Speakers

Home » Leti Innovation Days 2024 – World Speakers

Plenary Session

Stefan Finkbeiner

CEO and GM, Bosch Sensortec GmbH

Bio:

Stefan Finkbeiner received his Diploma in Physics from University of Karlsruhe in 1992. He then joined Max-Planck-Institut in Stuttgart and there received his PhD in Physics in 1995.
He joined Robert Bosch GmbH in 1995 and has been working in different positions related to the research, development, manufacturing, and marketing of sensors for more than 20 years. Senior positions at Bosch have included Director of Marketing for sensors, Director of Corporate Research in microsystems technology, and Vice President of Engineering for sensors.
In 2015, Dr. Finkbeiner was awarded with the prestigious lifetime achievement award from the MEMS & Sensors Industry Group.

Abstract:

Tiny sensors are catalysts for addressing major modern challenges: Enhancing air quality and elevating human well-being. Clean air is vital for well-being. Innovative MEMS technology measures health-damaging pollutants in the air and can help improve air quality. To further enhance well-being, MEMS sensors can track full-body motion, coupled with AI-driven personalization, providing real-time qualitative and quantitative feedback to users.
These examples underscore the synergy between MEMS sensors and smart algorithms, unlocking vast potential across diverse fields. This presentation emphasizes the transformative power of MEMS sensors, envisioning a world where technology not only enhances devices but also transforms lives. The presentation concludes with an outlook on innovative use cases ahead.

Theodore Sizer

EVP, Optical Research, Nokia Bell Labs

Theodore Sizer

EVP, Optical Research, Nokia Bell Labs

Bio :

Dr. Theodore (Tod) Sizer leads the Optical System and Device Research Lab in Nokia Bell Labs, leading teams innovating in all aspects of optical systems and devices for access, core, submarine, satellite, and data center communications. Prior to his current role, Tod lead Wireless Research in Nokia Bell Labs for eight years driving the vision and research of 5G. Tod graduated from Amherst College, and received his Masters and Doctorate in Optics from the Institute of Optics at the University of Rochester. In 2012 he received the Popular Science Breakthrough Innovation award for the lightRadio invention. Tod is a Fellow of Bell Labs, WWRF, and IEEE. He is the author of 55 US patents and a member of the IEEE and Optica.

Abstract :

Outside of the first 100m which might be carried over WiFi or 5G, nearly all communications are over optical fiber whether it is subsea, terrestrial, fiber to the home, or in the data center. This reality, however, is facing significant challenges due to fundamental limits we have reached in fiber communications. Managing the continued massive growth in communication requires new innovation to overcome the limits with new architectures, systems, and devices. For the optoelectronic semiconductor industry the challenge is to increase speed and parallelism in our devices while reducing the cost and energy per bit carried. In this talk we will share more on the challenge as well as the ways we are addressing in inside Nokia Bell Labs, particularly with research at the III-V Lab joint venture celebrating its 20th anniversary this year.

Fabio Gualandris

President Quality, Manufacturing & Technology, STMicroelectronics

Fabio Gualandris

President Quality, Manufacturing & Technology, STMicroelectronics

Bio :

Fabio is STMicroelectronics’ President, Quality, Manufacturing, and Technology and has held this position since July 2023. He was responsible for the company’s Back-End Manufacturing & Technology organization since 2016 and also led the Company’s Testing Council, alongside its manufacturing strategy in Asia and efforts in System-in-Package technology. Fabio is a member of ST’s Executive Committee.
Fabio joined SGS Microelettronica (now ST) R&D in 1984. He became R&D Director of Operations in 1989 and became Automotive BU Director in 1996. After two years as President and CEO of Semitool, he rejoined ST in 2000 as Group VP responsible for memory products including the RAM/PSRAM and Automotive Flash. In 2005, Fabio was appointed CEO of ST Incard, an ST smart-card subsidiary. In 2008-2010, he served as VP and Supply Chain General Manager at ST’s memory JV with Intel. In 2011, Fabio was appointed ST’s Executive Vice President, Product Quality Excellence.
Fabio has authored several technical and managerial papers and holds multiple international patents. He serves as Chairman of STS, ST's manufacturing JV in China. Fabio was born in Bergamo, Italy, in 1959. He is a Doctor in Physics from the University of Milan.

Abstract :

Since its inception in 1958, semiconductor technology has undergone rapid growth and innovation, positioning itself as one of the most dynamic segments in technological advancement. Following Moore's Law on technology evolution, and then transitioning to "More than Moore" approaches, the technology has progressed towards SoC and SiP architectures, ultimately leading to heterogeneous integration and chiplet technologies. New materials such as SiC and GaN have also been introduced, complementing Silicon, which still remains indisputably the main actor.Alongside these materials, new manufacturing techniques including SOI, W2W bonding, PLP, Fan-In-Fan-Out, DCI, PCM, FD-SOI, and II-VI quantum dots have emerged. The advancement of semiconductor technology moved hand in hand with increasing in volumes, data processing capabilities, and automation, paving the way for Edge AI applications that leverage deep learning and ML algos.
To sustain complexity and innovation, we implement edge-to-edge technology governance with integrated planning, data-driven decisions, and multidimensional organizational structures. Specific examples will clarify these concepts.

Abstract:

Since its inception in 1958, semiconductor technology has undergone rapid growth and innovation, positioning itself as one of the most dynamic segments in technological advancement. Following Moore's Law on technology evolution, and then transitioning to "More than Moore" approaches, the technology has progressed towards SoC and SiP architectures, ultimately leading to heterogeneous integration and chiplet technologies. New materials such as SiC and GaN have also been introduced, complementing Silicon, which still remains indisputably the main actor. Alongside these materials, new manufacturing techniques including SOI, W2W bonding, PLP, Fan-In-Fan-Out, DCI, PCM, FD-SOI, and II-VI quantum dots have emerged. The advancement of semiconductor technology moved hand in hand with increasing in volumes, data processing capabilities, and automation, paving the way for Edge AI applications that leverage deep learning and ML algos.
To sustain complexity and innovation, we implement edge-to-edge technology governance with integrated planning, data-driven decisions, and multidimensional organizational structures. Specific examples will clarify these concepts.

Sanjay Natarajan

SVP & GM, Components Research, Intel

Sanjay Natarajan

SVP & GM, Components Research, Intel

Bio :

Sanjay Natarajan is a Senior Vice President and General Manager of Intel Foundry Technology Research & External R&D Engagements group at Intel Corporation. He is responsible for Intel's internal semiconductor research, external engagements with Universities and Consortia, and government engagements worldwide related to semiconductor R&D. During his 31-year career in the semiconductor R&D industry, Sanjay led the development of Intel's 14nm process technology, and prior to that, he led development of Intel's industry-leading 32nm process technology. In addition to Intel, Sanjay has held senior executive positions at Applied Materials, where he led a group developing new types of semiconductor equipment focused on extending Moore’s Law. Outside of work, Sanjay is a Research Professor in the Department of Mechanical & Materials Engineering at Portland State University. He also serves on the Advisory Boards to the Deans of Engineering at Portland State University and Carnegie Mellon University and serves on the Advisory Council for the National Science Foundation Engineering Directorate. He is an IEEE member and received his BS, MS, PhD in Electrical Engineering from Carnegie Mellon University.

Abstract :

For nearly 60 years, Moore’s Law has exponentially increased our ability to compute and has transformed the way we live. Today we live in a world in which nearly every aspect of our lives is touched by technology, including technology itself - which now finds itself in a virtuous cycle of increasing demand driven by increasing capability.
As graphics and AI applications create new and taxing compute workloads, storage needs and power-hungry data transfer rates, advancing Moore’s Law has become more relevant than ever.
Continued dimensional scaling, additional new materials, novel architectures and disruptive innovation at all levels of the compute system drive Intel’s research on the fundamentals of semiconductor technology in our relentless pursuit of Moore’s Law.

