Bio :

Romain Coffy is a packaging engineer at STMicroelectronics based in Grenoble, where he is in charge of packaging innovation and networking within the Back-End Manufacturing & Technology group.

His main responsibilities encompass supporting the development of new innovative technological solutions, overseeing the technical roadmap for ST's entire packaging team, supporting market analysis activity, fostering relationships with labs and universities, assisting with patenting activities, and advancing sustainability initiatives.

With over 20 years of experience, Romain is the author of numerous patents in the packaging field.

He earned his Engineering degree from the “École Nationale Supérieure de Physique de Grenoble” (INPG) in 2002.