. Previously he was Senior Vice President for Intermolecular, Inc. where he led Customer Programs and Operations where he drove the discovery and optimization of new materials, integrated module solutions, and leading-edge devices. Milind is a senior engineering and management professional with extensive experience in advanced memory and logic technology development, DFM and design-process interactions, new product introduction, and foundry management. His previously held senior engineering and management roles include DFM products engineering at Cadence Design Systems and high-performance CMOS technology development at Sun Microsystems, Philips Semiconductors, and VLSI Technology. Milind holds a B. Tech and MS degrees in Electrical Engineering from the Indian Institute of Technology, Bombay, and the University of Hawaii, respectively. He holds 50+ patents and has co-authored over 70 technical papers, primarily focused on semiconductor process technology, integration and semiconductor device reliability.
Abstract :
The advent of artificial intelligence (AI) has had a disruptive impact on the state of the art of technology at all levels of abstraction. AI’s explosive growth demands significantly revolutionary and enabling improvements of >100X for memory density + bandwidth, latency + performance, and energy consumption + overall environmental sustainability. With device innovation at its core, present day technology development focuses on emerging methodologies that require co-optimization of all orders of abstraction such as system, design, devices, technology and even materials aka SDDTMCO. This talk will highlight the opportunities and challenges the industry faces in transitioning from established to novel process architectures that require new materials for successful deployment. Our ability as materials suppliers to offer integrated additive process modules that meet customers’ aggressive performance and reliability target key performance indices (KPIs) will be crucial to accelerating semiconductor technology development. Moreover, technological progress can be further accelerated by embracing digital transformation to explore our exploration space and enable innovation.
Hitoshi Wakabayashi
Leader and Professor, Tokyo Institute of Technology
RF & Telecommunications
Eric Mercier
Telecom Line Director, CEA-Leti
Eric Mercier
Telecom Line Director, CEA-Leti
Swan Gerome
Industrial Partnerships Manager, CEA-Leti
Swan Gerome
Industrial Partnerships Manager, CEA-Leti
Bio:
Swan GEROME is Industrial Partnership Manager for the System Department, specialized in RF and Telecommunication at CEA-Leti.
He hold a degree in Marketing and Sales Management at Grenoble IAE and has more than 15 years experience in the semiconductor industry in various companies, from materials, design and research.
He was successively Sales Manager for Dolphin Integration from 2008 to 2014 in charge of Business Development for ASIC Design, Analog Silicon IP and libraries towards Foundries, Fabless, Design Houses and OEM. He also managed a team of 3 sales coordinators in Asia (Japan, South Korea and Taiwan) then Europe. He joined CEA-Leti in 2015 as Industrial Parnership Manager for the System Departement in the fields of sensors integration, energy management, embedded data processing and RF Telecommunications (antennas designa and integration, specific protocols and RFIC design), developping partnership with national and international companies from Start-up to Big Tech.
Between 2022 and 2023, he was Product Marketing Manager for Connect-SOI Business Unit at SOITEC, developping the Roadmap of engineering silicon substrate for RF applications and launching new product to answer market requirement.
Perrine Batude
MOS & 3D sequential integration expert, CEA-Leti
Perrine Batude
MOS & 3D sequential integration expert, CEA-Leti
Bio :
Perrine BATUDE obtained her Ph.D. degree from the Institut National Polytechnique de Grenoble, France in 2009 during which she began the early development of 3D Sequential Integration (3DSI) in CEA-Leti. Since then, she participates to the development of this technology for various applications fields including computing, imagers, and RF. She is the author and coauthor of more than 130 publications in major conferences and journals and of more than 20 patents. Her field of expertise covers especially semiconductor devices, especially FD-SOI transistors, low temperature processes with a specific focus on low temperature junction processes, direct bonding for channel transfer.
Abstract :
Jean-Baptiste David
RF-mmW R&D Engineer, CEA-Leti
Jean-Baptiste David
RF-mmW R&D Engineer, CEA-Leti
Bio:
Jean-Baptiste David was born in 1973 and received his master of research in 1997. After various experiences in wide companies and a startup, he joined CEA Leti in 2002. His field of compentences is focused on RF-mmW IC design. Previously involved in BAW filters and duplexers, component modeling, electromagnetic simulation, 5G front-end modules, and control/readout IC for quantum computing, he is more recently involved in the design of frequency synthesis architectures on RFSOI and FDSOI technologies for 10GHz to 100GHz applications.