Laura Matz

CSTO, Merck

Laura Matz

CSTO, Merck

Bio :

Dr. Laura Matz serves as the Chief Science and Technology Officer at Merck KGaA Darmstadt, Germany, a role that entails spearheading the innovation agenda of a distinguished science and technology enterprise with a heritage exceeding 350 years in chemistry, biotechnology, and integrated materials solutions.
In her capacity, Laura collaborates closely with the Company Board and partners with Innovation Heads across Merck KGaA's three leading industry verticals: Life Science, Healthcare, and Electronics. Her visionary leadership is instrumental in shaping the future of the enterprise, leveraging digital and AI/ML technologies to drive innovation, exploring new markets, fostering strategic partnerships, and developing cutting-edge capabilities and digital business models to deliver groundbreaking solutions. A recent notable achievement includes her role as CEO in launching Athinia™, a joint venture with Palantir, which introduced a pioneering data collaboration platform for the semiconductor ecosystem.
Prior to assuming the role of CSTO, Laura held the position of Senior Vice President within EMD Electronics, previously Versum Materials and Air Products Electronics division. With over 20 years of experience in semiconductor manufacturing and a decade dedicated to running semiconductor materials businesses, she has been a driving force in advancing semiconductor materials development, emphasizing robust R&D initiatives to fuel business growth.
Laura is well-recognized for her leadership style, fostering diverse teams to innovate and solve complex challenges facing humanity. She advocates for the empowerment of young talent in science and engineering, recognizing their potential to drive meaningful change.
Beyond her role at Merck KGaA, Laura serves on the Board of Directors of transformative organizations. She is a board member of AIChE (American Institute of Chemical Engineers), championing a mission to inspire a safe, connected, and inclusive community of chemical engineering professionals worldwide. She contributes on the Board of SEMI Impact for Skills, a governance program focused on upskilling and reskilling initiatives, talent attraction, and accessing funding opportunities. Laura also serves as Director on the board of AION Labs, a Venture Studio pioneering a novel AI-based paradigm to drug innovation.
With her extensive industry experience, Laura is well regarded as a thought leader at the intersection of science, technology, innovation, and business.

Abstract :

Merck, a leading global Science and Technology company, operates across life science, healthcare, and electronics. With over 350 years ability in chemistry, biotechnology, and integrated materials solutions, Merck is at the forefront of leveraging data and digital technologies to drive innovation. By actively exploring new markets and developing its digital business models, Merck is leveraging its capabilities to deliver groundbreaking solutions to customers and patients.
In this presentation, Laura Matz, Merck's Chief Science and Technology Officer, will discuss the challenges faced by the Healthcare and Semiconductor industries and highlight how Merck utilizes digital business models and tools to provide solutions. Using AI as an example, she will showcase the benefits of data collaboration platforms in both Semiconductor and Healthcare industries as well as how AI is transforming drug discovery for proactive patient care.

Bernhard Quendt

CTO, Thales Group

Jean-Philippe Fricker

Chief System Architect and Co-Founder, Cerebras Systems

David Anderson

President, NY CREATES

David Anderson

President, NY CREATES

Bio :

A semiconductor industry veteran of 35 years, NY CREATES President David Anderson provides strategic leadership to grow and achieve the organization’s mission of fostering innovation that leads to job creation in New York State. He oversees a program portfolio consisting of 10 sites throughout the state, with expenditures exceeding $350 million annually from industry and state partners, and federal government research and economic development programs.

Previously, David was President of SEMI Americas, leading SEMI’s programs and visibility in the Americas. Before that, he founded and was President and CEO of Novati Technologies, Inc., with the world’s largest portfolio of product development materials. He has held executive positions for development foundries ATDF and SVTC Technologies, and leadership positions at Fairchild Semiconductor, National Semiconductor, the Semiconducto Industry Suppliers Association, and SEMATECH.

David has extensive experience in technology development, process engineering, operations management, supply chain management, international marketing, government relations, and strategy.

Abstract :

This presentation details semiconductor R&D centers as key drivers for stimulating innovation and enhancing chip manufacturing capabilities while bolstering the global semiconductor industry. It will highlight the many unprecedented opportunities for accelerating semiconductor R&D and cultivating a robust ecosystem. Additionally, this presentation showcases the pivotal role of semiconductor R&D centers in harnessing collaborative research efforts, fostering public-private partnerships, and nurturing talent. It will highlight the positive impact of semiconductor R&D centers on industry growth, job creation, and national security. Attendees will gain insights into the innovative research initiatives, cross-sector collaborations, and technology roadmaps that these centers facilitate, and how CHIPS Acts will help to propel the innovations necessary for the future of the semiconductor industry.

Coby Hanoch

CEO, Weebit Nano

Emmanuel Sabonnadière

Senior Vice-President for Automotive & Industrial., Soitec

Emmanuel Sabonnadière

Senior Vice-President for Automotive & Industrial., Soitec

Bio:

Since July 2021, Mr. Sabonnadiere has served as the Executive Vice President of the Automotive & Green Industry Division at Soitec, where he also oversees the Strategic Program for Silicon Carbide (SiC).

Prior to this role, from September 2017 to July 2021, Mr. Sabonnadiere held the position of CEO at CEA-Leti, a renowned laboratory in the fields of microelectronics and biotechnology located in Grenoble, France.

Preceding his tenure at CEA-Leti, he served as CEO and Chairman of the Division Professional at Signify, formerly known as Philips Lighting, based in Amsterdam, for two years. From 2014 to 2016, he was a Senior Associate at the MidCap Private Equity firm Gimv, operating out of Paris, Antwerp, Munich, and The Hague. Earlier in his career, Mr. Sabonnadiere held executive roles including CEO and Chairman of General Cable Europe & Africa in Barcelona. He also served as CEO of NKM Noell GmbH, the German branch of the REEL Group, from 2005 to 2008. Furthermore, he spent five years as Vice President of the Distribution Transformers division at Alstom T&D. His career began in 1992 at Schneider Electric, where he held various positions, including Managing Director of equipment units for a decade.

Mr. Sabonnadiere brings with him extensive experience in innovation, technology, and successful business strategies, with a proven track record spanning over three decades. An advocate for operational excellence, technological innovation, talent management, and inspiring leadership, Mr. Sabonnadiere's profound industry experience positions him as a highly respected and knowledgeable Senior actor in the International business landscape.

Mr. Sabonnadiere holds a PhD in Physics and an engineering degree in Information Technology, both from France, as well as an MBA from France.

Abstract:

For the past 30 years, Soitec has been at the forefront of designing and manufacturing semiconductor engineered substrates. As we look ahead, Soitec is positioned to capitalize on markets expected to grow by approximately 20% annually over the coming years, driven by three key megatrends: 5G/6G, Electric Vehicles (EVs), and Artificial Intelligence (AI). We anticipate EVs to emerge as a significant new growth catalyst, aligning with two major trends in the automotive market: the digitalization of vehicles and the electrification of mobility.
By 2030, it is projected that over 45 million cars sold will be EVs. With its enhanced performance in the powertrain, it is estimated that 50% of EVs will integrate Silicon Carbide (SiC) into their power electronics. Soitec's SmartSiC™ engineered substrates represent a new generation of SiC wafers, enhancing the electrical performance and efficiency of power devices, SmartSiC™ offers a greener, faster, and superior solution. It achieves this by reducing CO2 emissions by 70% compared to traditional SiC wafers, accelerating the adoption of 200mm SiC wafers by 2-3 years, and improving device-specific on-resistance by up to 30%. These remarkable capabilities have been possible because of the Pilot Line developed into CEA-Leti, and a reality now through manufacturing in Soitec's new fab, which has been in production since September 2023. The presentation at CEA-Leti 2024 executive session will provide insights into the SmartSiC process and present the latest results on wafers, devices and systems. It will illustrate how SmartSiC™ is driving significant advancements in the SiC business, benefiting both the automotive and Green industry sectors. It will explore the latest developments to be expected at power devices and expected innovations in Automotive & Green Industry

Leroy Liu

CSO, Realtek

Sébastien Dauvé

CEO, CEA-Leti

Sébastien Dauvé

CEO, CEA-Leti

Bio:

Sébastien Dauvé was named CEO of CEA-Leti effective on July 1, 2021, after more than twenty years of experience in microelectronics technologies and their applications, including clean mobility, medicine of the future, cybersecurity, and power electronics.

