Speakers
Michael Tchagaspanian
EVP Strategic Partnership, CEA-Leti
Michael Tchagaspanian
EVP Strategic Partnership, CEA-Leti
Susana Bonnetier
FAMES Pilot Line Open Access Chairperson, CEA-Leti
Susana Bonnetier
FAMES Pilot Line Open Access Chairperson, CEA-Leti
Bio:
Susana Bonnetier is a member of the FAMES Pilot Line management team and leads the Open Access effort with the goal of making « European-grown » advanced semiconductor technologies readily accessible to industry and academia.
An MIT engineer with a background in industry and research in the USA and France, Susana puts all her energy into transferring technological innovation to companies.
Born in Venezuela, Susana spent 9 years in the USA, where she completed her higher education and worked for General Electric Aircraft Engines, designing and building aircraft engines.
In 1991, Susana joined Saint-Gobain in France, first in the Industrial Strategy and Planning department working with 20 manufacturing plants to streamline and modernize their operations, and then at Saint-Gobain Cristaux et Détecteurs as Product and Industrial Market Manager, significantly increasing the profitability of a scintillation detectors product line.
In 2001, she moved to Grenoble, “the land of nano and micro technologies”, and reoriented her career towards the semiconductor industry. She joined Freescale as R&D Engineer and contributed to the successful development of the 65nm and 45nm CMOS technology nodes by the Crolles 2 Alliance.
In 2007, Susana joined CEA-Leti, first as head of a joint laboratory between Leti and a major French optics company, and later as Leti’s Carnot program manager, piloting a 14M€ R&D budget within Leti’s Scientific Directorate. During that time, she was VP of the Carnot Network and a member of its board of directors.
Susana brings a solid industrial and R&D experience to the FAMES Pilot Line project and the aim of contributing to the construction, in concert with the FAMES European Partners and the complementary Chips Act Pilot Lines, of a pan-European semiconductor ecosystem with the best Europe has to offer in microelectronics technologies.
Abstract:
The open-access concept of the FAMES pilot line project continues to be a key annual meeting point.This presentation will assess the responses to the 2025 call for proposals, introduce newly opened topics for 2026, and outline participation pathways. It will also feature a dedicated focus on the availibility of pathfinding design kit to evaluate the performance of the 10nm FD-SOI CMOS technology.
Sébastien Dauvé
Chief Executive Officer, CEA-Leti
Sébastien Dauvé
Chief Executive Officer, CEA-Leti
Bio:
Sébastien Dauvé was named CEO of CEA-Leti effective on July 1, 2021, after more than twenty years of experience in microelectronics technologies and their applications, including clean mobility, medicine of the future, cybersecurity, and power electronics.
Sébastien Dauvé started his career at the French Armament Electronics Center, where he worked on developing synthetic-aperture radar. In 2003, he joined CEA-Leti as an industrial transfer manager and supervised several joint research laboratories, in particular with the multinational Michelin.
In 2007, Sébastien Dauvé became a laboratory manager, then head of an R&D department in the area of sensors applied to the Internet of things and electric mobility. During this time, he supported the dissemination of new technologies in industry, including the automotive industry (Renault), aeronautics, national defense (SAFRAN), and microchips with the industry leader Intel. He played an active role in the creation of start-ups in application fields ranging from health to infrastructure security, leading to dozens of new jobs. In 2016, he became Director of the CEA-Leti Systems Division.
From sensors to wireless communication, Sébastien Dauvé has played an active role in the digital transformation, focused on coupling energy frugality and performance. He has made cross-disciplinary approaches central to innovation by harnessing the expertise of talented teams with diverse backgrounds. Their goal is to provide technological tools for meeting the major societal challenges of the future.
Sébastien Dauvé is a graduate of the French Ecole Polytechnique and the National Higher French Institute of Aeronautics and Space (ISAE-SUPAERO).
Abstract:
As artificial intelligence reshapes industries and societies, the technologies enabling this transformation are becoming strategic foundations for the decades ahead. In this keynote, CEA-Leti will highlight how its latest breakthroughs in semiconductors, photonics, sensing, and heterogeneous integration are helping build the technological backbone of the AI century.
From energy-efficient computing to next-generation architectures, these innovations are accelerating transformation across data centers, edge systems, healthcare, mobility, and industry. This talk will explore how breakthrough deep-tech innovation can scale in France and beyond borders, enabling international partnerships and creating lasting global impact in the future AI-driven economy.
John Neuffer
CEO, Semiconductor Industry Association
John Neuffer
CEO, Semiconductor Industry Association
Bio:
John Neuffer is President and CEO and ex officio board member of the Semiconductor Industry Association (SIA), which has been the voice of the chip industry for nearly five decades. He has been at the nexus of technology, public policy, and trade for most of his career. Since joining SIA in 2015, John has led the association’s policy advocacy in Washington and capitals around the world to foster growth and innovation in semiconductor design, manufacturing, and research.
John also serves as a member of the Board of Directors of the Semiconductor Research Corporation, the world’s leading non-profit industry-government-academia microelectronics research consortium. Additionally, he is a member of the Science & Technology Action Committee and the Council on Foreign Relations.
Abstract:
Semiconductors are the foundational technology enabling artificial intelligence (AI), underpinning modern systems and driving transformative gains in productivity, innovation, and scientific discovery. Today’s AI infrastructure reflects decades of advances from across the semiconductor ecosystem, with a single AI server rack containing over 4,500 packaged chips—comprising roughly 20,000 individual dies—and chips accounting for more than 95% of rack value and over half of total data center capital expenditures. AI workloads depend on the full stack of semiconductor technologies—including advanced logic, memory, and analog components—making supply chain resilience across all chip categories critical to systained AI deployment.
Dr. Atsuyoshi Koike
Chief Executive Officer, Rapidus corporation
Dr. Atsuyoshi Koike
Chief Executive Officer, Rapidus corporation
Bio:
ATSUYOSHI KOIKE established Rapidus Corporation, a company that researches, develops, designs, manufactures, and sells advanced logic semiconductors, in August 2022.
Prior to the current role, Koike had served as President of Western Digital Japan since April 2018. Prior to joining Western Digital, he served as corporate chief engineer for Renesas Technology Corporation. Previously, he held the position of president and chief executive officer, as well as other senior leadership positions at Trecenti Technologies, Inc. Prior to that, he held senior manufacturing management and executive leadership positions at Hitachi, Ltd.
Koike received the B.S. and M.S. in Materials Science and Engineering from Waseda University and Ph.D. in Electronic Engineering from Tohoku University. He is a Professor at Tohoku University and Special Senior Advisor at New Industry Creation Hatchery Center, and has given lectures at the University of Tokyo.
Abstract:
Dr. Koike will share how Rapidus is establishing a new manufacturing model centered on 2nm production in Japan, built on close collaboration with world class research institutions and industrial partners. How Rapidus is working with imec , IBM, and a growing ecosystem of European organizations demonstrates that advanced semiconductor development is a global platform. He will discuss how Rapidus aims to strengthen technical exchange with European partners, enhance supply chain interoperability, and contribute to a more geographically balanced and secure semiconductor landscape.
Takaki Murata
Senior Vice President & Executive Board Member, Murata
Takaki Murata
Senior Vice President & Executive Board Member, Murata
Bio:
Takaki Murata has been involved in technology development, accounting, planning, and business management at the Company and its group companies for many years and corporate management as a chief officer at business companies in the United States, accumulating a wealth of experience and a solid record of achievement. He has been elected as a Member of the Board of Directors because the Company expects that he will continue to strengthen the decision-making and supervisory functions of the Board of Directors.
Abstract:
The rapid scaling of AI and high‑performance computing workloads is driving a fundamental transformation of data center power architectures, from on‑package integrated voltage regulators to high‑voltage power supply units. In this context, passive components are no longer commodities but critical system enablers.
This presentation introduces Murata’s silicon capacitor technologies and roadmaps, highlighting how continuous innovations in three‑dimensional charge density, voltage capability, and reliability unlock new design spaces for advanced power delivery. Leveraging deep‑trench and nanoporous architectures, Murata silicon capacitors combine ultra‑low ESL/ESR, exceptional thermal and frequency stability, predictable aging, and high customization flexibility.
We will illustrate how these characteristics enable thin, high‑frequency integrated voltage regulator modules close to processors, as well as high‑voltage silicon capacitors for next‑generation data center power supplies operating up to 800V nominal.
Hajime Shoji
Executive Officer, General Manager of Transmission Devices Laboratory, Sumitomo Electric Industries
Hajime Shoji
Executive Officer, General Manager of Transmission Devices Laboratory, Sumitomo Electric Industries
Bio:
Hajime Shoji received the Ph.D. degree in electronic engineering from the University of Tokyo, and joined Fujitsu Laboratories in 1990. He moved to Eudyna Devices, a joint venture of Fujitsu and Sumitomo Electric in 2004, then after the change in organization, moved to Sumitomo Electric Industries, LTD. in 2009. He has been consistently leading the development of compound semiconductor materials and devices for optical and microwave communications. Currently, he is serving as a general manager of the Transmission Devices Laboratories, and also as an executive officer of Sumitomo Electric.
Abstract:
Optical device technologies play a fundamental role in combination with electronics toward photonics-electronics convergence. In the presentation, our development activities focusing on heterogeneous integration of III-V compound semiconductor and silicon and its application to advanced optical devices will be described. Photonics-electronics integration platform technologies will be also presented together with topics on some related devices.
Stuart Knight
Materials and Semiconductor Strategy Director, HORIBA Group Corporate Officer
Stuart Knight
Materials and Semiconductor Strategy Director, HORIBA Group Corporate Officer
Bio:
Stuart Knight is Materials and Semiconductor Strategy Director and HORIBA Group Corporate Officer, with more than three decades of experience in the global semiconductor industry. He began his career in 1992 in Hong Kong, working for a back‑end semiconductor equipment manufacturer, gaining first‑hand experience of high‑volume manufacturing environments in South East Asia.After returning to Europe in 1998, Stuart joined HORIBA, where he helped establish and grow the company’s semiconductor portfolio, delivering process monitoring and control solutions for semiconductor process optimisation to customers across Europe and globally. He spent many years building HORIBA’s presence in the semiconductor segment before moving into senior executive leadership.
Today, Stuart contributes actively to European and global semiconductor strategy for the HORIBA Group, bringing a practical, manufacturing‑led perspective to industry discussions
Abstract:
The semiconductor industry is increasingly defined by system level complexity, where performance, yield, and sustainability depend on the ability to sense, measure, and control interactions across the entire value chain.
HORIBA addresses this challenge through a woven value chain of sensing and metrology solutions, connecting materials characterization, process monitoring, device performance, and fab and sub fab environments. Built on decades of expertise in analytical instrumentation and supported by a strong global footprint, this integrated approach enables continuous insight from upstream R&D to high volume manufacturing.
By connecting core technologies, product organizations, and global operations, sensing and metrology emerge as a strategic enabler for innovation, yield, and industrial resilience. This integrated approach illustrates how semiconductor leaders can shape scalable growth, accelerate technology adoption, and support a more sustainable semiconductor ecosystem.
Eric Tang
VP & Spokesperson, Vice President & Spokesperson, Powerchip Semiconductor Manufacturing Corp. (PSMC)
Eric Tang
VP & Spokesperson, Vice President & Spokesperson, Powerchip Semiconductor Manufacturing Corp. (PSMC)
Bio:
Eric Tang is the Vice President and Spokesperson of Powerchip Semiconductor Manufacturing Corp. (PSMC). He also serves as an Independent Director of Micro Silicon Electronics Co., Ltd. His professional activities extend across various semiconductor industry associations and institutional committees, holding positions as a Director for the Taiwan AI Communication and Information Association and as a Supervisor for the Taiwan Advanced Automotive Technology Development Association. Additionally, Mr. Tang serves as an examinant for technological programs under Taiwan's Ministry of Economic Affairs and the National Science and Technology Council. His prior career includes executive roles within the Powerchip Group, Vice President of UMAX Computer, Inc., and Editor-in-Chief of Electronic Engineering Times Taiwan. He holds an MBA from National Taiwan University.
Abstract:
PSMC is redefining the AI era through its Open Foundry strategy, fostering international collaboration and flexible manufacturing. Our mission is to help global talents bridge the gap between innovation and commercial success.
Our growth is driven by three core pillars:
• 3D AI Foundry: Utilizing 3D Wafer-on-Wafer (WoW) technology to break the "Memory Wall."
• Memory: Providing customized DRAM solutions optimized for AI performance.
• Logic Foundry: Delivering essential specialty chips that power the AI ecosystem.
By offering an open, adaptive platform, PSMC serves as the vital foundation for transforming global AI concepts into physical reality.
Kun-Lin Lin
Deputy Director, National Institutes of Applied Research (NIAR), Taiwan Semiconductor Research Institute (TSRI)
Kun-Lin Lin
Deputy Director, National Institutes of Applied Research (NIAR), Taiwan Semiconductor Research Institute (TSRI)
Bio:
Dr. Kun-Lin Lin currently serves as Deputy Director and Group Leader of the Materials Analysis Division at the Taiwan Semiconductor Research Institute (TSRI), part of the National Institutes of Applied Research (NIAR). He leads multidisciplinary teams focused on next-generation semiconductor manufacturing and advanced characterization technologies. With more than two decades of experience spanning both industry and national research laboratories—including positions at Inotera Memories and TSRI—Dr. Lin specializes in bridging academic innovation with industrial semiconductor applications within Taiwan’s semiconductor ecosystem.
Abstract:
As the semiconductor industry enters the AI and Angstrom-scaling era, TSRI serves as Taiwan’s national platform connecting academia and industry. TSRI provides open-access nanofabrication, IC design, advanced packaging, and materials analysis services, while supporting startup field validation and accelerating innovation from research to industrial application.
