Bio:

Elliott Mc Namara is a Senior Vice President and current Head of ASML's 3D Integration business which was created in 2025. Elliott has built up a broad knowledge of the semiconductor environment with more than 25 years of experience covering technology development, semiconductor process control, product management for Lithography and Metrology systems across ASML’s businesses.
Elliott started his semiconductor career working for Canon Semiconductor in Japan after finishing his studies at the University of Limerick in Ireland. He later returned to Ireland and spent time working as a process engineer with Intel before joining ASML in 2007.
In his current role Elliott and his team are responsible for developing innovative solutions for Advanced Packaging customers to address their challenges today and in the future.

Abstract:

AI is everywhere, requiring more data ingestion and compute than ever, accelerating scaling of transistor density. Traditional device scaling faces increasing physical, economic, and system level limitations, the semiconductor industry is entering a new era in which progress must be enabled through architectural innovation and advanced integration. 3D integration has emerged as a key enabler of this transition, redefining how performance, power, density, and functionality are delivered at the system level.
As advanced packaging and 3D Integration become critical in the era of AI, innovating to address the key challenges in this new environment are key to scaling and volume. Advanced packaging customers are searching for innovation and looking to front-end know-how in equipment, materials and process control to enable fine-pitch integration at high throughput. This talk will address the lithography innovation roadmap catering to the technical challenges while being mindful of the economics in backend integration,