Sébastien Dauvé started his career at the French Armament Electronics Center, where he worked on developing synthetic-aperture radar. In 2003, he joined CEA-Leti as an industrial transfer manager and supervised several joint research laboratories, in particular with the multinational Michelin.

In 2007, Sébastien Dauvé became a laboratory manager, then head of an R&D department in the area of sensors applied to the Internet of things and electric mobility. During this time, he supported the dissemination of new technologies in industry, including the automotive industry (Renault), aeronautics, national defense (SAFRAN), and microchips with the industry leader Intel. He played an active role in the creation of start-ups in application fields ranging from health to infrastructure security, leading to dozens of new jobs. In 2016, he became Director of the CEA-Leti Systems Division.

From sensors to wireless communication, Sébastien Dauvé has played an active role in the digital transformation, focused on coupling energy frugality and performance. He has made cross-disciplinary approaches central to innovation by harnessing the expertise of talented teams with diverse backgrounds. Their goal is to provide technological tools for meeting the major societal challenges of the future.

Sébastien Dauvé is a graduate of the French Ecole Polytechnique and the National Higher French Institute of Aeronautics and Space (ISAE-SUPAERO).

Michael Tchagaspanian

EVP Strategic Partnerships, CEA-Leti

Pierre Chastanet

Head of Unit - Microelectronics & Photonics Industry, European Commission

Pierre Chastanet

Head of Unit - Microelectronics & Photonics Industry, European Commission

Bio:

Pierre Chastanet is Head of the Unit for Microelectronics and Photonics Industry at the European Commission, where he manages the development of European semiconductor policy and the implementation of the European Chips Act.

Mr. Chastanet has been working for over 17 years in the European Commission, supervising different digital policies in the areas of cloud, data flows, software, cybersecurity, privacy, green ICT, and telecom innovation.

Prior to that, Mr. Chastanet gained more than 10 years of ICT experience, mostly in various IT management positions in a large multinational company.

He holds a MSc in Telecommunication Engineering from Telecom Paris (Paris Polytechnic Institute), a M.A. in International Politics from the Free University of Brussels (ULB), and a BSc in Economics from the London School of Economics and Political Science. He also earned a Leadership Executive Certificate from Harvard Kennedy School of Government.

Abstract:

With the European Chips Act, the EU will address semiconductor shortages and strengthen Europe’s technological leadership. It will mobilise more than € 43 billion of public and private investments and set measures to prepare, anticipate and swiftly respond to any future supply chain disruptions, together with Member States and our international partners.

This will be achieved based on three pillars of action:

The "Chips for Europe Initiative" is supporting large-scale technological capacity building and innovation.
A framework to incentivise public and private investments in manufacturing facilities will ensure the security of supply and resilience of the Union's semiconductor sector.
A coordination mechanism through the European Semiconductor Board constitutes the key platform for coordination between the Commission, Member States and stakeholders.

The European Chips Act will bolster Europe’s competitiveness and resilience in semiconductor technologies and applications, and strengthen Europe’s technological leadership in the field.

Electronics & Sustainability

Léa Di Cioccio

Eco-Innovation Program Manager, CEA-Leti

Laurent Pain

Sustainable Electronics Program Director, CEA-Leti

David Medeiros

Ph.D. Senior Director Engineering, CTO Office, Entegris

David Medeiros

Ph.D. Senior Director Engineering, CTO Office, Entegris

Bio:

David Medeiros has over 30 years of industry experience in the semiconductor industry. He is currently the Senior Director of Engineering in the office of the CTO of Entegris, located at the headquarters in Billerica, MA. His primary focus areas are innovation for sustainability and corporate lithography strategy. He serves as the co-chair of the SEMI PFAS Working Group and is an active member of the SIA PFAS Consortium and the SEMI PFAS Initiative. He is also co-lead of the Materials, Equipment, Metrology, and Inspection (MEMI) working group of the American Semiconductor Innovation Coalition (ASIC). David is a part-time instructor at the Gordon Institute at Tufts University in Medford, MA, teaching Engineering Leadership and Ethics. Prior to joining Entegris in 2021, David spent six years at GlobalFoundries in Malta, NY in executive roles in patterning, capital management, and fab-capacity planning, as well as 17 years at IBM in Yorktown Heights, East Fishkill and Albany, NY, in a variety of engineering and management roles, primarily focused on lithography and patterning. He is trained as an organic chemist, starting his career as a research scientist at the Shipley Company and receiving his PhD from the University of Texas in Austin. He is the co-author of more than 50 technical papers and the co-inventor on over 50 issued US patents.

Abstract :

Water is perhaps the most important substance in semiconductor manufacturing beyond silicon. Today’s fabs use enormous volumes of water with exacting specifications for purity. As the industry grows, there is an increasing focus on strategies for minimizing use, reclamation, and other approaches to ensure a sustainable future for the industry, all without compromising quality. This presentation will provide an overview of the challenges facing semiconductor manufacturers and how innovative solutions provide opportunities for navigating a future that is both technology-enabling and environmentally conscious.

Abstract :

Nadine Allemand

PhD, Deputy Director, CITEPA

Nadine Allemand

PhD, Deputy Director, CITEPA

Bio:

Nadine Allemand is deputy director of Citepa since 2011. After a university degree in atmospheric sciences and a PhD in analytical chemistry, she joined Citepa in 1986. She has extensive experience in air pollution and climate issues and policies and measures to reduce emissions, including improving air quality and mitigating climate change. Among other tasks, she leads the technical-scientific secretariat of the "Task Force on Techno-Economic Issues (TFTEI)" of the Air Convention (CLRTAP) of the United Nations Economic Commission for Europe (UNECE) and participates in numerous works within the framework of this Air Convention. She has been responsible of a large number of technical assistance projects such as for the French Ministry for an Ecological Transition for the development of the national strategy to reduce air pollutant emissions (PREPA), or for international projects for different countries such as Serbia and Turkey to help these two countries to develop their plans to combat air pollution

Abstract:

The presentation will give a brief overview of the role of existing EU policies and measures on the reduction of emissions of air pollutants and improvement of air quality. It will present the new policies developed by the EU and explain what the objectives are.

Jean-Marc Girard

CTO & Sr VP. Manuf. Technologies, Air Liquide

Isabelle Servin

Sustainability Advisor and Eco-Design Engineer, CEA-Leti

François Marty

In charge of Star Monitoring, Team for the Planet

Elise Chaumat

Research Engineer—Eco-Innovation and LCA, CEA-Leti

Fabien Chêne

Head of Sustainability Business Europe, Schneider Electric

Fabien Chêne

Head of Sustainability Business Europe, Schneider Electric

Bio:

After finishing his studies - Engineer & Master's Innovation & Technology Management - EM Lyon- Fabien has joined Schneider Electric as a Business Development Manager where he has occupied the role of Director & Principal for Energy & Sustainability services before developing the solutions division of Business.
As the Head of Schneider Sustainability Business Europe, Fabien is at the forefront of advancing the company's commitment to sustainability and energy efficiency .
Fabien both crafts and ensures the adequate execution of strategies that aid global companies reduce their environmental impact & achieve their sustainability goals.
Fabien joined Schneider Sustainability Business in 2013 and has occupied diverse roles gaining a well-rounded and thorough understanding of each sector of operations to best lead the business.

Fabien is an expert advisor specializing in climate change strategy & guiding decarbonization efforts, dedicated to assisting Commercial & Industrial client on their path to Energy Efficiency & Electrification .