Babak Sabi
Technical Advisor, Sabi Tech Advisory LLC
Babak Sabi
Technical Advisor, Sabi Tech Advisory LLC
Bio:
Dr. Babak Sabi Founder & Principal, Sabi Tech Advisory LLC
Dr. Babak Sabi is a veteran of the semiconductor industry with a career spanning more than four decades of technical and executive leadership. As the Founder of Sabi Tech Advisory LLC, he provides strategic counsel to global technology firms at the intersection of silicon manufacturing, advanced packaging, and cloud-scale AI infrastructure. Dr. Sabi’s career is defined by his long-standing tenure at Intel Corporation, where he served in several of the company’s most critical technical and operational roles. As Senior Vice President and General Manager of Assembly Test Technology Development (ATTD), he led the industrialization of the industry’s first 2.5D and 3D heterogeneous integration technologies. Crucially, Dr. Sabi also held a primary leadership role within Intel’s Corporate Quality Network (CQN). In this capacity, he was responsible for the rigorous quality and reliability standards required for high-volume manufacturing across multiple process nodes. Following his 40-year career at Intel, Dr. Sabi most recently served as Vice President of Technology at AWS (Annapurna Labs), where he oversaw the hardware engineering requirements for the world’s largest cloud infrastructure.
Abstract:
Hyperscalers are changing the landscape for chip development with specialized custom chips. They are becoming more vertically integrated. Additionally future challenges of Advanced Packaging are discussed.
Audrey Charles
Senior Vice President of Corporate Strategy & Advanced Packaging; President of Lam Capital
Audrey Charles
Senior Vice President of Corporate Strategy & Advanced Packaging; President of Lam Capital
Bio:
Audrey Charles is senior vice president of corporate strategy and advanced packaging, and president of Lam Capital at Lam Research. In this position, she is responsible for leading the executive management team in the development of strategic priorities and key initiatives that support the company’s long-term profitable growth. She is also responsible for accelerating the company’s market-leading position in advanced packaging to deliver differentiated technology and support to customers.
Additionally, Audrey oversees Lam’s Corporate Development team and investment arm, Lam Capital, which invests in disruptive companies that advance the semiconductor ecosystem through next generation industrial automation, technology and product innovation, and new market opportunities. She brings a broad base of experience to her role, including engineering, customer technology management and investor relations. Since joining Lam in 1995, she has served in a range of leadership positions including senior vice president of Global Human Resources and vice president of corporate initiatives.
Audrey earned an M.B.A. from the MIT Sloan School of Management and a B.S. in applied physics from Dublin City University.
Abstract:
AI system performance increasingly depends on advanced 3D packaging. Hybrid bonding, chiplets, and heterogeneous integration deliver the bandwidth and energy efficiency that define next-generation AI architectures. The challenge is advancing these technologies from research into high-volume manufacturing at the yield, quality, and cost targets production demands.
Bridging this gap requires two capabilities: atomic-precision processing and data-driven manufacturing intelligence. This talk will examine how these capabilities address the core manufacturing challenges of 3D integration, including atomic-level film quality, defectivity management, and process integration across diverse materials systems, and how together they accelerate yield learning, optimize process windows, and compress the timeline from development to production.
Bill Chang
Co-founder, President & CTO, Density AI
Bill Chang
Co-founder, President & CTO, Density AI
Bio:
Bill Chang is the Co-founder, President, and Chief Technology Officer of DensityAI, a company focused on making AI infrastructure radically more efficient and sustainably scalable, by building the world's densest AI compute platform, integrating innovations across technology, chip and system architecture, software, and datacenter infrastructure.
Prior to founding DensityAI, Chang served as Chief System Architect at Tesla, where he was responsible for the design and architecture of the Dojo supercomputer, a vertically integrated high-performance AI training system. He led the development of the first production wafer-scale package technology, enabling machine learning training to scale to exaFLOP levels.
Before Tesla, Chang was at Apple, where he managed the transition of the Mac platform to Apple Silicon. Earlier in his career, he held various technical leadership roles at IBM Microelectronics spanning DRAM, CMOS technology development, and manufacturing, building deep expertise in silicon design and semiconductor process engineering.
Alexandre Shirakawa
VP of Engineering, Skyworks Solutions
Alexandre Shirakawa
VP of Engineering, Skyworks Solutions
Bio:
Alexandre Shirakawa is Vice President of Engineering at Skyworks Solutions, where he leads the acoustic RF filter technologies. His work spans bulk acoustic wave (BAW) and surface acoustic wave (SAW) platforms, with a focus on enabling future connectivity applications. With over two decades of experience in RF and acoustic technologies, Alexandre has held senior engineering leadership roles at Skyworks, Qualcomm, and Broadcom (Avago Technologies), driving technology roadmaps from early research through high volume manufacturing. He began his career at CEA Leti, working at the intersection of device physics and system integration.
Abstract:
RF front-end innovation sits on both sides of the AI factory transformation: it enables the robust, low-latency, energy-efficient connectivity required by sensor-rich, automated manufacturing environments, while also benefiting from AI factories as learning engines for semiconductor commercialization. As AI factories scale, dense networks of tools, robots, sensors, edge devices, and control systems will place new demands on RF front-end performance, integration, coexistence, and reliability. At the same time, RF front-end products must move rapidly from lab breakthroughs in materials, processes, design, and packaging to high-volume manufacturing, especially in mobile markets where product lifecycles are compressed and much of the lifetime volume is produced early in the ramp. This keynote will explore how AI-enabled data loops across design, simulation, process, equipment telemetry, metrology, test, reliability, and failure analysis can steepen the RF yield-learning curve, reduce scrap, shorten qualification cycles, and improve the sustainability of semiconductor commercialization
Tim Breen
Chief Executive Officer, GF
Tim Breen
Chief Executive Officer, GF
Bio:
Tim Breen is Chief Executive Officer (CEO) of GF, a position he was appointed to in 2025, having joined the company in 2018.
Prior to becoming CEO, Mr. Breen served as GF’s Chief Operating Officer (COO), overseeing the company’s global operations, including the manufacturing, quality, supply chain and digital transformation teams. Earlier in his tenure at GF he held various executive roles including leading strategy, business transformation and finance. Prior to joining GF, Mr. Breen served as a member of the senior leadership team of GF’s founding shareholder, Mubadala Investment Company (Mubadala). Earlier in his career, he was a partner with McKinsey & Company in Abu Dhabi.
Mr. Breen holds a Master of Business Administration degree from London Business School and is based in New York.
Laurent Rémont
Chief Executive Officer, Soitec
Laurent Rémont
Chief Executive Officer, Soitec
Bio:
Laurent Rémont joined Soitec in March 2026 and formally took up the position of Chief Executive Officer on 1 April, 2026.
Laurent Rémont served as Senior Vice President and General Manager of MEMS and Magnetics at Infineon Technologies, a leading integrated semiconductor manufacturer, which he joined in 2019. He has also led the Group's Radio Frequency and Sensors business, covering a portfolio that included sensors, radars, microphones and RF components, as well as systems and IoT innovation activities.
Before joining Infineon, he was Chief Technology Officer (CTO) and executive committee member at Kontron AG, an international specialist in industrial IoT solutions and embedded systems.
He began his career at Philips, before spending more than fifteen years at STMicroelectronics, where he held various general management positions in the Connected Home division, as well as in R&D, embedded systems, product development and operational unit management.
Laurent Rémont holds an engineering degree from Grenoble INP – ENSERG
Abstract:
The semiconductor industry has entered a new system architecture era driven by the three waves of AI: Generative, Agentic, and Physical. As compute demand scales, traditional silicon infrastructure is hitting critical bottlenecks that require material-led innovation. To break through the bandwidth wall and prevent copper links from consuming unsustainable power, the industry must transition to silicon photonics, migrating Co-Packaged Optics directly onto the interposer to achieve extreme shoreline densities. Simultaneously, with AI rack power scaling toward extreme levels, upgrading bulk silicon with engineered Wide-Bandgap substrates like Silicon Carbide and Gallium Nitride is vital to achieve maximum data center efficiency.
Finally, tackling the severe standby leakage of advanced sub-nanometer nodes in battery-constrained Physical AI devices requires a decisive architectural choice, pitting FD-SOI against advanced FinFET configurations. Ultimate AI scaling will be won through substrate-engineered innovation.
Elliott Mc Namara
Senior Vice President 3D Integration, ASML
Elliott Mc Namara
Senior Vice President 3D Integration, ASML
Bio:
Elliott Mc Namara is a Senior Vice President and current Head of ASML's 3D Integration business which was created in 2025. Elliott has built up a broad knowledge of the semiconductor environment with more than 25 years of experience covering technology development, semiconductor process control, product management for Lithography and Metrology systems across ASML’s businesses.
Elliott started his semiconductor career working for Canon Semiconductor in Japan after finishing his studies at the University of Limerick in Ireland. He later returned to Ireland and spent time working as a process engineer with Intel before joining ASML in 2007.
In his current role Elliott and his team are responsible for developing innovative solutions for Advanced Packaging customers to address their challenges today and in the future.
Abstract:
AI is everywhere, requiring more data ingestion and compute than ever, accelerating scaling of transistor density. Traditional device scaling faces increasing physical, economic, and system level limitations, the semiconductor industry is entering a new era in which progress must be enabled through architectural innovation and advanced integration. 3D integration has emerged as a key enabler of this transition, redefining how performance, power, density, and functionality are delivered at the system level.
As advanced packaging and 3D Integration become critical in the era of AI, innovating to address the key challenges in this new environment are key to scaling and volume. Advanced packaging customers are searching for innovation and looking to front-end know-how in equipment, materials and process control to enable fine-pitch integration at high throughput. This talk will address the lithography innovation roadmap catering to the technical challenges while being mindful of the economics in backend integration,
Thomas Rueckes
Chief Executive Officer, FMC
Thomas Rueckes
Chief Executive Officer, FMC
Bio:
Thomas Rueckes is CEO of Ferroelectric Memory Company (FMC), where he leads the development and commercialization of high-performance non-volatile memory products spanning NV-DRAM+ in Memory Fabs and high density Near Compute Memory, 3D-CACHE+ in advanced logic foundries. His work bridges materials, devices, integration, packaging, and system-level deployment, with active engagement across tier-1 memory IDMs, hyperscalers, OEMs, and leading equipment and materials suppliers.
Previously, Dr. Rueckes was Co-Founder, CTO, and COO of Nantero, where he spent more than two decades building one of the industry’s most advanced emerging memory platforms, overseeing R&D, operations, manufacturing scale-up, IP strategy, fundraising, government programs, and strategic partnerships. He holds more than 200 granted patents and has published extensively in leading scientific journals. Dr. Rueckes earned his Ph.D. in Nanotechnology from Harvard University.
Abstract:
Europe stands at a pivotal moment in reasserting its role in the global memory industry. Advances in materials science, device engineering, and semiconductor integration now enable the development of disruptive memory technologies that can meet the demands of next generation Artificial Intelligence—delivering lower energy consumption, higher density, and superior performance. FMC, positioned at the heart of Europe’s semiconductor R&D centers, is executing an ambitious, scalable product roadmap designed to reshape the memory landscape. Working in close partnership with leading industrial, research/technology, and institutional stakeholders across the European ecosystem, FMC is advancing a technology platform capable of supporting strategic sovereignty and long term competitiveness. The current environment offers a rare and timely opportunity for Europe to establish a new class of memory technology and a globally competitive memory champion.
Anton Hofmeister
APMS Group Vice President-General Manager Central R&D, STMicroelectronics
Anton Hofmeister
APMS Group Vice President-General Manager Central R&D, STMicroelectronics
Bio:
Anton Hofmeister is Group Vice President and General Manager of R&D and Strategy for ST’s Analog and MEMS Sub-Groups and has held this position since December 2021. He has also served as Managing Director of ST's German subsidiary since 2016.
Hofmeister joined Thomson Semiconductors (a predecessor company to STMicroelectronics) in Munich as product marketing engineer in 1986. He subsequently held management positions in product marketing, key account management, and corporate strategic marketing. In 1997, Hofmeister was appointed Director of a System R&D team in San Diego, USA, and became Director of the Print Head Business Unit in 2000. In 2005, he was appointed General Manager of the Microfluidics Division and has broadened his responsibility with the MEMS Actuator Division in 2015, a role he kept until December 2021. During his career, Hofmeister worked for ST in Germany, France, USA and Italy, his current location.
Hofmeister has previously served as a board member of the Singapore-based Molecular Diagnostics company Veredus Laboratories. He is part of the Governing Council of the MEMS&Sensor Industry Group (MSIG) at SEMI and a member of the Board of the European Association on Smart Systems Integration (EPoSS).
Jean-René Lèquepeys
Deputy Director and Chief Technology Officer, CEA-Leti
Jean-René Lèquepeys
Deputy Director and Chief Technology Officer, CEA-Leti
Bio:
Jean-René Lèquepeys received an engineering degree in 1983 from CentraleSupélec, a top French graduate engineering school at Paris-Saclay University, France. He taught physics during 2 years in Ouarzazate, Morocco.
He joined CEA, a French Research and Technology Office focusing on applied research, in Paris Saclay in 1985. He first worked at the laboratory of the Central Security Office, on the evaluation of means of detection and intrusion. Two years later, he was promoted head of this laboratory.
In 1993, he moved to Grenoble, France, and joined the System Division of CEA-Leti. He worked on different projects in the field of image processing and telecommunication technologies. In particular, he was responsible for the "Telecom, Communicating Objects and Smart Card" programs from 1999 to 2004.
In 2005, he took the responsibility of the Circuits Design Division at CEA-Leti (200 people). He launched new research activities at CEA such as a new laboratory in Aix-en-Provence, France, on the development of secured chips. In 2000, Jean-René Lèquepeys received the prestigious award from the french Société de l'Electricité, de l'Electronique et des technologies de l'information et de la communication (SEE) "Grand Prix de l'électronique Général Ferrié" for his work in the telecommunications field (he holds 15 patents).
In 2010, he launched a new division at CEA focusing on Electronic Architectures, Integrated Circuit Design and Embedded Software. He established the structure on two sites (Paris and Grenoble) and led the division twice in his career.
He rapidly got involved in the creation of the Silicon Components Division at CEA-Leti, and took the lead of it in 2011 managing 350 people. Division encompasses micro and nanoelectronics (SOI, nanodots, quantum, memories, 3D technologies, substrates), Micro Systems (sensor, actuator, radiofrequency components) and Power Components. He established the French Nano2022 Program for research funding in microelectronics.
In 2019, he was appointed Chief Technology Officer of CEA-Leti, overseeing Science, relations with the European Commission, Industrial Partnership and Strategic Program Management in the scope of the institute (2,000 people, ~€350m budget). He took the responsibility of the Microelectronic Program at CEA level, spearheading technological and upstream research in the field of semiconductor technologies. For the past 2 years, he has been strongly involved in the CEA-Leti Next Gen FD-SOI project in the frame of France2030 and has played a key role in European chips Act pilot line promoting FD-SOI and Gate All Around technologies.
