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April 30, 2026

#Lab-to-Market

LID World Summit 2026: Lab-to-Market Transition To Sustainable Chips Powers Next Wave of AI Factories.

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April 3, 2026

#Next-Generation AI

CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI.

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February 18, 2026

#Photonic Interposers

CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers

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VISUALS

Welcome to our media gallery. Here, you will find a selection of photos in low resolution. Please note that these photos are licensed for editorial use only, specifically for the promotion of CEA-Leti’s LID World Summit event. They may not be used for any other purpose without prior written consent.
High-resolution versions are available upon request by contacting CEA-Leti Communications Department.

Photo credit must be clearly stated as: UtopikPhoto/CEA

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