Abstract:

Minimizing the carbon footprint of the semiconductor industry is a key priority, particularly with scope 3 posing significant challenges. Decarbonizing the entire value chain effectively demands robust partnerships and industry-wide collaboration. Join us in this session to discover how forming the right partnerships can help reduce the carbon footprint of the semiconductor industry as a whole!

Thierry Chevolleau

Head of Etching Laboratory, CEA-Leti

Jérôme Daviot

R&D and Application Director, Deputy General manager, Technic

Ilya Zabelinsky

Co-Founder, ISRL

Charlène Descollonges

Engineer & Hydrologist, ENTREPRENEUR

Sahar Al Kamand

Sales Engineer, Hummink

Sahar Al Kamand

Sales Engineer, Hummink

Bio:

Sahar is a Sales Engineer at Hummink, responsible for identifying new business opportunities and collaborating closely with the business development team to facilitate Hummink's global expansion efforts. Her educational background includes a masters degree in Electronics Engineering with a focus on biomedical applications, as well as a master's degree in Biomaterials and Biodevices from the BME International Program in Paris. She has around 4 years of experience in sales and business development within tech companies, including startups.

Abstract:

In the context of modern manufacturing, sustainability is crucial due to the rising demand for electronic products and subsequent electronic waste issues. Traditional printing methods face limitations in resolution and precision, necessitating advanced techniques like High Precision Capillary Printing (HPCaP). Inspired by Atomic Force Microscopy (AFM), HPCaP utilizes capillary forces for precise printing on various substrates, achieving sub-micron resolutions. This method minimizes material usage, accommodates various inks, and is versatile across substrates, including recyclable ones. HPCaP technology enhances repair processes in industries such as displays, electronics, semiconductors, and automotive, contributing to a more resilient and environmentally friendly future amidst the shift towards a circular economy and eco-conscious innovation

Mattias Espanet

Central Facilities Water Program Manager, STMicroelectronics

Tech for Health

Nadège Nief

Deputy Head of Healthcare Division, CEA-Leti

Aurore Lepecq

Deputy Head of Energy Electronics & Sensors Systems Department in System Division, CEA-Leti

Philippe Andreucci

Co-Founder, CEO & Member Board of Directors, Injectpower

Selim Olcum

VP of Engineering, Travera

Selim Olcum

VP of Engineering, Travera

Bio :

Dr. Olcum is a co-founder of Travera, a pioneering biotechnology company in functional precision medicine in cancer. He is one of the inventors of Travera’s 2-day Rapid Therapy Guidance Test that measures the ex vivo growth response of live tumor cells to treatment. Dr. Olcum, earned his Ph.D. degree in electrical engineering from Bilkent University. He has completed his post-doctoral training in Biological Engineering at MIT and served as a research scientist at the Koch Institute for Integrative Cancer Research. He is a Ph.D. technologist, has co-authored over 50 papers, is an inventor of 15 issued and pending patents in bioinstrumentation, medical devices, microfluidics, sensors, micro-devices, and their biotechnology and healthcare applications.

Abstract :

Functional precision medicine offers a promising complement to genomics-based cancer therapy guidance by directly testing drug efficacy on patient tumor cells. Travera's test, delivering therapy guidance in just two days, boasts over 80% predictive accuracy across multiple cancers, tissue types and therapies. This talk details Travera's methodology, which integrates single-cell mass measurements with linked brightfield imaging, and discusses linked single-cell volume, density, and morphology and their utilization for improving the predictive accuracy and in broader single-cell data landscape.

Christine Dufour

Silicon Microfluidics Program Manager, X-FAB

Kalyan Handique

Chief Innovation Officer, CDG, Bio-Rad Laboratories

Kalyan Handique

Chief Innovation Officer, CDG, Bio-Rad Laboratories

Bio:

Dr. Kalyan Handique is one of the most prolific biotech and medical device innovators from Michigan with over 400 world wide patents. He is the founder of two successful healthcare start-ups Handylab and Celsee Inc. He currently serves as the Chief Innovation Officer,CDG at BioRad Laboratories, a leader in global life sciences and clinical diagnostics markets. Kalyan joined BioRad through the successful acquisition of Celsee in April 2020. Celsee focused on developing innovative tehnologies for rare cell and single cell analysis. Before Celsee, Handy was a founder of HandyLab, a molecular diagnostics startup based in Ann Arbor, MI that was sold to Becton Dickinson for $300M+ in late 2009. He serves as an advisor, mentor and board member to many startups and seed funds in the Michigan Biotech Region. Handy holds a PhD in Chemical Engineering from the University of Michigan.

Abstract :

Microfluidics has been at the core of numerous molecular diagnostic tests developed for the research and clinical markets over the past few decades. This technology has enabled the development of portable integrated instruments that can analyze a few biomarkers, such as DNA, RNA, or proteins. These instruments are now available for use at the point of care. However, analyzing multiple biomarkers simultaneously using technologies such as next-gen sequencing comes with its own set of challenges. Interrogation of hundreds to thousands of biomarkers requires complicated sample preparation steps and is cost-prohibitive to run in decentralized settings. New approaches for further miniaturization of sample prep technologies and advanced manufacturing methods are still needed to harness the true power of molecular diagnostics. Advances in microfluidic technology may be the answer.

Enrico Alessi

R&D Manager, STMicroelectronics

Enrico Alessi

R&D Manager, STMicroelectronics

Bio :

After graduating from the University of Catania (Italy) in 1997 with a degree in Electronics Engineering, Enrico's professional career started with IBM and Wind Telecommunications working on ICT and telecommunication standards. In 2000 he joined ST to work on sensors for smart applications and later in the medical segment as R&D Manager and led a strategic project focused on human DNA analysis. During this time, he worked on building semiconductor chips and hybrid silicon-plastic devices, hardware, software and instrumentation for In Vitro Diagnostics, maturing experience in design for manufacturing, technical standards and medical certifications. Today, Enrico is contributing ST to develop the next wave of devices for vital signs monitoring. Focusing on both integrated and system-in-package solutions, he and his team are working on developing devices and methods, platforms and solutions for monitoring vital signs and human physiological parameters for transversal applications from medical field to mobile phones and wearable devices for virtual and augmented reality. Enrico holds a second degree in Computer Science at the University of Catania in 2006.

Abstract :

Vital signs monitoring (VSM) technologies are of great benefit for human life since they can predict heart failures, organs and tissues malfunctions, and metabolic pathways disorders. They represent a convergence of technological advances in materials science, sensors, biosensors, electronics, microfluidic, and artificial intelligence. In this context ST is developing next wave of devices for VSM focusing on integrated and system-in-package solutions, modules and platforms for monitoring physiological parameters targeting transversal applications from medical to consumer fields.

Abdelmadjid Hihi

Deputy Director—Clinical Innovation, CEA-Leti

Abdelmadjid Hihi

Deputy Director—Clinical Innovation, CEA-Leti

Bio :

Dr. Abdelmadjid Hihi is Deputy Director for clinical innovation at DTIS, CEA-Leti’s innovative health technologies division. He is a member of CEA-Leti’s Internal Scientific Council, and is responsible for coordinating international public-private partnerships funded by the European Commission and DARPA in particular for medical devices, biomedical research, and neurotechnologies. Before joining Leti, Madjid was at Génome Québec as Scientific Program Manager; and at Chronogen Inc. (Montreal, Quebec) as R&D group leader. Madjid holds a Ph.D in biological sciences from Lausanne University (1999). He is a former Swiss National Fund postdoctoral fellow, and a McGill University postgraduate alumni.

Abstract :

Integrated medical device development platforms are a must to facilitate the connection between technology R&D and clinical deployment of innovative medical devices. In addition to clinical operability, such platforms may ensure an early compliance to industrial norms and regulatory constraints. These elements are key to successfully bring novel medical devices to the real world. Examples will be discussed based on Leti's cuting-edge research with a focus on brain-computer interfaces to compensate motor handicap, as well as on non-pharmacological therapies for neurodegenerative diseases based on photobiomodulation.