Having dedicated his career to applied research, he is regularly invited as a keynote speaker in international semiconductor conferences.
Jean-René is also Vice President of ACSIEL, a professional trade union gathering industrial companies in the French electronic value chain, member of the Board of EPOSS, the European Technology Platform on Smart Systems Integration, a member of the Board of AENEAS, the Association for Europoean NanoElectronics Activities, and an expert consultant for the European Commission and French Research Agency
Abstracts:
Plenary Session
CEA-Leti contributes to Europe’s semiconductor ambitions through RESOLVE, an initiative supporting the objectives of the European Chips Act by accelerating the transfer of breakthrough technologies from research to industrial deployment.
RESOLVE strengthens collaboration between research centers, startups, suppliers, and industrial leaders to shorten innovation cycles and enable faster market adoption. Leveraging CEA-Leti’s expertise in advanced semiconductor technologies, the initiative supports pilot lines, shared platforms, and technology validation frameworks.
This talk will present how RESOLVE helps build a stronger European semiconductor ecosystem by turning research excellence into industrial competitiveness and strategic sovereignty.
The RESOLVE Initiative Conference
This presentation will provide an update on the RESOLVE initiative and highlight the progress made in bringing together Research and Technology Organizations (RTOs) across all Europe and industrial partners to define a common vision for Europe’s semiconductor future. RESOLVE is a uniquely inclusive European initiative, uniting research organizations from nearly 20 EU Member States to ensure broad collaboration across the continent. In the context of the forthcoming Chips Act 2, the initiative focuses on fostering breakthrough technological innovation through close cooperation between research and industry and addresses key challenges such as energy efficiency, next generation of AI chips, European sovereignty in leading-edge technologies to strengthen Europe’s key vertical markets. Ultimately, this collective effort aims to position Europe as a global leader in semiconductor technologies and will contribute to the increase of semiconductor production in Europe.
Data & Network/Cloud Convergence
Hakima Chaouchi
Full Professor and Head of Digital Sovereignty and Sobriety Strategy, Institut Mines Telecom
Hakima Chaouchi
Full Professor and Head of Digital Sovereignty and Sobriety Strategy, Institut Mines Telecom
Bio:
Hakima Chaouchi is a Full Professor at Telecom SudParis – Institut Polytechnique de Paris. Following her PhD from Sorbonne University and King’s College London, she has dedicated 25 years of research to the optimization of wireless and mobile networks, the Internet of Things (IoT), cybersecurity, 5G/6G networks, and emerging concepts such as N3C and the digital continuum. For the past two years, she has served as the Head of Strategy for Digital Sovereignty and Sobriety at Institut Mines-Télécom, she is a member of the ASIC national research program agency of the high minitry of research and education and space (MESRE), specifically for the networks and digital continuum axis. As a former Scientific Advisor to the French Ministry of Higher Education and Research (MESRE), where she played a key role contributing to the structuring of the French academic research under the France 2030 initiative (specifically the Cyber, Cloud, and Telecom research, innovation and competences programs). She also contributed to both the national and European (ESFRI) roadmaps for digital research infrastructures. An expert in European networking and telecom working groups, she is the Vice-Chair of the States Representatives Group for the European JU SNS (Smart Networks and Services) and Chairs the Intermediary Supervisory Board of the ESFRI SLICES research infrastructure. Highly active in global standardization, she has chaired several ITU-T focus groups on data management and eco-responsible AI, while contributing to IETF and ETSI working groups. She currently leads the France 6G national mission, focusing on the 6G R&D ecosystem and the standardization engagement within the French national strategy for the 5G and Future Networks acceleration coordinated by the general directorate of entreprises (DGE).
Hughes Metras
Director of ASIC, Component and Digital Infrastructure French Program Agency
Hughes Metras
Director of ASIC, Component and Digital Infrastructure French Program Agency
Bio:
Hughes Metras has been appointed director of the National Program Agency for Components, Systems and Digital Infrastructures (ASIC) on September 15th, 2025. Previously, he led the IRT Nanoelec, a consortium of industrial and academic members, conducting research in the field of 3D stacking technologies, silicon photonics and embedded components. He also spent 6 years in California, as VP of strategic partnerships for the US region where he established Cea Leti’s commercial office in 2011. He benefits from a technical background in Physics engineering (Ecole Centrale de Marseille) and holds an MBA from the University of Miami (Florida).
The program Agency ASIC has been created 2 years ago to build a strategic vision for the french research ecosystem in the field of HW technologies from material science and engineering to components, systems and network + compute infrastructures. The agency is launching three programs adressing challenges in the fields of (i) AI Accelerators, (ii) IC design methodologies and (iii) Packaging through the engagement of academic and technology research communities.
Julie Galland
Director, CEA Technological Research Division
Julie Galland
Director, CEA Technological Research Division
Bio :
Director of Technological Research at the CEA since January 2023, Julie Galland is a graduate of the École Polytechnique (Palaiseau, France), and holds a doctorate in solid state physics.
At the CEA, she leads the Technological Research division of about 3500 Employees who develop key enabling technologies that foster the competitiveness of national and european industry, and contribute to solve the major challenges posed by the necessary energy transition, the advent of digital technology and demographic upheaval.
Before joining the CEA, Julie Galland held a number of positions within the French ministry of economic affairs between 2012 and 2023. First as head of the office in charge of the Semiconductor Sector and then of the office in charge of the Health Industries Sector, Julie Galland most recently held the position of Deputy Director for the Aerospace, Electronics and Software Sectors, where she drew up research, development and industrialisation policies. Julie Galland has been responsible for structuring projects to promote innovation and productive investment in the fields of semiconductors, pharmaceuticals and medical devices, the cloud, HPC and space. In these sectors, she has contributed to the structuring of industries and the consideration of public policy guidelines.
Jean-Baptiste Burtscher
R&D Partnerships Director, VALEO
Laurent Lafaye
Co-Chief Executive Officier, Dawex
Laurent Lafaye
Co-Chief Executive Officier, Dawex
Bio:
Laurent Lafaye is the Co-CEO of Dawex, a technology company recognized for its leadership in data exchange solutions. A seasoned French entrepreneur with a strong track record in the data economy and digital technologies, he co-founded Dawex in 2015 with Fabrice Tocco on a clear vision: controlling access to data and facilitating a fair distribution of its value. Laurent serves on the Boards of Directors of Gaia-X and buildingSmart France contributing his expertise to shaping the future of the global economy. Recognized in 2020 Technology Pioneer by the World Economic Forum, Dawex is also the initiator of an international standardization program now a harmonized EU standard on Trusted Data Transactions, a foundation of trust for the data-driven economy.
Chen-Kai Sun
Software Engineer, Free Software Lab, National Center for High-Performance Computing (NCHC)
Chen-Kai Sun
Software Engineer, Free Software Lab, National Center for High-Performance Computing (NCHC)
Bio:
Dr. Chen-Kai Sun is a Software Engineer at the Free Software Lab, National Center for High-Performance Computing (NCHC), Taiwan. With years of expertise in High-Performance Computing (HPC) and middleware development, he is a core member of the Clonezilla and DRBL projects, driving mass deployment solutions used globally. His recent work focuses on high-availability architectures, cluster monitoring, and integrated scientific data sharing platforms, specifically the Sci-DM (a public data market at NCHC). Chen-Kai is dedicated to leveraging FOSS to bridge the gap between high-performance research infrastructures and collaborative data environments.
Adrien Lebre
Senior Resarcher, Head of System, Network and Cloud Program, Inria Digital Program Agency
Adrien Lebre
Senior Resarcher, Head of System, Network and Cloud Program, Inria Digital Program Agency
Bio:
Adrien Lebre obtained his Ph.D. from Grenoble Institute of Technology (2006) and his M.S. from the University of Grenoble (2003). During his Ph.D., he developed a novel approach for managing I/O requests in multi-application HPC clusters, From 2006 to 2008, he worked as a postdoctoral researcher at Inria, designing kDFS, a kernel distributed file system for the XtreemOS EU project. In 2008, he joined IMT Atlantique as an Associate Professor, focusing on distributed cloud computing (e.g., the OpenStack’s FEMDC Working group...). He later founded and has led the STACK Research Group since 2017, following his promotion to Full Professor.
Since 2023, Adrien leads the French Cloud PEPR initiative (next-gen cloud infrastructures). In 2024, he joined Inria as a Senior Researcher, overseeing the System, Network, and Cloud program for the french digital agency. He also represents France in the SLICES-RI initiative, a platform for large-scale experimental research in networking, distributed computing, and cloud/edge architectures.
José Luis González Jiménez
CEA Fellow, Research Director, CEA-Leti
José Luis González Jiménez
CEA Fellow, Research Director, CEA-Leti
Bio:
José Luis González-Jiménez is a Fellow and Research Director at CEA-Leti, Grenoble, France.He received his Diploma, M.Sc., and Ph.D. in Electronic Engineering from Universitat Politècnica de Catalunya (UPC), Barcelona.He also obtained the HDR degree from Grenoble University in 2013.He worked as a Guest Researcher at the University of Arizona, collaborating with Motorola on high-speed DAC design.He later joined the STMicroelectronics/CEA-Leti Advanced Research Laboratory as a Visiting Researcher.Until 2011, he was an Associate Professor at UPC in Barcelona.From 2015 to 2019, he served as Deputy Head of the RFIC Design Laboratory at CEA-Leti.His research focuses on VLSI, RF/mixed-signal design, millimeter-wave and sub-THz ICs, and silicon photonics.He has authored 2 books, 40+ journal papers, 120+ conference papers, and holds 23 patents.He is a IEEE Senior Member, and active contributor to major journals and conferences technical program committees (including ESSERC, ISSCC, EuMW and IMS).
Abstract:
A vision of the scientific challenges for the telecom networks of the future with special focus on the French and European research projects in which CEA-Leti collaborates, bridging the gaps between network operators and deployment challenges, support for new or improved services, more energy efficient telecommunication equipments and networks, and the circuits and technologies needed to support them.
Coby Hanoch
CEO, Weebit Nano
Coby Hanoch
CEO, Weebit Nano
Bio:
Coby is the CEO of Weebit Nano. Coby has over 45 years’ of experience in the semiconductor and related industries, including engineering, engineering management, sales, and executive roles. Coby was previously CEO at PacketLight Networks, and held VP Worldwide Sales roles at both Verisity and Jasper Design Automation. Coby also set up his own consulting company, EDAcon Partners, helping startups define their corporate strategies, build their worldwide sales channels, and raise capital. Coby holds a Bachelor of Science in Systems Design from Technion – Israel Institute of Technology.
Abstract:
As AI workloads shift increasingly towards inference across cloud, edge, industrial, and connected systems, memory is becoming a central factor in determining performance, power efficiency, latency, and scalability. This evolution is driving a broader transition in memory architectures, as conventional approaches struggle with the growing cost and power related to data movement between compute and memory. This presentation examines how emerging non-volatile memory technologies such as ReRAM are enabling more efficient AI systems that achieve lower power operation, faster responsiveness, and advanced-node scalability. The session will also explore how these trends are shaping the longer-term evolution toward memory-centric AI architectures, including in-memory compute approaches designed to support the next generation of AI inference.
Takahiro Ogura
President of AI Computing Division, Preferred Networks
Takahiro Ogura
President of AI Computing Division, Preferred Networks
Bio:
Takahiro Ogura is a seasoned leader in high-performance computing with over 20 years of experience. He currently heads the AI Computing Division at PFN, overseeing the company's critical computing infrastructure technologies including the MN-Core™ series of AI semiconductors and in-house supercomputers. Prior to joining PFN, he served as the after-sales service manager for domestic high-performance computing clients at Fujitsu, where he began his career as a systems engineer working on supercomputer systems projects. A notable career highlight was his instrumental role in the design and development of the Fugaku (Post-K) supercomputer at Japan's national research and development agency RIKEN. Ogura received a Master's degree from Tsukuba University's Systems and Engineering program in 2005.
Abstract:
As generative AI continues to evolve, the importance of inference computing is poised to grow steadily. In this session, the speaker Takahiro Ogura will introduce the 3D-stacked memory structure, a technological breakthrough for AI inference chips, and demonstrate its potential for social transformation through AI agents and edge AI. Ogura will also share his company Preferred Networks’s vision for democratization of AI and creation of new paradigms through their proprietary chip design, ecosystem development and industry collaborations.
Edgar Auslander
Senior Director, Strategic Partnerships, Wearables, AR, AI, Meta
Edgar Auslander
Senior Director, Strategic Partnerships, Wearables, AR, AI, Meta
Bio:
Edgar Auslander has more 35 years of experience serving at company Boards, startups, a VC, and Fortune 100 companies. As Senior Director of Strategic Partnerships at Meta, he initiated and drove the partnership with EssilorLuxottica resulting in Ray-Ban Meta smart glasses. He is the Founding Managing Partner at Menlo Business Partners and was one of the founders of Texas Instruments' Wireless Business, bringing it from scratch to $5B/year. A former Faculty Member at Stanford University and the EDHEC Business School, he teaches Management of Change and Business Negotiation classes at UC Berkeley Extension. A Senior Member of IEEE, he is a Kauffman Fellow and holds an MBA from Columbia University, and an MEEng. from Cornell University.
Semiconductors for Computing
François Andrieu
Head of Memory & Computing Laboratory, CEA-Leti
François Andrieu
Head of Memory & Computing Laboratory, CEA-Leti
Dr. François Andrieu is CEA fellow and the head of Laboratory “Nano-devices for Memory and Computing” at CEA-Leti, Grenoble, France.
He has been strongly involved in the development of the Fully-Depleted-Silicon-On-Insulator (FD-SOI) CMOS technology at Leti and with STMicroelectronics, where he was assigned between 2012-2015 in the process-integration and technology-to-design groups. His fields of interest are: NVM Resistive-RAM, In-Memory-Computing, advanced CMOS transistors, 3D-sequential integration.
He is the author or co-author of more than 34 patents, 240 conference abstracts or refereed journal articles, 11 invited papers and 3 book chapters. He received the IEEE senior grade in 2018, the European ERC consolidator grant in 2019 and the IEEE/SEE Brillouin award in 2018.
