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April 30, 2026

#Lab-to-Market

LID World Summit 2026: Lab-to-Market Transition To Sustainable Chips Powers Next Wave of AI Factories.

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April 3, 2026

#Next-Generation AI

CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI.

Credits:Olivier-Glorieux-Ludovic-Couture

June 15, 2026

#FeRAM 22 nm

​​​​​​Breakthrough Reported at VLSI 2026 Also Extends to High-Performance Computing, Aerospace & Defense Systems, and IoT Platforms​.

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