Beatriz Matesanz

MIS Innovation and IrixX Business Segment Director, Thales

Mykhailo Zarudniev

Research Engineer, CEA-Leti

Mykhailo Zarudniev

Research Engineer, CEA-Leti

Bio:

M. Zarudniev received B.S. (2006) and M.S. (2008) degrees in Space and Aeronautical Systems from the National Technical University of Ukraine, Kyiv Polytechnic Institute, Ukraine, successfully accomplished 3rd year cursus in R&D at Ecole Centrale de Lyon (2009), France, and the Ph.D. (2013) delivered by Lyon University Claude Bernard (France). He joined CEA-LETI (France) in 2012 participating in numerous industrial and collaborative R&D projects working on the multi-sensor dynamical systems for operational awareness and obstacle avoidance. In 2014-2018 the research activity was performed on the embedded signal processing integrated to IR-UWB and FMCW radar sensors. From 2019, he is in charge of the innovative RFIC architectures development for radar and spectral sensing applications.

Abstract :

This presentation spans the latest developments of CEA-LETI in the matter of mmW Radar integrated circuit solutions for vital sign measurements, main features of the mmW radar for this application and perspectives for RF sensors in the near future regarding new opening markets.

Abstract:

Chiara Paviolo

Research Engineer & Project Leader, CEA-Leti

Chiara Paviolo

Research Engineer & Project Leader, CEA-Leti

Bio :

Chiara Paviolo is a project leader at CEA, working at the interface of engineering, physics and biology. After a PhD in biomedical engineering and a first PostDoc in Australia, she moved to Bordeaux (France) as a Marie-Curie fellow. In 2021 she joined CEA as an R&D engineer on novel microscopy techniques coupled with neural networks. Chiara is now the scientific coordinator of different academic and industrial projects and responsible of the 3D optical imaging development in the laboratory of ‘’Optical instrumentation and data-processing for in vitro imaging’.

Abstract :

To obtain evidence of the processes underlying cancer, we have developed a novel microscope where hardware and software are seamlessly integrated, and uses computational neural networks to determine the evolution of cell phenotypes. The software relies heavily on the use of neural networks for image formation, cell analysis, cell fate prediction and decision making to i) image and analyse in quasi real-time, cell behaviours of thousands of cells in parallel ii) identify variations in cell-state indicative of disease origin, iii) pinpoint the location of the cell of interest and the hardware will allow it to iv) pick-up cells for bio-analysis as a final step. While the live cell imaging will provide information about the past of the cell, the molecular analysis would reflect the present biological state of the cell and the prediction algorithm would then suggest the future state of the cell. The framework we propose is disruptive - we imagine a future where live cell microscopy and biomolecular analysis will form a continuum to generate a comprehensive biological timestamp for any cell of interest.

Abstract:

Tristan Caroff

Project Manager on Sensor Systems, CEA-Leti

Alexandre Delalleau

Medical Device Platform Manager, CEA-Leti

Jean-Pierre Burnouf

European Ecosystem & Scientific Relations Manager, Sanofi

3D Heterogeneous Integration

Sylvie Joly

3D Integration and Packaging Partnerships Manager, CEA-Leti

Pascal Vivet

Scientific Director, CEA-List

Jean-Philippe Fricker

Chief System Architect and Co-Founder, Cerebras Systems

Denis Dutoit

Program Manager, CEA-List

Denis Dutoit

Program Manager, CEA-List

Bio:

Denis Dutoit is senior program manager for advanced computing and digital architectures at CEA-List. He coordinated the European ExaNoDe project that developed a computer node demonstrator combining chiplets, an active interposer, and bare dies in a System-in-Package (SiP). He has also contributed to the architecture of the European Processor Initiative (EPI). His current focus is on architecture pathfinding into chiplet-based designs for computing applications including automotive electronics. Before joining CEA, he was a system-on-chip architect at ST Microelectronics and ST Ericsson. He has authored or coauthored more than 20 articles, including invited talks and tutorials at IEEE conferences.

Abstract:

Automotive E/E architecture is going towards centralized computing platforms running a rich set of compute intensive
applications with an increased number of sensors with high data traffic for fusion. Such a computing architecture requires
scalability to cover the needs of all vehicle platforms with a reasonable power consumption and cost. Either software
solutions optimized for flexibility or specialized ASIC solutions optimized for cost and power are not fully satisfactory to
answer centralized automotive platforms. This presentation will show how chiplet-based architectures combined with a
model-based design flow for architecture exploration could answer automotive needs.

Jean Charbonnier

Expert in 3D Integration, CEA-Leti

Jean Charbonnier

Expert in 3D Integration, CEA-Leti

Bio :

Jean Charbonnier, is graduated from National School of Physics of Grenoble in 2001 and obtained his Phd degree in crystallography from University Joseph Fourier of Grenoble in 2006. He joined the 3D wafer level packaging group of CEA-Leti in 2008. He has been working for more than 15 years in Through silicon vias, 3D interconnections and silicon interposers technology. His research interests include High Performance computing, Silicon Photonics Interposer as well as cryo-packaging for Quantum architecture applications. He is currently in charge of coordinating the High Density 3D Integration group within the 3D Integration Technologies Laboratory of CEA-Leti.

Abstract :

Due to the increasing costs of advanced nodes and the difficulties of shrinking analog and circuit input-output signals (IOs), alternatives to single die architectures are becoming mainstream. Scalable modular architectures and function partitioning paves the way for new system approaches using 3D technologies. 3D interconnects offers a breakthrough in terms of density, bandwidth, and limit overall power consumption. CEA-Leti’s advanced heterogeneous packaging research leverages expertise in 3D integration by means of Through Silicon Via (TSV) and Hybrid Bonding (HB) technologies developments since more than 15 years. This presentation will exposed the synergy of these key enablers through two meaningful examples for edge IA sensors and HPC applications.

Emilie Bourjot

Project Manager in 3D & BEOL Integration, CEA-Leti

Emilie Bourjot

Project Manager in 3D & BEOL Integration, CEA-Leti

Bio:

Emilie Bourjot is Project Manager and responsible of hybrid bonding integration team in 3D & packaging laboratory at CEA-Leti since 2018. Her current activities involve developing advanced hybrid bonding schemes for 3D integration in wafer to wafer and die to wafer approaches. Prior to joining CEA-Leti, she worked within Microelectronics foundries and R&D centers on the development of advanced FDSOI technologies and sub-3nm nodes. Her area of expertise includes contact, BEOL and hybrid bonding integration.

Abstract :

Heiko Dudek

Technical Account Manager, 3D-IC & Heterogeneous IC Packaging, Siemens EDA

Michael Campbell

Senior Engineer—Collaboration Spokesperson, CERN

Séverine Cheramy

Product Line Manager, Aledia

Séverine Cheramy

Product Line Manager, Aledia

Bio:

Séverine Chéramy holds an engineering degree having specialized in material science.

She has spent over eight years at GEMALTO, a leading smart-card company developing technologies for secure solutions such as contactless smart cards & electronic passports.

In 2008, she joined CEA-Leti and for 11 years occupied various roles related to semiconductor 3D integration, as project and team leader,.In January 2017, she took the responsibility for 3D integration strategy and related business development. She was also director of the 3D project of ITR (Institute of Technological Research) Nanoelec from 2012 to 2020.

In 2021, she joined ALEDIA, spin-off of CEA-Leti, as product line manager for Smart-Pixel line. She coordinates the products life from specification to commercialization and manages the roadmap , matching customers’ needs and production’s requirements.

Abstract :

Aledia has developed a unique GaN-on-Silicon 3D µLED technology enabling the use of standard large-area silicon wafers. This cost-effective technology combines the interest of high manufacturability together with easy integration of electronics, and therefore enables access to completely new display formats based on µLEDs.

The talk will focus on heterogeneous integrations developped at Aledia which combine the emission function and the CMOS driver.