Yvan Morandini
Senior Strategic Marketing Manager, Soitec
Yvan Morandini
Senior Strategic Marketing Manager, Soitec
Bio:
Dr Yvan Morandini received the Degree in engineering from Grenoble Alpes University, France in electronics
and radiofrequencies in 2005 and the PhD degree from Lille University in 2008. After 3 years in
STMicroelectronics he then moved to IBM , Dolphin Integration and then to SOITEC. He is currently Senior Strategic Marketing Manager at SOITEC. He has 20 years of experience in
semiconductor industry including characterization, modeling and design. He has authored/co-authored over
15 papers in international, peer-reviewed journals and conferences, and is Member of Institute of Electrical
and Electronics Engineers (IEEE).
Abstract:
Wireless technologies are constantly evolving to meet the demands of new and emerging applications. The introduction of 5G and the forthcoming 6G wireless systems present significant challenges for the design and implementation of new RF front-end components. To keep pace with this evolution, it's crucial for semiconductor technologies to achieve the RF performance needed for the next-generation RF Front Ends (RFFE). In this presentation, we will discuss the RF technology roadmap, emphasizing engineered substrates that are key to designing the next generation of RFFE.
Kazuaki Deguchi
Senior Manager RF Device Division, Murata
Kazuaki Deguchi
Senior Manager RF Device Division, Murata
Bio :
Kazuaki Deguchi received the B.S. and M.S. degrees in electronics, information systems and energy engineering from Osaka University, Suita, Japan, in 2000 and 2002, respectively. From 2002 to 2014, he joined Renesas Electronics Corporation, Hyogo, Japan and engaged in research and development of analog and mixed-signal circuits. From 2012 to 213, he joined IMEC Leuven, Belgium as an expatriate to research high-precision ADC. From 2014, he has been working with Murata Manufacturing Co, Ltd., Kyoto, Japan. He initially engaged in Wi-Fi module design and since 2018 he has been working for RF device development. His recent research interests include the high-linearity and high-efficiency power amplifier design for RF front-end.
Abstract :
In the realm of RF Front-End products, there has been a historical emphasis on high data rates. However, real-world products have demonstrated a growing need for tailored solutions that align with specific use cases. This presentation will shed light on this paradigm shift and explore how RF Front-End Modules are evolving to meet application-specific requirements. We will delve into the world of RF Front-End Modules with a specific focus on three key aspects: economical, low power consumption, and user-friendliness RF Front-End Module solutions.
David Moussaud
R&D Engineer, CEA-Leti
David Moussaud
R&D Engineer, CEA-Leti
Bio :
Graduated from Ecole Supérieur d’Électronique de l'Ouest (ESEO) d'Angers in 2004, Embedded systems option.
First experiences as an embedded Linux engineer, first in Italy at Thales Communication, then as a consultant, in France in 2006, in Sagem Communication (Livebox products) and Nagra Kudelski (for DVB decoder access control)
In 2008, I've joined the CMMI 3 development center based in Nantes to work mainly in the Automotive domain. After few projects, i take part to a large Autosar team involved in the development of basic softwares and RTE generator. Main focus in the RTOS module and communication stack integration.
From 2014, I am an R&D engineer at CEA Leti in the wireless technologies department,in the signal, protocol and platform radio laboratory.
Either as software developer, system architect or project leader, i have participated to several projects regarding the development of wireless protocols using of the shelve radio (UWB, LoRa) and achieved by a complete industrial transfer.
Nicola Di Pietro
Subsidized Project Specialist, HPE
Nicola Di Pietro
Subsidized Project Specialist, HPE
Bio:
Nicola di Pietro has worked at the Athonet Research & Innovation department of HPE, Italy, since 2021. He has B.S., M.S., and Ph.D. degrees in mathematics, received respectively from the Univ. of Padova, Italy, in 2008, jointly from the Univ. of Padova, Italy, and the Univ. of Bordeaux, France, in 2010, and from the Univ. of Bordeaux, France, in 2014. He was a Research Engineer with Mitsubishi Electric in Rennes, France, between 2010 and 2013. From 2014 to 2016, he was an Associate Post-Doctoral Fellow at Texas A&M University at Qatar, and from 2017 to 2021 he was a Research Engineer with CEA LETI in Grenoble, France. His research focuses on 5G-and-beyond networks, edge cloud computing, and coding theory.
Abstract:
Private 5G networks meet the telecommunication service requirements of heterogeneous vertical sectors, proposing mobile networks as controllable and tuneable infrastructural assets for industrial, governmental, and commercial entities. Based on HPE's on-field experience, this presentation discusses private 5G use cases, edge-to-cloud network deployments, and technological enablers. It highlights the versatility of private 5G architectures and the increased automation, robustness, security, and control capabilities compared to other network technologies and previous mobile generations.
