Shaping What’s Next

Thursday, June 25, 2026

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Thursday, June 25, 2026

Tech Talks: flagship partner programs

Technology leaders will showcase advances accelerating integrated circuit innovation, from breakthrough devices to advanced manufacturing.

Building on these trends, CEA-Leti will highlight its flagship multi-partner programs—microLED technologies for data communications, quantum cascade laser solutions for glycemia monitoring, radio-frequency sensing of dielectric parameters, and sustainable cleanroom approaches—providing  practical insights to sharpen strategies.

8:30 a.m. - 9:30 a.m.

Welcome Coffee, Exhibitions & Networking

9:30 a.m. - 12:00 p.m. | Morning Session

Welcome & Introduction

Event Chair & Co-Chair

Michael Tchagaspanian

EVP Strategic Partnerships, CEA-Leti

François Legrand

Communication Manager, IRT Nanoelec

 

9:30 a.m. - 9:45 a.m.
President & CEO, Tohoku-MicroTec

Makoto Motoyoshi

President & CEO, Tohoku-MicroTec

T-Micro's 3D-IC technology... more info

9:45 a.m. - 10:00 a.m.
CTO, XIVER

Joost van Beek

CTO, XIVER

Thinking big on a micro-scale: How XIVER bridges innovation and volume manufacturing... more info

10:00 a.m. - 10:10 a.m.
Deputy Head of Sustainable Electronics Program, CEA-Leti

Cindy Liotard

Deputy Head of Sustainable Electronics Program, CEA-Leti

CEA-Leti Multilateral Program: Driving sustainable and cost-efficient semiconductor manufacturing

10:10 a.m. - 10:25 a.m.
CEO, Agileo Automation

Marc Engel

CEO, Agileo Automation

Bridging the data gap: Why EDA standardized acquisition is now mandatory from front-end to advanced packaging... more info

10:25 a.m. - 10:40 a.m.
Microelectronics global account manager, Keysight Technologies

Guillaume Granet

Microelectronics global account manager, Keysight Technologies

Beyond bandwidth: the hidden constraints shaping AI infrastructure... more info

10:40 a.m. - 10:50 a.m.
RF & Telecommunications Industrial Partnership Manager, CEA-Leti

Swan Gerome

RF & Telecommunications Industrial Partnership Manager, CEA-Leti

CEA-Leti Multilateral Program: Enabling RF sensing of dielectric parameters with a miniaturized vector network analyzer... more info

10:50 a.m. - 11:05 a.m.
Senior Sales Account Manager, ACCRETECH Europe

Jérôme Boutant

Senior Sales Account Manager, ACCRETECH Europe

Driving backend efficiency – automation in wafer probing and dicing... more info

10:05 a.m. - 11:20 a.m.
Senior Scientist, Rigaku Europe SE

Artem Shalimov

Senior Scientist, Rigaku Europe SE

Advancing full‑wafer XRD metrology with the Rigaku TFXRD series... more info

11:20 a.m. - 11:35 a.m.
Metrology Director, Camtek Metrology

Roy Pinhassi

Metrology Director, Camtek Metrology

Metrology Solutions in Advanced Packaging for 2026 and beyond... more info

11:35 a.m. - 11:50 a.m.
Director, Semiconductor Sales, Thermo Fisher Scientific

Andres Fayt

Director, Semiconductor Sales, Thermo Fisher Scientific

Enabling reliable AI hardware: overcoming challenges in advanced packaging and beyond... more info

11:50 a.m. - 12:00 p.m.
Optical Sensors Industrial Partnership Manager, CEA-Leti

Vincent Destefanis

Optical Sensors Industrial Partnership Manager, CEA-Leti

CEA-Leti Multilateral Program: shaping the future of non-invasive glucose monitoring with quantum cascade laser photoacoustic technology... more info

More on our other speakers coming soon !

12:00 p.m. - 02:30 p.m.

Lunch, Exhibitions & Networking

  • Latest Demos: Discover more than 30 live demos and network with potential partners.
  • Startups Corner: Don’t miss out on the startups corner to learn about the latest tech offers.
  • Business Meetings: Book meetings with experts to discuss your innovation project.
  • Partners Corner: Explore partners’ booth showcasing their technologies.

Bonus: Attendees will receive the conference proceedings after the event