Abstract :

The talk will focus on heterogeneous integrations developped at Aledia which combine the emission function and the CMOS driver.

Romain Coffy

Packaging Engineer, STMicroelectronics

Frederic Devriere

Collaborative R&D Manager, Teledyne e2v

Jean-Stéphane Mottet

Technical Product & Sales Manager, SET

Dale McHerron

Chief Strategist, Chiplets & Advanced Packaging, IBM Research

Dale McHerron

Chief Strategist, Chiplets & Advanced Packaging, IBM Research

Bio :

Dale is currently the Chief Strategist for IBM Research Chiplet and Advanced Packaging Group based in Albany, New York. Prior to his current role, Dale was Senior Manager and Senior Technical Staff Member at IBM Research with responsibility for developing and leading IBM’s Heterogeneous Integration Research Program and principal investigator in the IBM AI Hardware Research Center. Over his 30 + year career at IBM, Dale has held various technical, managerial, and business development positions in both advanced packaging and CMOS logic R&D. Dale received his PhD in Chemical Engineering from Virginia Tech with a focus on polymeric materials. Dale has co authored numerous research papers and holds multiple patents in the field of microelectronics.

Abstract :

High performance computing (HPC) and AI applications are driving capacity and complexity of computational workloads at an ever increasing rate. In order to sustain these trends and improve energy efficiency, new hardware technologies and architectures are required. Silicon scaling and design innovations will not be sufficient to meet this challenge. Innovations in advanced packaging, heterogeneous integration, and chiplet architectures hold great promise to deliver system level performance improvements for these critical workloads and provide energy efficiency improvements for the next decade and beyond. In particular, the ability to package multiple silicon chips with a variety of computational functions and technologies in a small form factor will be critical. Furthermore, these technologies must also deliver significant gains in chip to chip communication bandwidth and latency to realize the system level improvements required to sustain these trends and meet the needs of future applications. This talk will discuss trends in workload requirements for HPC / AI and how innovations in packaging and heterogenous integration can enable new hardware architectures to meet the needs of the future.

Darius Bunandar

Chief Scientist, Lightmatter

Thomas Finateu

VP Sensor, Prophesee

Thomas Finateu

VP Sensor, Prophesee

Bio :

Thomas Finateu received the Master’s degree from the Electrical Engineering School of Bordeaux (ENSEIRB), France, in 2004 and the Ph.D. degree in electrical engineering in 2008. His dissertation was done at STMicroelectronics about, Crolles, France.
In 2008, he joined STMicroelectronics, Belgium as an analog engineer where he pursued his analog and RF work for Bluetooth transmitters mobile products.
In 2011, he joined SoftKinetic in Brussels, Belgium, now Sony DepthSensing Solutions. He has been working on Time Of Flight pixels and sensors as analog designer and project leader.
In 2015, he joined Prophesee, as senior analog designer and project leader. He has been working on bio-inspired pixels and sensors pushing further on-chip integration of analog and digital IPs, deeply involved in the joint development with Sony to mature the technology and make it ready for mass production. He is now VP sensor, with more than 20-year experience in the semiconductor industry and IC design.

Abstract :

After an overview on event-based sensors, upcoming trends regarding application domains will be introduced. It will justify the benefits of 3D integration while highlighting the challenges to face. But technology challenges are fortunately not the only ones, design and architecture challenges are arisen too such as edge-AI, multi-modality, multi-layer, pixel shrink, etc... Triple-layer stack and neural network such as GNNs can fill some of these gaps !

Mate Jenei

Tech Lead,3D integration and wiring, IQM Finland Oy

Julien Schmitt

Technical leader-Compilation, embedded code & simulation platforms,VSORA

Dmitriy Gusev

Project Director, Menta SAS

Sense & Act

Vincent Destefanis

Optical Sensors Industrial Partnerships Manager, CEA-Leti

Pierre-Damien Berger

MEMS Industrial Partnerships Manager, CEA-Leti

Stephen Bart

Senior Director of Advanced Technology, TDK

Stephen Bart

Senior Director of Advanced Technology, TDK

Bio:

Dr. Bart received the B.S., M.S., and Ph.D. degrees from the Massachusetts Institute of Technology, Cambridge, Massachusetts. He did his doctoral research with Professors Senturia and Lang on analysis and design of the first microfabricated electrostatic motors and pumps. After his PhD work, Dr. Bart joined Analog Devices, Inc., where he designed the MEMS sensor in the well-known Analog Devices, Inc. ADXL150 family of airbag accelerometers, which has over 500 million sensors in the field. From 1996 to 2002 he held several positions at Coventor, Inc., a developer of physical design tools for MEMS systems. Dr. Bart returned to Analog Devices as a Senior Product Development Leader, working on inertial MEMS sensors for the commercial marketplace. Dr. Bart then joined MKS Instruments to develop high-performance, vacuum absolute-pressure sensors for semiconductor and industrial applications. Today, Dr. Bart leads the Advanced Technology group at TDK, where he is developing advanced gas sensors, ultrasonic and acoustic sensors and advanced machine learning and circuit architectures. Dr. Bart's research interests include the design, modeling, and simulation of complex electromechanical systems and Machine Learning methods for sensor data fusion. Dr. Bart holds 11 patents in the microsystems area.

Abstract:

Sensor technology is becoming increasingly sophisticated, affordable, and ubiquitous. Sensors are becoming the human interface to the digital world and, when combined with machine learning (ML), make systems or devices more aware of what the human is doing, about to do, or has just done. As the variety and capabilities of sensors grow, technology has the opportunity to disappear into the background, assisting everyone to be better connected, track their internal health and well being and their external environment, and be enabled with more leisure time. Finally, sensors can optimize the power we consume with all devices, delivering a great experience at the lowest consumption of resources. I will explore these themes, show examples of developments at TDK, and inspire a future vision of smarter sensors.

Joost van Beek

Head of Process Development & Integration, Philips MEMS foundry

Joost van Beek

Head of Process Development & Integration, Philips MEMS foundry

Bio:

Joost van Beek (1969) has been active in MEMS and Micro Systems technology for over 20 years. During his career, he held scientific positions related to these fields at the Massachusetts Institute of Technology, University of California at Berkeley, Philips Research Laboratories, and NXP Semiconductors. Apart from his extensive research experience, he also had the opportunity at Philips and NXP to gain expertise in MEMS process and product release for large volume manufacturing. At NXP and Philips, he was leading projects on RF-Passives, RF-MEMS, MEMS timing devices, Ultrasound Sensing, and others. Currently, he is a member of the management team of the Philips MEMS Foundry in Eindhoven where he is leading the Process Development & Integration group.

Joost received a MSc degree in Applied Physics from the Technical University Eindhoven, and a PhD degree in Electrical Engineering from the Catholic University Leuven. He is co-author of over 50 scientific papers and holds 25 granted patents.

Abstract:

Philips operates a state-of-the-art 2650 m2 pure-play MEMS Foundry on the High Tech Campus in Eindhoven, the Netherlands. This MEMS Foundry is specialized in medium volume custom MEMS manufacturing. An important focal area is the co-development of manufacturing processes for its bio-medical customers. It is thereby uniquely acting as a European pilot line for emerging medical applications.

This presentation will elaborate several on-going MEMS manufacturing activities for various bio-medical applications, such as cell-sorting, neural probing, micro optical tomography and ultrasound imaging.

Lia Li

CEO & Founder, Zero Point Motion

Lia Li

CEO & Founder, Zero Point Motion

Bio:

Dr. Ying Lia Li (Lia), CEO and Founder of Zero Point Motion, is a trailblazer in chip-scale optical inertial sensors. Recognized with the 2021 Institute of Physics Clifford Paterson Medal, the 2022 Innovate UK Women in Innovation Award and named as Sensors Converge ‘Woman of the Year’ 2023, Lia's groundbreaking work redefines sensing using light. A physics graduate from Imperial College, she earned her Ph.D. at University College London, developing optical sensors with applications in macroscopic quantum state preparation. With a track record of coupling optical resonances to mechanical motion, she achieved displacement sensing over 1000x smaller than a single atom. Post-Ph.D., she secured prestigious fellowships from EPSRC and the Royal Academy of Engineering before founding Zero Point Motion in 2020, raising over £6.3M to date.