Olivier Thomas
Deputy Head of the Digital IC Division, CEA-List
Olivier Thomas
Deputy Head of the Digital IC Division, CEA-List
Bio:
Olivier THOMAS is the deputy head of the Digital IC & System Design Division at CEA-List. He is in charge of partnership strategies and ecosystem growth, leveraging his background in system/design-to-technology co-optimization and product engineering within the field of embedded systems innovation. He is author and co-author of 25 patents and 77 publications. He was a pioneer and co-inventor of multi-VT technology utilizing back biasing for FD-SOI, as well as single p-well SRAM. He got is PhD in 2004 from the doctoral school of Computer Science, Telecommunications, and Electronics of Paris.
Juan Rey
CTO, Siemens EDA
Juan Rey
CTO, Siemens EDA
Bio:
Juan C. Rey returned to the Calibre Segment and was appointed as Sr. Vice President, Segment Leader/General Manager for Siemens EDA in April of 2025. Prior to his appointment as GM, Juan led the Central Engineering Solutions Team as part of a government program focused on 3D flows. He Transitioned to Central Engineering Solutions Team after serving as Vice President of Government Programs for Siemens EDA where he was responsible for defining technical programs to support government initiatives since 2023. Prior to his work with Government Programs, Juan held the roll of Vice President of Calibre Engineering. He joined Mentor Graphics in 2001 as Senior Engineering Director for Mentor?s industry-leading Calibre product line, directing all development activities for Calibre products, a role he performed until December 2021. Prior to his time at Mentor Graphics, Juan was Vice President of Engineering at Exend Corporation, managing all software development and quality activities. He joined Extend after serving as Engineering Director of Physical Verification at Cadence Design Systems. Earlier positions include Manager/Developer for Process Modeling and Parasitic Extraction at Technology Modeling Associates, Visiting Scholar/Science and Engineering Associate at Stanford University, Senior Research Engineer at INVAP, Argentina, and Associate Professor at Universidad Nacional del Comahue, Argentina. Juan holds a degree in Nuclear Engineering from Universidad Nacional de Cuyo, Argentina. The author or co-author of numerous papers and conference presentations, he serves on the Executive Technology Advisory Board of Semiconductor Research Corporation (SRC) and the UCLA Center for Domain-Specific Computing.
Abstract:
AI is rewriting the computing landscape, driving exponential demand for computational resources and unprecedented complexity in system design. Traditional chip-centric approaches can no longer address the multi-domain challenges spanning silicon, packaging, systems, and infrastructure.
This session presents Siemens EDA's vision for a comprehensive digital twin that places EDA at the center of next-generation computing—connecting chip design, advanced packaging, and system integration within a unified framework. Juan Rey will demonstrate how digital continuity from silicon to systems enables organizations to accelerate innovation, manage complexity, and deliver the software-defined, silicon-enabled solutions that power AI-driven transformation.
Sven Beyer
Technology Architect, Global Foundries
Sven Beyer
Technology Architect, Global Foundries
Bio:
Sven Beyer received his master’s and Ph.D. in Physics from the University of Hamburg, Germany. He started his career with Infineon as a manufacturing engineer in the etch department in 2003. Joining the integration department of AMD in 2005, he intermediately spent a year in the IBM ASTA alliance 2007 working on the 45nm node. Returning to Dresden, Sven has worked in many roles since then, ranging from integration technology-lead to customer engineering and lasting throughout the separation of GlobalFoundries and AMD. Today he serves as DMTS in GlobalFoundries FAB1 as technology architect (TA), overseeing mainly the eNVM & CMOS roadmap and development in Dresden.
Abstract:
Introducing the “AI stack” at the example of transformer-based AI and laying out current and potential future ownership of the elements of this stack, I will make the daring claim that “Attention ain’t everything”. Hence, pushing the digital brute force computing capability of leading-edge CMOS alone, by continuing to stumble along the path of Moore’s law, will likely never deliver true human like intelligence. Perusing this way, striving for true human like intelligence, power consumption will sky-rocket, eventually building an insurmountable barrier. It will need another paradigm shift, already foreseeable at the horizon, to lift AI capabilities on a manageable power budget, to the next level. Here the value-added solution (VAS) device offerings of mature CMOS nodes, like non-volatile memory cells, in combination with specialized low power CMOS platforms, might play a crucial role. In addition, financially affordable CMOS technologies bear the chance to bring this fascinating technology into the edge devices.
Serge Nicoleau
Group VP Technology, STMicroelectronics
Serge Nicoleau
Group VP Technology, STMicroelectronics
Bio:
Since 2024, Serge Nicoleau has served as Group Vice-President of Technology at STMicroelectronics, where he is responsible for defining, implementing, and driving the R&D governance of Digital and BCD technologies.
He began his career at STMicroelectronics in 1998, focusing on manufacturing management at the 200mm Crolles fab near Grenoble.
Over the years, Serge has held various positions in manufacturing, process engineering, and equipment engineering.
In 2004, he joined the Crolles 300mm fab as part of the Crolles2 Alliance between STMicroelectronics, Motorola/Freescale, and Philips/NXP.
By 2007, he was promoted to Director of Industrial Technologies, and in 2012, he expanded his responsibilities as Deputy Director of Operations for both the Crolles 200mm and 300mm fabs.
In this role, he tackled the industrial challenges of Automotive and IoT products, working with technologies ranging from 0.5μm to 28nm critical dimensions, including their various variants and options.
In 2018, Serge was involved in the new STMicroelectronics 300mm fab program in Agrate, Italy, supporting Smart Power, Analog Mixed Signal, and eNVM products.
Abstract :
Computing is no longer confined to executing instructions, it has evolved into a continuum spanning datacenters, gateways, edge devices, and physical systems. Today’s “computing” integrates sensing, actuation, connectivity, and decision-making, raising fundamental questions about the nature of intelligence versus mere computational cleverness. At its core, this transformation is enabled by semiconductors, where the control of electrons defines both digital, analog, and power applications. Photonics adds a complementary dimension through photon-based data transport enabling AI datacenters acceleration. Simultaneously, the boundaries between front-end and back-end technologies are blurring, extending into advanced packaging approaches, where integration now bridges semiconductor fabrication, substrates, and even display technologies. This convergence, from science to scalable industrial solutions, transforms the extraordinary into everyday reality, making semiconductor technology the foundational enabler of the intelligent, distributed computing world.
Len Koh
Senior Director, Powerchip Semiconductor Manufacturing Corp.
Len Koh
Senior Director, Powerchip Semiconductor Manufacturing Corp.
Bio:
Len Koh is Senior Director of Project Management at Powerchip Semiconductor Manufacturing Corp. (PSMC), driving innovation at the intersection of AI computing architecture and advanced memory technologies. With over two decades in the semiconductor industry, he has led initiatives in Processing-in-Memory (PIM) and 3D DRAM stacking to overcome data movement bottlenecks in next-generation systems. Holding multiple international patents, Len focuses on redefining the convergence of memory and compute to power the future of intelligent computing. He earned his Master’s degree in Computer Science from National Tsing Hua University
Abstract:
The surging AI workloads demand a memory fabric that delivers massive bandwidth, ultra-low power, and truly effective performance. Emerging bandwidth-centric solutions — wide-bandwidth memory, near-memory computing, and in-memory computing — aim to meet these challenges. Effective AI systems require co-designing memory and compute architectures to suit specific workloads. This lecture will explore the trends, compare the solutions, and underscore the need for tailored memory approaches.
Shigeru Kawanaka
Director, Corporate R&D Institute, KIOXIA
Shigeru Kawanaka
Director, Corporate R&D Institute, KIOXIA
Bio:
Shigeru Kawanaka joined Toshiba ULSI research laboratory in 1991.
Here, his research interest was high speed Logic device mainly SOI CMOS.
From 2002 to 2005, he worked on the joint development project of high-end microprocessor between Toshiba, Sony, IBM and AMD for the target of super computer, game and consumer products.
From 2006 to 2016, he engaged advanced device research activity with low power CMOS, high-density memory, power IC and image sensor.
In 2016, he served senior manager of advanced memory technology department. At this time, he started his research management carrier focusing on high speed memory device.
From 2023, he served director position of corporate Frontier R&D institute of KIOXIA corporation.
Abstract:
Recent computing system reforms have gone beyond the conventional scaling guidance principles and accelerated evolution based on the emergence of new algorithms and market requirements. This presentation introduces the evolution of the AI world and the new technological transformation based on the interlocking of memory devices from the system level that supports this evolution, especially the evolution of technologies that respond to the accelerating increase in data transactions.
Shu-Jen Han
CTO, SEEQC
Shu-Jen Han
CTO, SEEQC
Bio:
Shu-Jen Han currently serves as a CTO of SEEQC, where he is leading global multi-disciplinary teams to develop chip-based quantum computing systems. He is responsible for company’s technology roadmaps, and the integration of SEEQC’s digital chip solution into clients’ quantum systems. Before SEEQC, Han was an associate VP of HFC Semiconductor Corp., where he drove two generations of MRAM technology development. Prior to HFC, he managed nanoelectronics group at IBM T. J. Watson Research Center. He obtained his Ph.D. degree from Stanford University. He has authored over 100 technical publications, including multiple publications in Science and Nature series, two book chapters, and over 200 issued US patents.
Abstract:
Current superconducting quantum computers rely on a brute-force scaling approach where quantum chips operating at the millikelvin stage inside dilution refrigerators are connected to room-temperature electronics via an ever-increasing number of signal wires. In order to drastically scale up such systems without facing refrigeration challenges, these quantum interface electronics need to be integrated at cryogenic temperatures, ideally at the same stage as qubits. Here, we show that, by employing energy-efficient digital superconducting microchips based on single flux quantum technology, all essential functions to operate a full stack quantum computer can be integrated at 10 mK.
Cécilia Dupré
Quantum Devices lab Manager, CEA-Leti
Cécilia Dupré
Quantum Devices lab Manager, CEA-Leti
Bio:
Cécilia Dupré is the Head of Quantum Devices Laboratory at the Silicon Components Division, CEA-LETI since 2023. She is strongly involved as project manager in different innovative industrial partnerships, in quantum field and previously, in Si Photonics and NEMS sensors integration. She obtained an engineering & Master's degree from ENSTA (Paristech) in 2005, and she was awarded a Phd Microelectronics degree from Institut Polytechnique de Grenoble in 2008.
Abstract:
Engineering the Quantum Future
CEA benefits from a unique position to accelerate the industrialization of quantum technologies as its activities cover the full value chain from fundamental to applied research. CEA takes advantage of high-level clean room facilities and cryogenic infrastructure to develop Qubit technologies at large scale, as deployed in three of European CHIPS JU Pilote Lines (SUPREME, SPINS & P4Q) for superconducting, spin & photonics qubits respectively. Moreover, CEA is leading the French quantum enabling technologies initiative (IRT Nanoelec Q-Loop), addressing the full quantum control stack necessary for Fault Tolerant Quantum Computing (FTQC).
Eric Guthmuller
Research Engineer, CEA-List
Eric Guthmuller
Research Engineer, CEA-List
Bio:
Eric Guthmuller graduated from Ecole Polytechnique and received the M.S. degree from Telecom Paris, France in 2009. He received his Ph.D in computer science from the University Pierre & Marie Curie (UPMC, Paris, France) in 2013. He joined the CEA-Leti in Grenoble as a full-time researcher until 2019, then within CEA-List. His main research interests include processor architectures and their memory hierarchy, and quantum computer control architectures.
Abstract:
Engineering the Quantum Future
CEA benefits from a unique position to accelerate the industrialization of quantum technologies as its activities cover the full value chain from fundamental to applied research. CEA takes advantage of high-level clean room facilities and cryogenic infrastructure to develop Qubit technologies at large scale, as deployed in three of European CHIPS JU Pilote Lines (SUPREME, SPINS & P4Q) for superconducting, spin & photonics qubits respectively. Moreover, CEA is leading the French quantum enabling technologies initiative (IRT Nanoelec Q-Loop), addressing the full quantum control stack necessary for Fault Tolerant Quantum Computing (FTQC).
Michael Schaffert
SVP, Robert Bosch
Michael Schaffert
SVP, Robert Bosch
Bio:
Michael studied electrical engineering at the Technical University of Stuttgart.
In 1998, he joined Bosch in Stuttgart as hardware development engineer for Engine Control Units. 2001, he joined ETAS GmbH in Stuttgart as a Product Manager for Rapid Prototyping system. He left ETAS 2011, when he was Director for Product Management and Development and responsible for all ETAS HW. After ETAS Michael became Vice President at BOSCH and was the Head of Center of Competence for Vehicle Electrics and Electronics Architecture. In this role he was responsible for future E/E-Architecture’s development incl. responsibility for recognizing and assigning new technologies. In 2015 he moved to BOSCH Japan and was the Head of Customer Engineering responsible for Asian Pacific Engine Control Units & SW Service Business. In 2019 he came back to Germany and became Head of HW Development for Powertrain Control Systems BOSCH. In 2020 he was founding member of the new BOSCH Division XC (Cross-Domain Computing Solutions) and had the role as the head of Product Group responsible for Base-SW and Middleware incl. OS Product & Services. Since 07/2022 he joined BOSCH Tier2 as a SCP responsible for Chiplet.
Abstract:
The CHASSIS initiative marks a transformative step in automotive compute platform design for Software-Defined Vehicles (SDVs). By leveraging chiplet-based architectures, CHASSIS addresses the inherent limitations of traditional monolithic System-on-Chips (SoCs), introducing a modular and scalable approach to semiconductor design. This paradigm shift enables tailored, high-performance computing solutions that accelerate the transition to software-defined mobility and foster competitive innovation across the automotive industry.
Our vision extends beyond technical advancement: CHASSIS aims to restore European technological sovereignty in automotive semiconductor innovation through the creation of a multi-vendor chiplet ecosystem. This ecosystem ensures architectural flexibility, automotive-grade reliability, and freedom from proprietary constraints, paving the way for open, future-proof compute platforms.
