Plenary Session

Tuesday, June 23, 2026

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Tuesday, June 23, 2026

Lab to Market with Sustainable Chips to Power the Next Wave of AI Factories

Discover sustainable semiconductor breakthroughs to guide your roadmap from lab to market and to tomorrow’s AI factory at LID World Summit 2026.

Expect a front-row look at the materials and technologies that will enable tomorrow’s devices, systems, and markets.

Join industry leaders to discover groundbreaking innovation that will help meet technological goals for the healthcare, automotive, industrial, defense, and consumer electronics sectors.

Leave with confidence in the possible.

9:00 a.m. - 10:00 a.m.

Welcome Coffee, Exhibitions & Networking

10:00 a.m. - 12:30 p.m. | Morning Session

Welcome & Introduction

Event Chair & Co-Chair

Michael Tchagaspanian

EVP, Strategic Partnerships, CEA-Leti

Susana Bonnetier

FAMES Pilot Line, CEA-Leti

 

10:05 a.m. - 10:20 a.m.
Chief Executive Officer, CEA-Leti

Sébastien Dauvé

Chief Executive Officer, CEA-Leti

10:20 a.m. - 10:35 a.m.
President & CEO, SIA

John Neuffer

President & CEO, SIA

10:35 a.m. - 10:50 a.m.
Chief Executive Officer, Rapidus Corporation

Dr. Atsuyoshi Koike

Chief Executive Officer, Rapidus Corporation

Rapidus—Accelerating cutting-edge semiconductor leadership through global collaboration... more info

10:50 a.m. - 11:05 a.m.
Senior Vice President & Executive Board Member, Murata

Takaki Murata

Senior Vice President & Executive Board Member, Murata

Silicon capacitors: a key enabler for next‑generation data center power architectures... more info

11:05 a.m. - 11:20 a.m.
Executive Officer, General Manager of Transmission Devices Laboratory, Sumitomo Electric Industries

Hajime Shoji

Executive Officer, General Manager of Transmission Devices Laboratory, Sumitomo Electric Industries

Optical device technologies toward photonics-electronics convergence... more info

11:20 a.m. - 11:35 a.m.
President & Corporate Officer, HORIBA Group

Stuart Knight

President & Corporate Officer, HORIBA Group

Sensing the semiconductor value chain: A woven, global metrology approach from materials to manufacturing... more info

11:35 a.m. - 11:40 a.m.

Get some fresh ideas: 180-second pitch by a talented young scientist

11:40 a.m. - 11:55 a.m.
Chief Technology Officer & Founder, Density AI

Bill Chang

Chief Technology Officer & Founder, Density AI

11:55 a.m. - 12:10 p.m.
Senior Vice President, Corporate Strategy & Advanced Packaging; President, Lam Capital

Audrey Charles

Senior Vice President, Corporate Strategy & Advanced Packaging; President, Lam Capital

12:10 p.m. - 12:25 p.m.
Technical Advisor, Sabi Tech Advisory LLC

Babak Sabi

Technical Advisor, Sabi Tech Advisory LLC

AI data center landscape and advanced packaging challenges... more info

12:30 p.m. - 2:30 p.m.

Lunch, Exhibitions & Networking

  • Latest Demos: Discover more than 30 live demos and network with potential partners.
  • Startups Corner: Don’t miss out on the startups corner to learn about the latest tech offers.
  • Business Meetings: Book meetings with experts to discuss your innovation project.
  • Partners Corner: Explore partners’ booth showcasing their technologies.

2:30 p.m. - 5:00 p.m. | Afternoon Session

2:35 p.m. - 2:50 p.m.

Speaker coming soon

2:50 p.m. - 3:05 p.m.
VP of Engineering, SKYWORKS

Alexandre Shirakawa

VP of Engineering, SKYWORKS

3:05 p.m. - 3:20 p.m.
Senior Executive Director, PSMC

Len Koh

Senior Executive Director, PSMC

3:20 p.m. - 3:35 p.m.
Vice President & Senior Expert, ITRI

Chih-I Wu

Vice President & Senior Expert, ITRI

The strategy of ITRI’s international collaboration: from the perspective of semiconductor ecosystem resilience... more info

3:35 p.m. - 3:40 p.m.

Get some fresh ideas: 180-second pitch by a talented young scientist

3:40 p.m. - 3:50 p.m.
Chief Executive Officer, GF

Tim Breen

Chief Executive Officer, GF

3:50 p.m. - 4:05 p.m.
Chief Executive Officer, Soitec

Laurent Rémont

Chief Executive Officer, Soitec

How advanced materials enable the AI revolution... more info

4:05 p.m. - 4:20 p.m.
Senior Vice President 3D Integration, ASML

Elliott McNamara

Senior Vice President 3D Integration, ASML

3D Integration: scaling in new ways for a new era... more info

4:20 p.m. - 4:35 p.m.
Chief Executive Officer, FMC

Thomas Rueckes

Chief Executive Officer, FMC

Towards a renewal of memory from Europe... more info

4:35 p.m. - 4:50 p.m.
Group Vice President – General Manager Central R&D, STMicroelectronics

Anton Hofmeister

Group Vice President – General Manager Central R&D, STMicroelectronics

4:50 p.m. - 5:00 p.m.
Deputy Director and Chief Technology Officer, CEA-Leti

Jean-René Lèquepeys

Deputy Director and Chief Technology Officer, CEA-Leti

5:00 p.m. - 6:00 p.m.

Coffee Break, Exhibition & Networking

Bonus: Attendees will receive the conference proceedings after the event