Abstract:

Zero Point Motion has been developing optomechanical accelerometers and gyroscopes using standard MPW offerings in micro-electro-mechanical systems (MEMS) and photonic integrated circuit (PIC) platforms. By exploiting the coupling between mechanical motion and the evanescent field of optical resonators, exceptional inertial sensing noise floors are demonstrated. In this talk we present progress in our proof-of-concept devices and how we are tackling challenges on creating a compact and low cost system architecture. We are exploring a number of ways to integrate lasers and detectors, capitalizing on emerging capabilities such as heterogeneous solutions.

Philippe Robert

CEO, NG.Sense

Marc Sansa Perna

Project Manager, CEA-Leti

Marc Chaigneau

Semiconductors Market Manager, Horiba

Pierre Jallon

Director of Technology & Innovation, eLichens

Cyril Herrier

Manager R&D, Aryballe

Pascal Mailley

Scientific Director, CEA Leti

Christina Strohrmann

Director Advanced Engineering, Bosch Sensortec GmbH

Andreja Erbes

Director, Technology Scouting and R&D Partnerships, STMicroelectronics

Andreja Erbes

Director, Technology Scouting and R&D Partnerships, STMicroelectronics

Bio :

Andreja Erbes received the M.Eng., M.A., and Ph.D. degrees from the Department of Engineering, University of Cambridge, in 2011, 2014, and 2015, respectively, in electrical and electronic engineering. In 2009, he spent one year abroad at the Massachusetts Institute of Technology (Cambridge-MIT Exchange Program) and took part in an undergraduate-research opportunity program with the Weinstein Research Group, where he worked on novel RF MEMS. Since 2022, he is the Director of Technology Scouting and R&D Partnerships at STMicroelectronics within the Analog, Power & Discrete, MEMS and Sensors group.

Abstract :

Sensors and actuators are at the heart of our interactions with the digital world. These devices, based on micro-electro-mechanical systems (MEMS) technologies and embedded with highly efficient and intelligent processing, are effectively merging the offline and online worlds. This fusion of technology into our daily lives is steering us towards a sustainable 'Onlife' era.

For the past 25 years, STMicroelectronics has been a global leader in MEMS, incorporating sustainability practices into the innovative technologies that are developed. This enables new applications and smarter, more sustainable products for our customers.

Piezoelectric MEMS technologies are an integral part of our sensor and actuator products, addressing the diverse requirements of modern applications. The latest advancements in piezoelectric MEMS technology show how process and design innovations are fueling today's applications and anticipating the needs of the future.

Additionally, STMicroelectronics is positioned to aid early-stage companies in their industrialization journey, helping to expedite their production scale-up for cutting-edge sensors and actuators. STMicroelectronics’s Singapore campus is 'Lab-in-Fab,' an 8-inch (200 mm) facility developed in partnership with the Institute of Microelectronics, offers a unique industrialization framework that supports customers in developing and transitioning their novel concept process technology to high-volume production.

Philippe de Bettignies

Technological Roadmap Manager, Horiba France

Philippe de Bettignies

Technological Roadmap Manager, Horiba France

Bio:

Philippe DE BETTIGNIES is the Advanced Technology Roadmap Manager at HORIBA France, in charge of establishing the directions for Innovation and R&D inside the company for the next 5-10 years to support its growth, and also listening to the progress in public research that would be of interest. He was previously the R&D manager of AFM and Raman microscopy in HORIBA during more than 10 years, and works now inside the Innovation team.

Abstract :

HORIBA France, pioneer in optical instrumentation and measurement systems, is a supplier of OEM solutions and benchtop instruments for both industrial and academic sectors. Targeting markets such as semiconductor metrology, environmental monitoring, and life sciences, HORIBA is developing a new range of optical sensors while scaling up current technologies (Raman, Photoluminescence, Ellipsometry) from laboratory settings to industrial environments.
In this presentation, we will present our roadmap for these advanced sensors, along with innovations in the needed sub-components to address the market challenges such as throughput enhancement, compact design, robustness, and seamless integration within fabrication facilities. We will illustrate the practical application of these developments with the Raman metrology inspection in semiconductor manufacturing.

Abstract:

New Materials for Computing

François Andrieu

Head of Memory & Computing Laboratory, CEA-Leti

Philippe Rodriguez

Head of Laboratory, CEA-Leti

Philippe Rodriguez

Head of Laboratory, CEA-Leti

Bio:

Philippe Rodriguez is a research engineer and laboratory manager at CEA-Leti in the Semiconductor Platforms Division.

He received his Ph.D. in 2007 from the University of Lyon 1 in Materials Chemistry for his work on metal organic vapor phase epitaxy growth of B(In)GaAs epilayers. From 2007 to 2009, he worked at the CNRS (French National Center for Scientific Research) developing deposition methods on structured substrates for process intensification applications. In 2009, he started his career at the CEA (French Alternative Energies and Atomic Energy Commission). First, he worked on the coating and fluidization of dense powders by fluidized bed metal-organic chemical vapor deposition for the development of new nuclear fuels (2009 - 2011). Then, he developed silica permeation barriers by magnetron sputtering for laser megajoule gas targets (2011 - 2013). Finally, he joined CEA-Leti in Oct. 2013. His research activity is mainly focused on advanced contact technologies for electronics and photonics applications. He develops contact metallization for advanced CMOS and photonics devices (Si, Ge(Sn), III-V and GaN materials) and also deals with surface preparation and interface modulation prior to metallization. He led the contact team at CEA-Leti between 2017 and 2020 and became head of the Advanced Materials Deposition Laboratory in February 2020. In Sept. 2022, he joined the Surface and Interface Science and Engineering Department and since Jan. 2023, he is in charge of the Laboratory of Wet Surface Preparation, Epitaxy and Thermal Treatment Processes.

He is the author and co-author of approximately 100 peer-reviewed journal articles, 115 international conference papers, 2 book chapters, and 15 patents.

Uygar Avci

Director, Novel Devices and Memory in Foundry Technology Research, Intel

Uygar Avci

Director, Novel Devices and Memory in Foundry Technology Research, Intel

Bio:

Uygar Avci is a Senior Principal Engineer at Intel Corporation and is currently leading Novel Devices and Memory Group in Foundry Technology Research. He is responsible for delivering new transistor and memory devices by bridging Physics-based understanding of new materials and experimental realities to enable viable semiconductor devices with power, performance and scaling benefit. He was an Editor for the IEEE Transactions on Electron Devices and is currently in the Executive Committee of the IEDM Conference. He has over 100 patents and has co-authored more than fifty papers. Uygar received double-major degrees in Physics and Electrical Engineering in Turkey and his PhD degree in Applied Physics from Cornell University.

Abstract :

As the demand for semiconductor technology increases through AI applications and number of electronic devices, improving power efficiency and scaling of the transistor and memory elements is vital. New materials such as Ferroelectrics for memory and TMD materials for logic offer great potential for scaling vs. the state-of-the-art devices and also for lowering power through their intrinsic properties. This talk will demonstrate recent advances in these devices and key challenges the researchers are focusing on.

Matthieu Jamet

Research Scientist, CEA

Salim El Kazzi

2D Product Manager, Aixtron

Lucie Le Van Jodin

Research Scientist, CEA-Leti

Lucie Le Van Jodin

Research Scientist, CEA-Leti

Bio :

Lucie Le Van-Jodin, Ph.D. is a project manager and a team leader for 2D material transfer at CEA-Leti. Lucie started her scientific carrier studying thermoelectricity during her Ph.D research. She worked at CEA from 2003 on carbon nanotubes for chemtronics, developing growth and characterization of this material. She spent more than 10 years in the CEA’s microbatteries Lab. There, she studied the relationship between the structural and electrical properties of the inorganic electrolyte. In 2018, she joined the film transfer Lab (LIFT). She is working on transfer of various materials as silicon, III-V, piezoelectric, wide gap materials… mainly by SmartCut™ technology. Recently, she focused her works on 2D material transfer for microelectronics applications.