By delivering scalable architectures that meet diverse performance requirements,
Semiconductors for Defense
Guillaume Hervé
Head of Defense Innovation Program, CEA
Gaëlle Mistrulli
Communication of Defense Program, CEA
Gaëlle Mistrulli
Communication of Defense Program, CEA
Bio:
Gaëlle Mistrulli is a Communications Project Manager within the Defense Program at CEA-DRT, where she has been leading strategic outreach and promotion initiatives for several years, working closely with defense industry stakeholders, government institutions, and innovation ecosystems. With over 15 years of experience in communication, marketing, and event management, she operates at the intersection of technology, industry, and sovereignty challenges. Deeply committed to defense matters, she also serves as a Reserve Officer within the office of the General commanding the 27th Mountain Infantry Brigade, actively contributing to strengthening the link between civilian and military spheres. As a graduate of the IHEDN (French Institute for Advanced Studies in National Defense), she has a strong interest in issues related to resilience, influence, and innovation in support of national sovereignty.
Rachid Jaoui
Head of Innovation for Nanotechnologies, DGA/AID
Rachid Jaoui
Head of Innovation for Nanotechnologies, DGA/AID
Bio:
Head of innovation for nanaotechnologies at the French Defence Innovation Agency (AID); I work closely with industry, research institues, and start up to foster innovation and strengthen technological sovereignty.
Abstract:
Semiconductors are at the heart of modern defense systems and are essential to maintaining technological superiority. However, France and Europe remain highly dependent on non-European supply chains amid rising geopolitical tensions. This talk will highlight the vulnerabilities this creates and their operational implications. It will also outline the key levers to strengthen our technological autonomy. The overarching goal is to secure the long-term sovereignty and freedom of action of our armed forces
Ignacio Montiel Sanchez
Project Manager Defence Development Programme, European Commission - DG DEFIS
Ignacio Montiel Sanchez
Project Manager Defence Development Programme, European Commission - DG DEFIS
Bio:
Dr. Ignacio Montiel-Sánchez is a researcher and policy officer with extensive experience in defence technologies and a growing focus on the integration of artificial intelligence (AI) and semiconductor advancements into security and military applications. Currently employed at the European Commission's DG DEFIS, he supports the coordination of technical working groups with an emphasis on AI and semiconductors, contributing to the development of projects under the European Defence Fund (EDF). His research examines how AI and semiconductor technologies can enhance sensor capabilities, provide information superiority, improve operational efficiency, and tackle emerging challenges in modern defence systems. His work underscores the importance of collaboration across European institutions and industry to foster innovation and resilience in semiconductor and AI integration for defence purposes.
Abstract:
During this exciting period of advanements in semiconductor technology, the European Union is leading efforts to develop semiconductor technologies that are crucial for defence purposes.This presentation will highlight collaborative efforts between EU member states, industry leaders, and research institutions to drive technological progress. Key discussions will centre on policy frameworks, funding avenues, cross-border collaborations, and the integration of sustainable practices in semiconductor development. The presentation will address challenges such as supply chain security and technological independence, offering strategic pathways to ensure resilience and sustain innovation.
Cyrille Le Royer
Semiconductor Device Researcher, CEA-Leti
Cyrille Le Royer
Semiconductor Device Researcher, CEA-Leti
Bio:
Dr. Cyrille Le Royer is a Senior Expert at CEA-Leti, specialized in advanced semiconductor (Si, SiGe, Ge; GaN, SiC) devices.
With 20+ years of experience, he has driven advancements in 28, 14 and sub 12 nm Fully Depleted (FD-SOI) technologies (and other innovative transistors for CMOS ICs) collaborating with industry leaders like STMicroelectronics, IBM, Soitec and GlobalFoundries.
Since 2018 he is involved in the Power Device activity in CEA-Leti: from GaN based HEMTs to now high-efficiency SiC power devices, he bridges academia and industry to shape next-gen microelectronics.
Dr. Le Royer has supervised 10 PhD students, led several French (including ANR projects) and European R&D projects (on FDSOI and Power) and authored 180+ publications (h-index: 31) and 34 patents.
Abstract:
In a world where supply chain disruptions and geopolitical tensions threaten critical technologies, Europe must secure its own power electronics sovereignty. Through the CARTHAGE project, CEA-Leti is developing next-gen SiC thyristors for dual-use applications—from grid resilience to defense systems—while offering agile, sovereign manufacturing to meet urgent operational needs. This talk will explore how we’re bridging the gap between lab innovation and battlefield-ready components.
Alan Peyaud
Research Engineer & Project Leader, CEA-Leti
Alan Peyaud
Research Engineer & Project Leader, CEA-Leti
Bio:
Alan Peyaud is currently a Project Manager at CEA-Leti, specializing in R&D for defense, particularly in the field of photonics. Over his 20 years of international experience, he has coordinated projects at CERN in Switzerland for the upgrade of the ATLAS detector, at the RIKEN Institute in Japan for the MINOS project, and at Macquarie University in Australia in the field of astrophysics.
With a PhD in Astrophysics from Macquarie University and the University of Louis Pasteur, Alan Peyaud combines a strong academic background with practical expertise in managing technological projects. He has published several scientific articles and participated in international conferences. Throughout his career, he has developed expertise in technical coordination, managing international teams, and developing cutting-edge technologies.
Laurent Thouy
Head of HWIL France Department, MBDA
Laurent Thouy
Head of HWIL France Department, MBDA
Bio:
After few years working as a system validation engineer, Laurent Thouy has managed a team, within the Hardaware in the Loop Départment within MBDA. He is now Head of the HWIL France Department, and is managing several teams in France. Moreover, he has a role of coordination of HWIL test capabilities at international level for MBDA.
During his professional life, he has worked and leaded the development and evolution of several key test capabilities in such field.
Mantas Sakalas
RF Group lead, Baltic Institute of Advanced technology (BPTI)
Mantas Sakalas
RF Group lead, Baltic Institute of Advanced technology (BPTI)
Bio:
Dr. Mantas Sakalas received a Master’s degree in electrical engineering from Berlin University of Technology in 2012. He continued his career in the industry working as an engineer in the field of microwave electronics components for radar applications. Since 2018 he is the leader the RF Group in Baltic Institute of Advanced Technologies (BPTI) in Vilnius, Lithuania. In 2024, parallel to his work as the RF group leader in BPTI, he acquired a PhD in Dresden University of Technology in the field of MIMO radars. The main focus of his research is development of MMIC components for radar and EW applications.
Abstract:
Establishing all European supply chain for RF components is one of the key goals in strengthening the European strategic autonomy. This is especially true for defense applications, where Europe is still falling behind and is strongly dependent on overseas supply.
However, there is a number of challenges that need to be overcome for Europe to create its own supply chain for defense systems. A lack, or even absence of commercial, open semiconductor foundries offering services for defense application development, limited technology offering, need for advanced packaging techniques. How can we tackle these challenges? Insights will be shared from European design house point of view.
Raffaele D’Errico
Senior Scientist, R&D Project Manager, CEA-Leti
Raffaele D’Errico
Senior Scientist, R&D Project Manager, CEA-Leti
Bio:
Dr. Raffaele D’Errico is a Senior Scientist and Project Manager at CEA-Leti in Grenoble, France. Since 2025, he has been coordinating EU programs for the Wireless Technology Division.
Throughout his career, he has contributed to and coordinated several European and French ANR projects, while also developing strong industrial partnerships. His expertise spans propagation channel sounding and modeling, wireless communications, radar systems, 5G/6G networks, mmWave and THz technologies, wireless sensor networks, Body Area Networks (BANs), antenna design and characterization, RFID, radio localization and mapping, reconfigurable intelligent surfaces (RIS), and Over-the-Air testing.
He has authored more than 150 scientific papers and holds 15 patents. He also led the development of MIMO Ground Penetrating Radar at CEA-Leti.
Abstract:
This talk presents a cutting-edge 3D MIMO ground-penetrating radar for real-time, high-resolution imaging of subsurface structures.
Originally developed at CEA-Leti for civil engineering and underground digital-twin applications, it precisely maps buried utilities with centimeter-level accuracy. The presentation will show how this civil technology can also serve defense by enabling the detection of mines, concealed objects, and other subsurface threats, as a powerful example of dual-use sensing.
Mathilde Cartier
IR Imaging Partnership Manager, CEA-Leti
Mathilde Cartier
IR Imaging Partnership Manager, CEA-Leti
Bio:
Mathilde Cartier is currently IR Imaging Partnership Manager at CEA-Leti.
With a PhD in magnetic materials physics from University Grenoble Alpes and an engineering degree from PHELMA INPG, she joined CEA-Leti in 2001. Over her 25 years of R&D experience, she has coordinated several European and industrial R&D projects in different fields of activities: chemtronics, spintronics, MEMS sensors …
With this practical expertise in managing technological projects, she changed positions to join the optics and photonics department in 2021 and take the position of IR Imaging Partnership Manager.
Pierre Jenouvrier
Cooled product Unit Director, LYNRED
Pierre Jenouvrier
Cooled product Unit Director, LYNRED
Bio:
Graduated from Grenoble INP (PHELMA) in 2000, Pierre first carried out academic research at CNRS (Grenoble) and was awarded a PhD in optronics in 2003. He then joined Industry and worked on a new generation of high-end gyroscope at Sagem Defense & Security (Paris). Since 2007 Pierre has been involved in the development of infrared detector technologies, being the CTO of LYNRED between 2018 and 2024. He is now in charge of the cooled business unit of LYNRED.
Thierry Mourier
Senior Process Engineer and Project Leader- Packaging For Photonics Lab, CEA-Leti
Thierry Mourier
Senior Process Engineer and Project Leader- Packaging For Photonics Lab, CEA-Leti
Bio:
PleaThierry Mourier is graduated in material science and electrochemistry from “Conservatoire National des arts et métiers” of Grenoble in 1989
He has been working in semiconductor area at LETI for 37 years now on different topics.
He started in the early phases of DUV lithography and chemical amplified photoresists developments before moving to metal deposition introducing Electrolytic metal deposition for Back End of Line and 3D applications. In the early 2000, He moved as an assignee to ST Microelectronics Crolles 300 to develop a planarizing copper electrodeposition process named “Electrochemical-Mechanical copper deposition” for 45 nm node CMOS before implementing the first generation of CMOS image sensors 2.5D integration based on TSV last on 300mm wafers. Back in LETI in 2010, he led the project of installing and starting a 300mm pilot line for 3D Integration and the introduction of new technologies as mid-process TSV and lead free solder flip chip on 300 mm integrations. He moved 7 years ago to the packaging laboratory of LETI Photonic department to lead the developments of 3D integration technologies like TSV and advanced packaging based on fine pitch flip chip for photonic devices co-integration.
Mr Mourier was involved in 85 pubse
Pierre-Damien Berger
MEMS Industrial Partnership Manager, CEA-Leti
Pierre-Damien Berger
MEMS Industrial Partnership Manager, CEA-Leti
Bio:
Pierre Damien Berger is MEMS Industrial Partnerships Manager at CEA LETI.
CEA LETI is a leading MEMS R&D lab working for industry, with more than 150 people working on these topics – world’s largest MEMS R&D institute.
Pierre-Damien was previously the MinaSmart (European Digital Innovation Hub) director at Minalogic. He worked before as CPS European projects manager, Head of Smart Devices Program, Industrial Partnership Manager and VP Business Development & Communication at CEA-Leti.
With more than 25 years of experience, 10 years in industry, 15 years in R&D serving industry, his experience has allowed him to master the right balance between business and innovation - Understand and listen to needs, identify and select innovative solutions, enhance the functions that meet expectations, communicate to radiate.
Philippe Robert
CEO, iNGage
Philippe Robert
CEO, iNGage
Bio :
Philippe Robert is CEO and co-founder of iNGage, a deeptech startup developing a new generation of high-performance MEMS sensors. He holds a PhD in Microtechnologies and began his career at the startup SILMAG, developing advanced magnetic sensor technologies for data storage, before joining THALES to work on high-end MEMS inertial sensors for aerospace and defense applications.
He joined CEA-Leti in 2001, where he held successive leadership roles, including Head of the MEMS Sensors Laboratory and Head of the Microsystems Department (120+ people), before leading Business Development for Microsystems.
In 2025, he founded iNGage as CEO & CTO, leading corporate strategy, fundraising, and execution.
He has authored over 50 scientific publications and holds more than 60 patents, including more than 20 related to the M&NEMS architecture at the core of iNGage’s innovation.
Bruno Vazzoler
Executive VP - Strategy, Innovation & Technology, Safran Electronics & Defense
Bruno Vazzoler
Executive VP - Strategy, Innovation & Technology, Safran Electronics & Defense
Bio:
Bruno Vazzoler started his career in 1989 within the Thales Group where he has held various positions in the fields of on-board radars, avionics equipment, land surveillance radars and rail systems.
In 2010, Bruno joined Segula Technologies as President of SIMRA and in 2014 he became General Manager and Executive VP of the Electrical Systems and Cockpit Solutions Division (DECS) of Zodiac Aerospace Group.
From 2019 to 2024, Bruno served as Executive VP of the Avionics Division at Safran Electronics & Defense.
Since 2024, he has held the position of Executive VP of Strategy, Innovation & Technology of Safran Electronics & Defense.
Bruno Vazzoler graduated from Ecole Polytechnique (1984) and Ecole des Ponts et Chaussées (1989).
Cybersecurity
Marion Andrillat
Cybersecurity Strategic Partnership Manager, CEA-Leti
Marion Andrillat
Cybersecurity Strategic Partnership Manager, CEA-Leti
After a Microelectronics Engineer degree at CPE Lyon, Marion Andrillat has started her career at STMicroelectronics as a digital designer of “System On Chip” for the payed TV setup boxes and consumer smartphones. In 2011, with a postgraduate Advanced Master in Marketing and Technological Innovation at Grenoble Ecole de Management, she joined the CEA as Strategic Marketing Manager. Then she moved as Strategic Partnership Manager for Systems Division at CEA Leti. Since 6 years, she is specialized in Cybersecurity Strategic Partnership Management for a wide range of industrial applications such as transports, smart grids, medical, industry 4.0, security & defense… and various devices such as integrated circuits, embedded systems or industrial equipment’s.
