Plenary Session

Tuesday, June 23, 2026

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Tuesday, June 23, 2026

Lab to Market with Sustainable Chips to Power the Next Wave of AI Factories

Discover sustainable semiconductor breakthroughs to guide your roadmap from lab to market and to tomorrow’s AI factory at LID World Summit 2026.

Expect a front-row look at the materials and technologies that will enable tomorrow’s devices, systems, and markets.

Join industry leaders to discover groundbreaking innovation that will help meet technological goals for the healthcare, automotive, industrial, defense, and consumer electronics sectors.

Leave with confidence in the possible.

9:00 a.m. - 10:00 a.m.

Welcome Coffee, Exhibitions & Networking

10:00 a.m. - 12:30 p.m. | Morning Session

Welcome & Introduction

Event Chair & Co-Chair

Michael Tchagaspanian

EVP, Strategic Partnership, CEA-Leti

Susana Bonnetier

FAMES Pilot Line, CEA-Leti

 

10:05 a.m. - 10:20 a.m.
Chief Executive Officer, CEA-Leti

Sébastien Dauvé

Chief Executive Officer, CEA-Leti

Building the technological foundations of the AI century: from CEA-Leti breakthroughs to global impact... more info

10:20 a.m. - 10:35 a.m.
CEO, Semiconductor Industry Association

John Neuffer

CEO, Semiconductor Industry Association

Powering AI: the semiconductor ecosystem at the foundation of AI data centers... more info

10:35 a.m. - 10:50 a.m.
Chief Executive Officer, Rapidus Corporation

Dr. Atsuyoshi Koike

Chief Executive Officer, Rapidus Corporation

Rapidus—Accelerating cutting-edge semiconductor leadership by global collaboration... more info

10:50 a.m. - 11:05 a.m.
Senior Vice President & Executive Board Member, Murata

Takaki Murata

Senior Vice President & Executive Board Member, Murata

Silicon capacitors: a key enabler for next‑generation data center power architectures... more info

11:05 a.m. - 11:20 a.m.
Executive Officer, General Manager of Transmission Devices Laboratory, Sumitomo Electric Industries

Hajime Shoji

Executive Officer, General Manager of Transmission Devices Laboratory, Sumitomo Electric Industries

Optical device technologies toward photonics-electronics convergence... more info

11:20 a.m. - 11:35 a.m.
Materials and Semiconductor Strategy Director, HORIBA Group Corporate Officer

Stuart Knight

Materials and Semiconductor Strategy Director, HORIBA Group Corporate Officer

Sensing the semiconductor value chain: a woven, global metrology approach from materials to manufacturing... more info

11:35 a.m. - 11:40 a.m.

Get some fresh ideas: 180-second pitch by a talented young scientist

11:40 a.m. - 11:55 a.m.
Vice President & Spokesperson, Powerchip Semiconductor Manufacturing Corp. (PSMC)

Eric Tang

Vice President & Spokesperson, Powerchip Semiconductor Manufacturing Corp. (PSMC)

PSMC, Powering the AI Supply Chain... more info

11:55 a.m. - 12:10 p.m.
National Institutes of Applied Research (NIAR), Taiwan Semiconductor Research Institute (TSRI)

Kun-Lin Lin

National Institutes of Applied Research (NIAR), Taiwan Semiconductor Research Institute (TSRI)

NIAR/TSRI: A Strategic Bridge Connecting Academic Innovation and Taiwan’s Semiconductor Industry... more info

12:10 p.m. - 12:30 p.m.

Panel Session: France-Taiwan Partnerships

12:30 p.m. - 2:30 p.m.

Lunch, Exhibitions & Networking

  • Latest Demos: Discover more than 30 live demos and network with potential partners.
  • Startups Corner: Don’t miss out on the startups corner to learn about the latest tech offers.
  • Business Meetings: Book meetings with experts to discuss your innovation project.
  • Partners Corner: Explore partners’ booth showcasing their technologies.

2:30 p.m. - 5:00 p.m. | Afternoon Session

2:35 p.m. - 2:50 p.m.
Technical Advisor, Sabi Tech Advisory LLC

Babak Sabi

Technical Advisor, Sabi Tech Advisory LLC

AI data center landscape and advanced packaging challenges... more info

2:50 p.m. - 3:05 p.m.
Senior Vice President, Corporate Strategy & Advanced Packaging; President, Lam Capital

Audrey Charles

Senior Vice President, Corporate Strategy & Advanced Packaging; President, Lam Capital

From lab breakthroughs to AI factories: manufacturing the 3D future with atomic precision and intelligence... more info

3:05 p.m. - 3:20 p.m.
Co-founder, President & CTO, Density AI

Bill Chang

Co-founder, President & CTO, Density AI

3:20 p.m. - 3:35 p.m.
VP of Engineering, Skyworks Solutions

Alexandre Shirakawa

VP of Engineering, Skyworks Solutions

Steepening the Learning Curve: RF Front-End Innovation for the AI Factory Era... more info

3:35 p.m. - 3:40 p.m.

Get some fresh ideas: 180-second pitch by a talented young scientist

3:40 p.m. - 3:50 p.m.
Chief Executive Officer, GF

Tim Breen

Chief Executive Officer, GF

Shaping what comes next: human collaborative intelligence driving Europe's silicon intelligence... more info

3:50 p.m. - 4:05 p.m.
Chief Executive Officer, Soitec

Laurent Rémont

Chief Executive Officer, Soitec

How advanced materials enable the AI revolution... more info

4:05 p.m. - 4:20 p.m.
Senior Vice President 3D Integration, ASML

Elliott Mc Namara

Senior Vice President 3D Integration, ASML

3D Integration: scaling in new ways for a new era... more info

4:20 p.m. - 4:35 p.m.
Chief Executive Officer, FMC

Thomas Rueckes

Chief Executive Officer, FMC

Towards a renewal of memory from Europe... more info

4:35 p.m. - 4:50 p.m.
Group Vice President – General Manager Central R&D, STMicroelectronics

Anton Hofmeister

Group Vice President – General Manager Central R&D, STMicroelectronics

4:50 p.m. - 5:00 p.m.
Deputy Director and Chief Technology Officer, CEA-Leti

Jean-René Lèquepeys

Deputy Director and Chief Technology Officer, CEA-Leti

RESOLVE: Powering Europe’s Semiconductor Future by Accelerating Lab-to-Market Transfer... more info

5:00 p.m. - 6:00 p.m.

Coffee Break, Exhibition & Networking

Bonus: Attendees will receive the conference proceedings after the event