Abstract :

Since the discovery of graphene and more generally of 2D materials, numerous studies have demonstrated the potential of these materials that allow a drastic devices size reduction, performances improvement, low power, new properties… That is why they are seen as the ultimate materials for the microelectronics of the future.. Nowadays, they can be found at several levels, in a wide variety of applications such as transistors, sensors, memories, RF switches...
However, the transition from lab to fab remains challenging. The implementation of 200 and 300 mm characterization capability for 2D materials at CEA enables us to work on this transition to industrial processes. Wafer scale growth, transfer such as integration and van der Waals interfaces preservation are intensively studied since they are key points for the successful manufacturing of industrial 2D materials devices.

Andrea Illiberi

Team Leader, ASM Corporate R&D

Milan Pešić

Senior Member of the Technical Staff and Director of Technology Development, Applied Materials Inc.

Milan Pešić

Senior Member of the Technical Staff and Director of Technology Development, Applied Materials Inc.

Bio:

Milan D. Pešić received a Ph.D. from the Technical University of Dresden, Germany, and is currently a Senior Member of the Technical Staff and Director of Technology development at Applied Materials Inc. He is leading a device and reliability team and overseeing device and cell physics and research activities in the field of advanced logic, (emerging) (non)volatile memories and devices. Previously, he was with MDLSoft Inc., Santa Clara, USA, Ferroelectric Memory Company, Dresden, and NaMLab, Dresden. Up to now, he has given 12 invited talks and (co)authored over 70 technical papers, four book chapters, and filed over 30 patents.

Abstract :

Only understanding of the materials and underlying physical mechanism can help us engineer novel superior devices of the future. Lead by this principle, we will look at ferroelectric (the most efficient memory material) and oxide-semiconductor materials and devices. We'll review what challenges they need to overcome to be integrated into logic and memory architectures. We will look in detail at the material phases, defects, vacancies, material changes, and underlying physical mechanisms governing mobility, variability, reliability, and others figures of merit of the devices they are integrated to.

Abstract:

Toshiro Hiramoto

Professor, The University of Tokyo

Milind Weling

Head of Lab-to-Fab-to-Product Realization, Merck

Milind Weling

Head of Lab-to-Fab-to-Product Realization, Merck

Bio :

Milind Weling is the Head of Lab-to-Fab-to-Product Realization and co-founder of the Neuro-inspired Computing Incubator of the Electronics business of Merck KGaA, Darmstadt, Germany, and for EMD Electronics in the U.S. and Canada. Previously he was Senior Vice President for Intermolecular, Inc. where he led Customer Programs and Operations where he drove the discovery and optimization of new materials, integrated module solutions, and leading-edge devices. Milind is a senior engineering and management professional with extensive experience in advanced memory and logic technology development, DFM and design-process interactions, new product introduction, and foundry management. His previously held senior engineering and management roles include DFM products engineering at Cadence Design Systems and high-performance CMOS technology development at Sun Microsystems, Philips Semiconductors, and VLSI Technology. Milind holds a B. Tech and MS degrees in Electrical Engineering from the Indian Institute of Technology, Bombay, and the University of Hawaii, respectively. He holds 50+ patents and has co-authored over 70 technical papers, primarily focused on semiconductor process technology, integration and semiconductor device reliability.

Abstract :

The advent of artificial intelligence (AI) has had a disruptive impact on the state of the art of technology at all levels of abstraction. AI’s explosive growth demands significantly revolutionary and enabling improvements of >100X for memory density + bandwidth, latency + performance, and energy consumption + overall environmental sustainability. With device innovation at its core, present day technology development focuses on emerging methodologies that require co-optimization of all orders of abstraction such as system, design, devices, technology and even materials aka SDDTMCO. This talk will highlight the opportunities and challenges the industry faces in transitioning from established to novel process architectures that require new materials for successful deployment. Our ability as materials suppliers to offer integrated additive process modules that meet customers’ aggressive performance and reliability target key performance indices (KPIs) will be crucial to accelerating semiconductor technology development. Moreover, technological progress can be further accelerated by embracing digital transformation to explore our exploration space and enable innovation.

Hitoshi Wakabayashi

Professor, Tokyo Institute of Technology

Simone Bertolazzi

Principal Analyst, Memory, YOLE GROUP

Simone Bertolazzi

Principal Analyst, Memory, YOLE GROUP

Bio :

Simone Bertolazzi, PhD, is Principal Analyst (Memory) at Yole Group. As member of the Yole Group’s Memory team, he contributes on a day-to-day basis to the analysis of markets and technologies, their related materials, device architectures and fabrication processes. Previously, Simone carried out experimental research in the field of nanoscience and nanotechnology, focusing on emerging semiconducting materials and their opto-electronic device applications. He (co-) authored more than 20 papers in high-impact scientific journals and was awarded the Marie Curie Intra-European Fellowship. Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland) and a double M. A. Sc. degree from Polytechnique de Montréal (Canada) and Politecnico di Milano (Italy).

Abstract :

In this presentation, I will provide an overview of emerging non-volatile memory (NVM) markets and technologies, discussing their technical maturity and their recent progress towards mass adoption in stand-alone and embedded applications. After reviewing the different NVM solutions currently available at leading semiconductor foundries/IDMs – among which MRAM, ReRAM, and PCM – I will discuss the challenges and opportunities for their adoption as embedded NVM in microcontrollers and edge-AI devices.

Ashonita Chavan

Distinguished Member of Techincal Staff, Micron Technology

RF & Telecommunications

Eric Mercier

Telecom Line Director, CEA-Leti

Swan Gerome

Industrial Partnerships Manager, CEA-Leti

Perrine Batude

MOS & 3D Sequential Integration Expert, CEA-Leti

Jean-Baptiste David

RF-mmW R&D Engineer, CEA-Leti

Yvan Morandini

Senior Strategic Marketing Manager, Soitec

Kazuaki Deguchi

Senior Manager RF Device Division, Murata

David Moussaud

R&D Engineer, CEA-Leti

David Moussaud

R&D Engineer, CEA-Leti

Bio :

David MOUSSAUD graduated from the Ecole Supérieur d'Électronique de l'Ouest (ESEO) in Angers in 2004, with a specialisation in embedded systems.
He worked as an embedded Linux engineer, first in Italy at Thales Communication, then as a consultant, in France in 2006 at Sagem Communication (Livebox products) and Nagra Kudelski (for access control of DVB decoders).
In 2008, he joined the CMMI 3 design office in Nantes, working mainly on automotive projects. He then joined a large Autosar team involved in the development of the basic softwares and the associated modelling tools. He focused mainly on the RTOS module and the integration of communication stacks.
Since 2014, he has been an R&D engineer at CEA-Leti in the wireless technologies department, in the signals, protocols and radio platforms laboratory. As a software developer, system architect or project manager, he has been involved in several projects aimed at developing wireless protocols for industrial IoT.

Abstract :

To remain competitive or to win new markets, companies need to upgrade their products, for example to simplify installation and operation, improve robustness, and/or add new functions such as remote software updates or monitoring. The use of wireless technologies is often one of the solutions needed to meet these challenges. And to make these products communicate in their environment, with the associated constraints, a communication protocol is needed. Depending on the constraints of the application and/or the operating environment, it is not always possible to identify an off-the-shelf solution or a standardized protocol that can meet the performance indicators imposed by the application. In this presentation, illustrated by several case studies, we will explain how we meet this need, and how we develop and transfer communications stacks for industrial IoT at high TRL levels.