Mikael Carmona
Head of Cybersecurity Department, CEA-Leti
Mikael Carmona
Head of Cybersecurity Department, CEA-Leti
BIO:
Mikael Carmona is an engineer (Grenoble INP, 2007), agrégé in mathematics (2007), and PhD in signal processing (Grenoble INP, 2011). Researcher at CEA-Leti from 2011 to 2015 in the field of sensor networks, he co-founded the start-up Morphosense as CTO. He mainly contributes to the establishment and execution of the company's Technological, Product and Operational roadmaps. In 2021, he joined the Cybersecurity department of CEA-Leti and worked in the fields of post-quantum cryptography and random number generators. He took charge of the Component Security Laboratory from 2022 to 2025. He is currently Head of the Cybersecurity department of CEA-Leti
Abstract:
Technological transition can have huge impacts on hardware security of embedded devices. The examples are multiple. Post-quantum transition implies the modification of harware accelerators and countermeasures against physical attacks. RISC-V processors allow new approaches for securing components. Transistor technology migration change the properties of random number generators and the resilience to physical attacks. In that presentation, we present VASCO a serial of ASIC testing vehicles allowing implementation, physical modeling and security testing regarding cybersecurty standards of the main technological transitions.
Xavier Banchelin
R&D and Product Management Director, Thales
Xavier Banchelin
R&D and Product Management Director, Thales
Bio:
Xavier Banchelin is currently R&D and Product Management Director in the Identity & Biometric Solution Business Line of Thales, where he drives the development and product management of chip enabled solutions for identity documents.
As R&D professional with an in-depth experience of smartcard related technologies Xavier joined Thales 28 years ago and has held various engineering positions in France and in Singapore, contributing to the deployment of several new key technologies such as Javacards(TM) or electronic passports.
Xavier is a Graduate Engineer from Centrale Méditerranée.
Abstract:
Over the last two decades, electronic identity documents encountered a tremendous development. This is now a mature ecosystem with clear rules as it comes to regulations, standardisations and cybersecurity certifications. The presentation will detail how the integration of Post Quantum Cryptography is triggering changes to this framework.
Nathalie Feyt
VP Product Security, Cyber Center Of Excellence, Energy Management, Schneider Electric
Nathalie Feyt
VP Product Security, Cyber Center Of Excellence, Energy Management, Schneider Electric
Bio:
Nathalie Feyt joined Schneider Electric in 2025 as Vice President of Product Security, Cyber Center Of Excellence for the Energy division. As recognized leader in cybersecurity and digital transformation, she defines strategic technology directions for a wide range of Schneider Electric offers, from medium-voltage breakers to data centers and smart buildings.
In 2026, she spearheads the CEA–Schneider joint research lab for a 3-year renewal, advancing collaborative R&D She previously spent 18 years at Thales as Director of Cybersecurity in both the avionics as Chief Product Security Officer and in governmental sectors, as Thales ITSEF Director under ANSSI mandate. Her early career at Gemalto’s cybersecurity lab led to multiple patents and international publications.
Abstract:
Explore how a Responsible AI governance framework, grounded in cybersecurity controls, can accelerate innovation rather than constrain it. This session walks through the progression from enterprise-level AI oversight to proof-of-concept development, and ultimately to operational deployment of a use case. It demonstrates how to move from theory to practical industrial intelligence by using governance and cyber requirements as the foundation.
Bernard Vian
General Manager, SEALSQ France
Bernard Vian
General Manager, SEALSQ France
Bio:
Bernard Vian serves as General Manager of SEALSQ France. Before its acquisition by the group WISeKey, Mr. Vian served as the Executive Vice President of the Secure Transaction Business Division, Vice President of Business Development and Executive Vice President for Secure Payments at INSIDE Secure SA. He came to INSIDE Secure from Gemplus where he served in several positions in Sales Support and Marketing, in Europe and lately in California where he opened the Gemplus North America headquarter and served as Technical Support Director for 5 years. Mr. Vian joined INSIDE Secure's team in 2002 as Business Development Vice President. He is a graduate of the University of Aix-Marseille, France, with an engineering degree in Electronic Systems.
Julien Airaud
Senior Expert in Space Cybersecurity, CNES
Julien Airaud
Senior Expert in Space Cybersecurity, CNES
Bio:
Julien Airaud is a Senior Expert in Space Cybersecurity with over 20 years of experience in protecting critical systems and products. Specializing in the convergence of space and cybersecurity strategies and technologies, he focuses on enhancing organizational and technical resilience while ensuring operational continuity.
Julien has a proven track record of managing budgets exceeding €20 million and leading multidisciplinary teams. He excels in designing comprehensive security strategies, spanning cyber governance, protection, operational threat detection, and response mechanisms.
His previous roles include operational security for a banking institution, EMEAR infrastructure management for an international manufacturing group, infrastructure architecture for another industrial enterprise, and security analysis for an insurance company.
A frequent speaker at conferences and an active contributor to various cybersecurity and space groups.
Ahmadou Sere
Head of the Cyberdefense Department, ENEDIS
Ahmadou Sere
Head of the Cyberdefense Department, ENEDIS
Bio:
Ahmadou SERE is Head of Cyber Defense at a major European energy distribution company, where he leads large-scale security operations across critical infrastructure, including SOC, CSIRT, threat intelligence, and offensive security.
With a background in computer engineering, he specializes in navigating the growing complexity between operational cybersecurity, industrial constraints, and evolving regulatory frameworks such as NIS2 and European cyber resilience requirements.
His work focuses on scaling cyber defense capabilities in real-world environments, where technological ambition must align with operational reality, risk exposure, and regulatory pressure.
He brings an industrial perspective on how organizations adapt their security posture to meet both technological and compliance-driven transformations.
Marc Peresse
Cybersecurity Expert Leader, Renault Group
Marc Peresse
Cybersecurity Expert Leader, Renault Group
Bio:
Marc Péresse works within Ampere Software Technology, where he contributes to the definition and security of next‑generation vehicle software platforms. With over 25 years of experience in embedded software architecture, cybersecurity, and critical systems, he has built an international career spanning semiconductors, telecommunications, and the automotive industry.
After holding positions at Intel (France and the United States) as a security architect and embedded software engineering manager, he joined Renault, where he successively led transverse software architecture, vehicle cybersecurity, and high‑performance compute units. He is now a key reference on Software Defined Vehicle cybersecurity, in close alignment with international standards and regulations.
Marc is a graduate of Grenoble INP – ENSERG.
Samih Souissi
Chief of Staff, ANSSI
Samih Souissi
Chief of Staff, ANSSI
Bio:
Samih Souissi is currently the Chief of Staff of the Expertise Department of the French National Cybersecurity Agency (ANSSI). He leads ANSSI’s work on the transition to post-quantum cryptography (PQC). Before joining ANSSI, he was a policy officer at the French telecom regulator (Arcep) focusing on Open Internet issues. Prior to that, he worked as a cybersecurity consultant and a research engineer.
Besides, he is actively engaged with the internet governance and cybersecurity community, serving on the scientific council of Afnic (the French NIC) and the scientific committee of Internet Society France.
Samih holds a MSc in engineering and a PhD in computer science and networks with a focus on cybersecurity from Telecom Paris. He is also a graduate of University of London-LSE in international relations.
Abstract:
This presentation will highlight key actions undertaken by ANSSI to foster trusted PQC solutions availability and to support the transition to PQC in France.
ANSSI's roadmap and recommendations for the different stakeholders involved in the transition (solution providers, ITSEFs, users, etc.) will also be explained during this intervention.
Sébastien Lasserre
Product Marketing Manager FD-SOI Business Line, SOITEC
Sébastien Lasserre
Product Marketing Manager FD-SOI Business Line, SOITEC
Bio:
FD-SOI Product Marketing Manager | Semiconductor Industry Expert
With 25+ years of experience in semiconductors, Sébastien’s expertise spans from 0.25µm down to 7nm FinFET nodes across R&D and manufacturing. His career is marked by technical leadership in process engineering, yield enhancement, device development (eDRAM cell, RF, CMOS High Voltage, …) and 14nm FDSOI technology assurance implementation. Having held pivotal roles at industry leaders like Siemens, Infineon, and IBM, he has a proven track record of navigating complex international alliances partnering with UMC, NXP and ST Microelectronics.
Since joining Soitec in 2018, Sébastien has been instrumental in the global growth of FD-SOI. Combining a Master’s in Physics with an Engineering degree in Opto and Micro-electronics from French National Engineering School in Caen, he now leverages his deep technical roots and know how in advanced substrate to drive product marketing strategy and innovation around FD-SOI engineered substrate.
Abstract:
Fully Depleted Silicon-On-Insulator (FD-SOI) technology has emerged as the definitive platform of choice for cybersecurity, particularly across the IoT, edge computing, automotive, and high-speed connectivity sectors. Moving beyond the limitations of traditional bulk CMOS, FD-SOI’s ultra-thin buried oxide (BOX) layer and dual-gate control enable dynamic reconfigurable security devices that can physically alter their logic functions at runtime. This architecture creates a low-noise environment optimized for advanced cryptography, enabling the deployment of ultra-low-power engines and high-entropy Physical Unclonable Functions (PUFs). By facilitating a 'moving target' defense through polymorphic hardware obfuscation, FD-SOI does even more by resisting physical tampering and side-channel attacks. Going forward, the substrate itself can be transformed into proactive armor. Further engineered to be resilient to counterfeiting and sophisticated cyber-physical threats, FD-SOI is going to stand as the industry’s first line of defense in a hyper-connected world.
Raphaël Collado
Head of Security Testing and Tools Laboratory, CEA-Leti
Raphaël Collado
Head of Security Testing and Tools Laboratory, CEA-Leti
Bio:
With nearly 20 years of experience in the R&D departments of consumer electronics companies, I have been a member of the cybersecurity team at CEA LETI for the past seven years. I started as a research engineer and have since led the Laboratory of Security Tests and Tools (LTSO) for the past five years.
Throughout the first 20 years of my career, I have worked at several companies, holding various positions ranging from embedded software developer to team leader, including roles as a software architect.
My areas of interest cover all aspects of cybersecurity for electronic devices, encompassing both hardware and software.
I hold a master's degree in mathematics and computer science (university of Savoie), as well as a master's degree in management (CNAM Paris).
Abstract:
The activities of the LTSO laboratory at CEA/LETI focus on the research and development of new testing techniques and tools to evaluate the cybersecurity of electronic devices. This includes both hardware and embedded software components, with a holistic view of the systems. A major key aspect to enhancing the security of these systems is the identification of vulnerabilities to anticipate and address potential fixes.
This presentation will showcase the tools developed at LTSO, with a particular focus on how they can aid in evaluating compliance with new regulatory requirements such as the CRA, as well as enhancing the resilience of systems against sophisticated attacks.
The FAMES Pilot Line
Dominique Noguet
FAMES Pilot Line Project Coordinator, CEA-Leti
Dominique Noguet
FAMES Pilot Line Project Coordinator, CEA-Leti
Bio:
Dominique Noguet holds an engineering degree of the National Institute of Applied Sciences (INSA) in electrical engineering in 1992, and a PhD from National Polytechnical Institute of Grenoble (INPG) in 1998. Then, he held several positions at CEA-Leti as a digital IC designer, lab manager and department manager. He led many projects at a national level and in several European frameworks (FP5, FP6, FP7). In January 2023, he was appointed project manager for the France 2030 flagship project NextGen. He is currently the coordinator of the FAMES Pilot Line and reports to CEA-Leti’s CEO. Dominique is a CEA senior expert and an IEEE Senior Member. He has authored or co-authored ~100 scientific papers (several best paper awards), several book chapters and 15 patents. He was a reviewer and a member of scientific committees of many conferences and a member of journal editorial boards. He was conference chair and TPC chair of several international conferences.
Abstract:
The FAMES pilot line has reached a pivotal stage, with highly innovative results obtained on all developed technologies.
These outcomes enable to strengthen FAMES partnerships and further feed other FAMES key initiatives, such as our
open-access and training programs. Moreover, the official inauguration of the Pilot Line earlier this year, was marked by the
launch of a state-of-the-art cleanroom, which is a major asset of the Pilot Line implementation strategy.
Susana Bonnetier
FAMES Pilot Line Open Access Chairperson, CEA-Leti
Susana Bonnetier
FAMES Pilot Line Open Access Chairperson, CEA-Leti
Bio:
Susana Bonnetier is a member of the FAMES Pilot Line management team and leads the Open Access effort with the goal of making « European-grown » advanced semiconductor technologies readily accessible to industry and academia.
An MIT engineer with a background in industry and research in the USA and France, Susana puts all her energy into transferring technological innovation to companies.
Born in Venezuela, Susana spent 9 years in the USA, where she completed her higher education and worked for General Electric Aircraft Engines, designing and building aircraft engines.
In 1991, Susana joined Saint-Gobain in France, first in the Industrial Strategy and Planning department working with 20 manufacturing plants to streamline and modernize their operations, and then at Saint-Gobain Cristaux et Détecteurs as Product and Industrial Market Manager, significantly increasing the profitability of a scintillation detectors product line.
In 2001, she moved to Grenoble, “the land of nano and micro technologies”, and reoriented her career towards the semiconductor industry. She joined Freescale as R&D Engineer and contributed to the successful development of the 65nm and 45nm CMOS technology nodes by the Crolles 2 Alliance.
In 2007, Susana joined CEA-Leti, first as head of a joint laboratory between Leti and a major French optics company, and later as Leti’s Carnot program manager, piloting a 14M€ R&D budget within Leti’s Scientific Directorate. During that time, she was VP of the Carnot Network and a member of its board of directors.
Susana brings a solid industrial and R&D experience to the FAMES Pilot Line project and the aim of contributing to the construction, in concert with the FAMES European Partners and the complementary Chips Act Pilot Lines, of a pan-European semiconductor ecosystem with the best Europe has to offer in microelectronics technologies.
Abstract:
The open-access concept of the FAMES pilot line project continues to be a key annual meeting point.This presentation will assess the responses to the 2025 call for proposals, introduce newly opened topics for 2026, and outline participation pathways. It will also feature a dedicated focus on the availibility of pathfinding design kit to evaluate the performance of the 10nm FD-SOI CMOS technology.
Laurent Fesquet
Deputy DIrector of the TIMA Laboratory (UGA - Grenoble INP - CNRS)
Laurent Fesquet
Deputy DIrector of the TIMA Laboratory (UGA - Grenoble INP - CNRS)
Bio:
Laurent FESQUET received the Ph.D. degree in electrical engineering from
Paul Sabatier University, Toulouse, France, in 1997. In 1999, he joined the Grenoble Institute of Technology, Grenoble, France, as an Associate Professor at ENSERG (now PHELMA).
