3D Heterogeneous Integration

WEDNESDAY, JUNE 26, 2024

Home » 3D IC

Any wafer from any foundry
for your needs

With HPC, quantum, RF, and imagers driving demand, 3D heterogeneous integration is here to stay. Modular chiplets give you the freedom to choose the most appropriate technology for each subcomponent and achieve the most powerful, efficient, cost-effective system. This satellite conference will answer your questions about applications, architectures, design, technology, and impacts on existing ecosystems.

08:30 a.m. - 09:30 a.m.

Welcome coffee, Exhibition & Networking

09:30 a.m. - 11:30 a.m. | Morning Session

Welcome & Introduction

Co-chairs

Sylvie Joly

Partnerships Manager 3D integration and packaging, CEA-Leti

 

 

Pascal Vivet

Scientific Director, CEA-List

09:30 a.m. - 09:50 a.m.
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Speaker00

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11:30 a.m. - 02:30 p.m.

Lunch, Exhibition & Networking

  • Latest Demos: Discover more than 50 live demos and network with potential partners.
  • Startups Corner: Don’t miss out on the startup corner to learn about the latest tech offers.
  • Business Meetings: Book meetings with experts to discuss your innovation project.

02:30 p.m. - 04:30 p.m. | Afternoon Session

02:30 p.m. - 02:45 p.m.
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Speaker00

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04:00 p.m. - 04:30 p.m.

Panel session

04:30 p.m. - 05:30 p.m.

Coffee break, Exhibition & Networking

Bonus: Attendees will receive the conference proceedings after the event