His current research at the TIMA Laboratory today covers asynchronous circuit design, computer-aided design (CAD) for event-based systems and non uniform signal processing. He has served as general and program chair of several international conferences. He is currently the Deputy Director of the TIMA laboratory and CIME Nanotech, an academic center supporting microelectronic teaching and research activities
Claire Fenouillet-Beranger
Project Manager, CEA-Leti
Claire Fenouillet-Beranger
Project Manager, CEA-Leti
Bio:
Claire Fenouillet-Béranger joined CEA-Leti, Grenoble, in 1998 where she carried out her PhD. work on the integration and characterization of SOI devices. From 2001 to 2013 she worked as a CEA-Leti assignee in advanced R&D STMicroelectronics center, Crolles, France on FD-SOI (Fully-depleted SOI) technology platform development and characterization. From 2013 to 2020 she worked as the project leader of the low temperature MOSFETs development for 3D sequential integration. From January 2020 to January 2022, she was the LETI SiC pilot line project manager in the frame of the joint development program between SOITEC & AMAT. She is the author and co-author of more than 200 publications in major conferences and journals and of more than 40 patents. She was the co-recipient of the Grand Prix du Général Ferrié in 2012 for her work on FD-SOI. She is in charge of CMOS patent portfolio. Since 2022, she is director of research, and CEA Fellow expert, and co-project manager of the FD-SOI next generation node integration at CEA-Leti.
Abstract:
In the context of 10 nm FD-SOI technology development, new architectural and process building blocks must be implemented to meet the targeted device performance specifications. Strain engineering remains one of the primary performance boosters. Strain can be introduced either at the wafer level or at the device level. Additional process modules are required to further reduce access resistance and enhance overall device performance. In particular, the integration of in-situ doped, faceted raised source and drain regions is critical. Achieving the aggressive contacted poly pitch (CPP) target of 68 nm necessitates the implementation of advanced patterning techniques, specifically Self-Aligned Double Patterning (SADP), to meet density scaling requirements. In this presentation, we’ll dive into each of these levers and explore how they can push FD-SOI to the next level.
Laurent Grenouillet
Integration and Device Engineer - Ferroelectric Memory Group Leader, CEA-Leti
Laurent Grenouillet
Integration and Device Engineer - Ferroelectric Memory Group Leader, CEA-Leti
Bio:
Laurent Grenouillet received the Engineer degree in physics in 1998 from the National Institute of Applied Sciences (INSA) in Lyon, France, and the PhD degree in electronic devices in 2001. From 2001 to 2009 he worked at CEA-Leti on Optoelectronics and Silicon Photonics. In 2009, he joined IBM Alliance in Albany, USA to contribute to the development of FDSOI technology and took part to the FDSOI technology transfer to Global Foundries (22FDX) in 2015. Back in France, he joined the Advanced Memory Device Laboratory at CEA-Leti where he worked on resistive switching memory devices. In 2018 he started to work on ferroelectric HfO2-based memories (FeCaps, FeRAM, FTJs) and he is now leading the Ferroelectric Memory group at CEA-Leti.
Abstract:
CEA-Leti research engineers have demonstrated for the first time a scalable Hf0.5Zr0.5O2 (HZO) based ferroelectric capacitor platform integrated into the back-end-of-line (BEOL) at the 22nm FD-SOI technology node. This breakthrough represents a major milestone in ferroelectric memory technology, significantly advancing scalability for embedded applications and positioning ferroelectric RAM (FeRAM) as a competitive memory solution for advanced nodes.
This demonstration opens the door to faster, more energy-efficient, and cost-effective memory solutions in embedded systems such as IoT, mobile devices, and edge computing, and further strengthening Europes's position in both the FD-SOI and the FeRAM Technologies.
Marie Bousquet
Research Engineer, CEA-Leti
Marie Bousquet
Research Engineer, CEA-Leti
Bio:
Marie Bousquet is a Research Engineer at CEA-LETI, Grenoble, France. She received M.S. and PhD degrees in materials science from the University of Limoges, France, in 2007 and 2010, respectively. After 6 years of academic and industrial experiences, she joined the CEA-LETI, Grenoble, France where her interest is on the integration of piezoelectric materials (LiNbO3 and LiTaO3) in RF acoustic devices (SAW, BAW, Lamb) and management of industrial and academic R&D projects. She has authored and co-authored more than 40 scientific journal and conference papers and contributed to 10 patents on RF acoustic devices.
Abstract:
The FR3 range, from 7.125 to 24.25 GHz, is expected to extend by exploiting an intermediate region between the sub-6 GHz and the millimetric range. Filtering solutions based on Bulk Acoustic Wave (BAW) filters have to adapted for this frequency range. In this talk, we will present the main challenges (design, co-integration, process control, wafer level packaging, and so on) related to the up-scaling of BAW technologies for this frequency range. This will be exemplified by preliminary results based on AlScN and LiNbO3 BAW devices for this frequency
Tuomas Pensala
Research Team Leader – RF Microsystems Team, VTT
Tuomas Pensala
Research Team Leader – RF Microsystems Team, VTT
Bio:
Tuomas Pensala received the M. Sc. degree in Engineering Physics from the Helsinki University of Technology in 2000 and the D. Sc. (Tech.) degree in Applied Physics from the Aalto University in 2011. He has worked for the VTT Technical Research Centre of Finland since 1998 where he presently holds a position of Research Team Leader of the RF microsystems team. His research interests include RF devices based on thin film technology such as GHz range BAW/FBAR resonators and filters and IPD. He has also worked on piezoelectric MEMS sensors and timing devices. He has authored and co-authored more than 50 scientific journal and conference papers on thin film, RF and MEMS devices and contributed to almost 30 patent families.
Abstract:
The FR3 range, from 7.125 ta 24.25 GHz, is expected ta extend by exploiting an intermediate region between the sub-6 GHz and the millimetric range. Filtering solutions based on Bulk Acoustic Wave (BAW) filters have to adapted for this frequency range. In this talk, we will present the main challenges (design, co-integration, process control, water level packaging, and so on) related to the up-scaling of BAW technologies for this frequency range. This will be exemplified by preliminary results based on AIScN and LiNbO3 BAW devices for this frequency.
Sandrine Catrou
VP Marketing and Strategic Partnership, CEA-Leti
Sandrine Catrou
VP Marketing and Strategic Partnership, CEA-Leti
Bio:
Sandrine Catrou holds an Electrical Engineering degree and a Master degree in microelectronics both obtained in Bordeaux, France, in 1991.
She spent her first 15 years in chips design, alternatively at European Silicon Structures, Rousset, France, ATMEL Corporation, and STMicroelectronics, Grenoble, France.
In 2011, she joined CEA Technology Transfer Office in Grenoble, France, supervising market studies in microelectronics. She got involved in the launch of a dozen CEA deeptech startups in France.
In 2015, she joined CEA-Leti CTO office as Strategic Marketing Manager to provide semiconductor market insights. In particular, she got involved in major national strategic investment plans in microelectronics.
In 2020, Sandrine started developing CEA-Leti international industrial partnerships with semiconductor industrial leaders. She got involved in the High Level Forum to foster international collaborations between innovative clusters. She also got involved in the development of technological collaborations between Grenoble Silicon Valley and the K-Belt.
Abstract:
Insights into the semiconductor and electronics industries will concentrate on the latest market and technology trends. This analysis will explore design opportunities unlocked by innovative semiconductor technologies, with a special emphasis on FD-SOI technology, covering its current adoption status and market outlook. Driven by the promising advantages of FD-SOI transistors—ideally suited for a wide range of next-generation electronic applications—a new industrial ecosystem has emerged, fostering increased design wins and accelerating technology adoption.
Sébastien Lasserre
Product Marketing Manager FD-SOI Business Line, SOITEC
Sébastien Lasserre
Product Marketing Manager FD-SOI Business Line, SOITEC
Bio:
FD-SOI Product Marketing Manager | Semiconductor Industry Expert
With 25+ years of experience in semiconductors, Sébastien’s expertise spans from 0.25µm down to 7nm FinFET nodes across R&D and manufacturing. His career is marked by technical leadership in process engineering, yield enhancement, device development (eDRAM cell, RF, CMOS High Voltage, …) and 14nm FDSOI technology assurance implementation. Having held pivotal roles at industry leaders like Siemens, Infineon, and IBM, he has a proven track record of navigating complex international alliances partnering with UMC, NXP and ST Microelectronics.
Since joining Soitec in 2018, Sébastien has been instrumental in the global growth of FD-SOI. Combining a Master’s in Physics with an Engineering degree in Opto and Micro-electronics from French National Engineering School in Caen, he now leverages his deep technical roots and know how in advanced substrate to drive product marketing strategy and innovation around FD-SOI engineered substrate.
Abstract:
Fully Depleted Silicon-On-Insulator (FD-SOI) technology has emerged as the definitive platform of choice for cybersecurity, particularly across the IoT, edge computing, automotive, and high-speed connectivity sectors. Moving beyond the limitations of traditional bulk CMOS, FD-SOI’s ultra-thin buried oxide (BOX) layer and dual-gate control enable dynamic reconfigurable security devices that can physically alter their logic functions at runtime. This architecture creates a low-noise environment optimized for advanced cryptography, enabling the deployment of ultra-low-power engines and high-entropy Physical Unclonable Functions (PUFs). By facilitating a 'moving target' defense through polymorphic hardware obfuscation, FD-SOI does even more by resisting physical tampering and side-channel attacks. Going forward, the substrate itself can be transformed into proactive armor. Further engineered to be resilient to counterfeiting and sophisticated cyber-physical threats, FD-SOI is going to stand as the industry’s first line of defense in a hyper-connected world.
Piotr Wiśniewski
Head of Intelligent Semiconductor Systems Division, CEZAMAT
Piotr Wiśniewski
Head of Intelligent Semiconductor Systems Division, CEZAMAT
Bio:
In 2014, he received his MSc. Eng. degree in microelectronics, photonics, and nanotechnology, and in 2020, a Ph.D. degree in electrical engineering from Warsaw University of Technology (WUT). Currently is the Head of the Intelligent Semiconductor Systems Department (SEMINSYS) and an assistant professor at the Centre for Advanced Materials and Technologies CEZAMAT WUT, responsible for managing the department's semiconductor technology line and R&D activities. He has been actively involved in several national and international projects related to microelectronics and photonics as a researcher and principal investigator.
Abstract:
This presentation explores the design of cybersecurity-oriented applications leveraging FD SOI technology, with a particular focus on RRAM integration. The integration of RRAM further enhances system security by providing non-volatile, scalable memory suitable for secure key storage, physically unclonable functions, and in-memory security primitives. It enables robust, low-power, and cybersecurity architectures, making them highly attractive for next-generation secure IoT, embedded, and edge computing applications.
Jean-Frédéric Christmann
R&D Engineer, CEA-Leti
Jean-Frédéric Christmann
R&D Engineer, CEA-Leti
Bio:
Jean-Frédéric Christmann received the M.S and PhD degrees in Electronics from the Grenoble Institute of Technology in France in 2009 and 2013. Since 2009, he is a research engineer at the French Atomic Energy Commission (CEA). He first was with the Digital Circuits and Systems Department where he worked on mixed-signals systems modelling, multicore processor assembly and functional validation, low power microcontrollers architectures, asynchronous processors logical synthesis and physical implementation, and In-Memory Computing controllers. From 2018 to 2022, he has been the digital technical leader for a world-class mixed-signals pressure sensor design. Since 2022, he is with the Silicon Component Department where he works on standard cells design automation and advanced technologies benchmarking.
Abstract:
To evaluate the performance of the 10nm FD-SOI CMOS technology process, FAMES offers a pathfinding design platform targeting both analog and digital design. Offering multiple devices, the compehensive PDK featuring DRC, LVS, PEX and Virtuoso support allows exploration of advanced process features. Moreover, 50+ combinational and sequential cells are derived in 16 standard cells libraries with Verilog, Spice, Liberty, and LEF descriptions, which enables the implementation of complex digital architectures and hence system-level benchmarking.
Régis Hamelin
CTO / aCCCEss coordinator, Blumorpho
Régis Hamelin
CTO / aCCCEss coordinator, Blumorpho
Bio:
Régis Hamelin earned an engineering degree in materials science and a PhD in Electronics from the University of Lille, where he researched semiconductor lasers with the IEMN optronics team in 1993. He spent seven years at CEA-LETI as a process engineer and program manager in optronics, developing expertise in compound semiconductor photonic components and packaging. In 2003, he co-founded Intexys Photonics, serving as CTO and board member in launching active optical cables for high-end supercomputers. In 2010, he joined the “COWIN” support action under FP7, leading to the foundation of BLUMORPHO, which he joined as CTO in January 2015. As BLUMORPHO’s Chief Technology Officer, he directs deep-tech innovation and helps European ecosystems advance in semiconductors, IP generation, and technology transfer.
He is currently coordinator of the aCCCess CSA coordinating the Competence Centers Activity.
Sana Ibrahim
Research Engineer in Microelectronics Design, Grenoble INP
Sana Ibrahim
Research Engineer in Microelectronics Design, Grenoble INP
Bio :
Sana Ibrahim received the M.S. degree in Wireless Integrated Circuits and Systems from Grenoble Alpes University (UGA), Grenoble, France, in 2020, and the Ph.D. degree in Nanoelectronics and Nanotechnologies from TIMA Laboratory, UGA, Grenoble, France, in 2024. In 2025, she joined Grenoble Institute of Technology (INP), Grenoble, France, as a research engineer at Phelma within the European project FAMES. During her doctoral studies, her research focused on the design of a wideband, low-power RF front-end based on N-path mixers in 28nm FD-SOI technology.
Her current work involves on developing and contributing to a comprehensive curriculum covering both analog/RF and digital design flows, aimed to provide designers with the foundational knowledge needed to develop integrated circuits using FD-SOI technology.
Philippe Flatresse
Director of Valorization - ASTEERICS Competence Center, MINALOGIC
Philippe Flatresse
Director of Valorization - ASTEERICS Competence Center, MINALOGIC
Bio:
Philippe Flatrese, who holds a PhD in Microelectronics and has over 25 years' experience, is Director of Commercialisation at the ASTRIERICS Competence Centre. Recognised as an expert in FD-SOI technology, he has held strategic management and marketing roles at Soitec, Dolphin Design and STMicroelectronics. He specialises in developing complex technological ecosystems and accelerating innovation for the automotive and AI markets. He is currently responsible for fostering synergy between industrial and academic partners to shape the electronics sector.
Loreta Stojanova
Project Manager - Austrian Chips Competence Center, TUGraz
Loreta Stojanova
Project Manager - Austrian Chips Competence Center, TUGraz
Bio:
Loreta Stojanova moved to Graz in 2005 to study Electrical Engineering at Graz University of Technology, specialising in Information and Communication Technology and Analog Chip Design. Today, she combines technical expertise with strong project management skills at the Institute of Electronics at TU Graz, the only university partner in the Austrian Chips Competence Center (AT-C³), where she contributes to skills and training activities.
The RESOLVE Initiative
Bruno Paing
VP Europe & International Public Affairs, CEA-Leti
Bruno Paing
VP Europe & International Public Affairs, CEA-Leti
Bio:
Mr Paing has a substantial international (15 years abroad) and mixed public/private experience in private companies (Orange, Sagemcom), in the French Ministry of Foreign Affairs (scientific attaché in Taiwan in 1998-1999 and in Hanoi, Vietnam from 2002 to 2005) and in CEA since 2005.
He first promoted MINATEC innovation campus in Grenoble and then became CEA-Leti VP Industrial Partnerships to develop R&D programs with Industry. He also developed R&D partnerships with Japanese and American companies in Tokyo and California (Caltech, Pasadena) from 2013 to 2021, and then became International Relations Deputy Director at CEA Head Office in Paris-Saclay from 2021 to 2023. He now serves as CEA-Leti VP Europe & International Public Affairs in Grenoble.
Mr Paing is graduated from the French “CentraleSupelec” Engineering School (Master of Science in Engineering), from Lyon Business School / EM Lyon (Executive MBA), and he is an auditor of CHEAD (French Diplomatic Academy) in 2025.
Anne Van den Bosch
Vice President Public R&D Policies & Programmes, Imec
Anne Van den Bosch
Vice President Public R&D Policies & Programmes, Imec
Bio:
Anne Van den Bosch obtained her PhD degree at the Catholic University of Leuven in 2003 in the area of current steering digital-to-analog converters. She is the first author of 17 publications and the co-author of 5 publications. From 2001 until 2008, she worked for the Flemish funding agency, where she headed the micro-electronics and photonics team and represented the agency in the MEDEA+/CATRENE and ENIAC public authorities board. She is now working at imec as Vice-President Public R&D Policies and Programs and leads all imec activities related to Flemish, European and international public research policy and funding programs. She is also responsible for the contractual collaborations with international universities and research institutes. Since the beginning of 2023, she is executive Vice-President of the European Association of Space Technology Research Organizations. She is a member of several boards, management commissions, and steering committees.
Patrick Bressler
Director for International Cooperation, Fraunhofer Microelectronics Group
Patrick Bressler
Director for International Cooperation, Fraunhofer Microelectronics Group
Bio:
Dr. Patrick Bressler is the director for international cooperation, emerging technologies and innovation at the Fraunhofer Microelectronics Group / FMD (Research Fab Microelectronics Germany) in Berlin, Germany. Responsibilities include technology evaluation, developing partnerships for research, innovation and work force development, and advancing European and international R&D&I programmes. Patrick is a member of several European technology advisory boards and scientific committees. Since September 2024 Dr. Bressler also serves as the Secretary General of the European Materials Research Society, E-MRS.
Patrick is a physicist by training. Earlier career stages include:
Managing Director of the Fraunhofer Microelectronics Office in Berlin, Germany,
Executive Vice President of Fraunhofer USA, in charge of research operations at the seven Fraunhofer R&D centers, Plymouth, MI, USA,
Adjunct professor at Michigan State University, East Lansing, MI, USA,
Director of Fraunhofer Brussels, Brussels, Belgium,
Head of Unit for Physical Sciences and Engineering of the European Science Foundation, Strasbourg, France (2004-2008),
Member of the E-MRS Governing Board (2005-2015) and Chairman of the European Materials Science and Engineering Expert Committee (MatSEEC, 2012-2015) and Senior scientist and Head of Unit at the Berlin Synchrotron BESSY, Berlin, Germany.
Pierre Chastanet
Head of the Unit - Microelectronics and Photonics, European Commission
Pierre Chastanet
Head of the Unit - Microelectronics and Photonics, European Commission
Bio:
Pierre Chastanet is Head of the Unit for Microelectronics and Photonics at the European Commission, where he manages the development of European semiconductor policy and the implementation of the European Chips Act and the preparation of a Chips Act 2.0.
Mr. Chastanet has been working for 20 years in the European Commission, supervising different digital policies in the areas of cloud, data flows, software, cybersecurity, privacy, green ICT, and telecom innovation.
Prior to that, Mr. Chastanet gained over 8 years of business experience, mostly in various IT management positions in a large multinational company.
He holds a M.Sc. in Telecommunication Engineering from Telecom Paris (Polytechnic Institute of Paris), a M.A. in International Politics from the Free University of Brussels (ULB), and a B.Sc. in Economics from the London School of Economics and Political Science. He also earned a Leadership Executive Certificate from the Harvard Kennedy School of Government.
Abstract:
The presentation will highlight the European Union’s renewed strategy to strengthen its semiconductor ecosystem and to increase its technological sovereignty, supply chain resilience, and investment in advanced chip manufacturing and research. Semiconductor research is a key driver for innovation, enabling breakthroughs that can directly benefit Europe’s industrial base. The Chips Act 2 aims at boosting partnerships, fostering cutting-edge R&D and addressing skills shortages to enhance the competitiveness, sustainability, and global positioning of European semiconductor industry.
Jean-René Lèquepeys
Deputy Director and Chief Technology Officer, CEA-Leti
Jean-René Lèquepeys
Deputy Director and Chief Technology Officer, CEA-Leti
Bio:
Jean-René Lèquepeys received an engineering degree in 1983 from CentraleSupélec, a top French graduate engineering school at Paris-Saclay University, France. He taught physics during 2 years in Ouarzazate, Morocco.
He joined CEA, a French Research and Technology Office focusing on applied research, in Paris Saclay in 1985. He first worked at the laboratory of the Central Security Office, on the evaluation of means of detection and intrusion. Two years later, he was promoted head of this laboratory.
In 1993, he moved to Grenoble, France, and joined the System Division of CEA-Leti. He worked on different projects in the field of image processing and telecommunication technologies. In particular, he was responsible for the "Telecom, Communicating Objects and Smart Card" programs from 1999 to 2004.
In 2005, he took the responsibility of the Circuits Design Division at CEA-Leti (200 people). He launched new research activities at CEA such as a new laboratory in Aix-en-Provence, France, on the development of secured chips. In 2000, Jean-René Lèquepeys received the prestigious award from the french Société de l'Electricité, de l'Electronique et des technologies de l'information et de la communication (SEE) "Grand Prix de l'électronique Général Ferrié" for his work in the telecommunications field (he holds 15 patents).
In 2010, he launched a new division at CEA focusing on Electronic Architectures, Integrated Circuit Design and Embedded Software. He established the structure on two sites (Paris and Grenoble) and led the division twice in his career.
He rapidly got involved in the creation of the Silicon Components Division at CEA-Leti, and took the lead of it in 2011 managing 350 people. Division encompasses micro and nanoelectronics (SOI, nanodots, quantum, memories, 3D technologies, substrates), Micro Systems (sensor, actuator, radiofrequency components) and Power Components. He established the French Nano2022 Program for research funding in microelectronics.
In 2019, he was appointed Chief Technology Officer of CEA-Leti, overseeing Science, relations with the European Commission, Industrial Partnership and Strategic Program Management in the scope of the institute (2,000 people, ~€350m budget). He took the responsibility of the Microelectronic Program at CEA level, spearheading technological and upstream research in the field of semiconductor technologies. For the past 2 years, he has been strongly involved in the CEA-Leti Next Gen FD-SOI project in the frame of France2030 and has played a key role in European chips Act pilot line promoting FD-SOI and Gate All Around technologies.
Having dedicated his career to applied research, he is regularly invited as a keynote speaker in international semiconductor conferences.
Jean-René is also Vice President of ACSIEL, a professional trade union gathering industrial companies in the French electronic value chain, member of the Board of EPOSS, the European Technology Platform on Smart Systems Integration, a member of the Board of AENEAS, the Association for Europoean NanoElectronics Activities, and an expert consultant for the European Commission and French Research Agency
Abstracts:
Plenary Session
CEA-Leti contributes to Europe’s semiconductor ambitions through RESOLVE, an initiative supporting the objectives of the European Chips Act by accelerating the transfer of breakthrough technologies from research to industrial deployment.
RESOLVE strengthens collaboration between research centers, startups, suppliers, and industrial leaders to shorten innovation cycles and enable faster market adoption. Leveraging CEA-Leti’s expertise in advanced semiconductor technologies, the initiative supports pilot lines, shared platforms, and technology validation frameworks.
This talk will present how RESOLVE helps build a stronger European semiconductor ecosystem by turning research excellence into industrial competitiveness and strategic sovereignty.
The RESOLVE Initiative Conference
This presentation will provide an update on the RESOLVE initiative and highlight the progress made in bringing together Research and Technology Organizations (RTOs) across all Europe and industrial partners to define a common vision for Europe’s semiconductor future. RESOLVE is a uniquely inclusive European initiative, uniting research organizations from nearly 20 EU Member States to ensure broad collaboration across the continent. In the context of the forthcoming Chips Act 2, the initiative focuses on fostering breakthrough technological innovation through close cooperation between research and industry and addresses key challenges such as energy efficiency, next generation of AI chips, European sovereignty in leading-edge technologies to strengthen Europe’s key vertical markets. Ultimately, this collective effort aims to position Europe as a global leader in semiconductor technologies and will contribute to the increase of semiconductor production in Europe.
Startups & Investments
Sylvain Colomb
Startup Program Manager, CEA-Leti
Sylvain Colomb
Startup Program Manager, CEA-Leti
Bio:
Sylvain Colomb began his career as a Marketing Engineer within CEA’s technology transfer division, where he spent eight years supporting laboratories and emerging startups. In 2010, he co-founded Ethera, a startup specializing in indoor air quality fueled by disruptive nanomaterial technology. After successfully scaling the company and its integration into the SEB Group, he returned to the innovation ecosystem. Since 2019, Sylvain has served as the Startup Program Manager at CEA-Leti, where he currently leads entrepreneurship initiatives and spearheads strategic support for new startup creation from CEA-Leti's laboratories.
Laurence Petit
Director for Innovation, CEA - EIC board member
Laurence Petit
Director for Innovation, CEA - EIC board member
Bio:
Laurence Petit holds a PhD in quantum chemistry and has been certified as a Project Management Professional (PMP) by the PMI since 2015.
From 2008 to 2019, Laurence Petit worked at the French National Agency for Radioactive Waste Management (Andra). She was, in particular, in charge of managing Andra’s “Investissements d’Avenir” (Investing in the Future) program (€75M). She became Head of Innovation at Andra in 2016 and was appointed Deputy Director of the Development, Innovation, and International Relations Division in 2019.
Laurence Petit joined CEA at the end of 2019 as Technical Innovation Advisor to the Chairman and CEO. She has been Director for Innovation at CEA since 2022. She is specifically responsible for the strategic and operational management of all CEA's startup support programs and the CEA Investissement subsidiary. She joined the board of the European Innovation Council at the end of 2025.
Régis Saleur
Managing Partner, Supernova Invest
Régis Saleur
Managing Partner, Supernova Invest
Bio:
Régis has been part of the team since 2008 as Managing Partner. He has more than 25 years of experience in private equity and operations.
From 2003 to 2007, he was general partner at Galileo, where he invested in Talend (software publisher, 500 employees, Nasdaq: TLND), Alyotech (engineering and technology consulting, 1,900 employees), and Sarenza (online sales, 300 employees). Régis was Managing Director of Seeft Ventures from 1999 to 2003 (digital start-up management). He is a graduate of École Centrale Paris. Régis is on the boards of Aledia, Aveni, Kalray, Aselta, Crocus, Prophesee.
Pierre Garnier
Managing Partner, Jolt Capital
Pierre Garnier
Managing Partner, Jolt Capital
Bio:
Pierre Garnier has over 30 years of operational and C-suite experience across large corporates and scale-ups, in sectors such as semiconductors, hardware, software and cybersecurity. Prior to joining Jolt Capital, Pierre was most recently President of e2v-semiconductor, a leader in the semiconductor market for aerospace & defence where he accelerated growth of 15% in less than a year before its sale to the Teledyne Group in 2017.
Preceding this, Pierre served as COO of Inside Secure (EUR: INSD) where he led its transformation from a semiconductor player into an embedded software security leader. Pierre has also held various other top executive roles including VP & General Manager of the Wireless BaseBand Business Unit at Texas Instruments (TI), CEO at Everbee Networks, and General Manager of the Broadband Chipset Business Unit at Alcatel Microelectronics (now part of ST-Microelectronics). Pierre holds an Engineering degree from École Supérieure d’Électricité (Supélec), and a Master of Solid State Physics from UPMC (Pierre and Marie Curie University).
Pierre is currently on the boards of Interel, MicroOled, Dolphin Semiconductor and P2i, as well as an observer on the boards of EfficientIP and Tehtris. Pierre led the exit process of UnitySC to Merck (ETR:MRK).
Steven Konsek
Investment Director, Applied Ventures
Steven Konsek
Investment Director, Applied Ventures
Bio:
Steven Konsek is an Investment Director at Applied Ventures where he focuses on photonics and displays in addition to supporting investments and startup ecosystem engagement in Europe and Israel.
Prior to joining Applied Ventures in 2022, Steven spent nearly two decades working with and funding deep-tech startups in the U.S. and Europe. He was most recently Director of Business Development at Aledia, a French photonics startup. Prior to Aledia, Steven led innovation programs at the U.S. National Science Foundation, where he ran NSF’s portfolio funding startups in the semiconductor, photonics, advanced materials, and IoT sectors as well as leading the Innovation Corps program for deep-tech startups. Prior to NSF, Steven held leadership positions in several semiconductor/photonics startups, including Illumitex, Glo/Qunano, and Nantero.
Steven has a PhD in Physics from the University of Washington and BS in Mathematics from Purdue University. He is based in Geneva, Switzerland.
Bernard Aspar
Silian Partners/Ardian Semiconductor
Bernard Aspar
Silian Partners/Ardian Semiconductor
Bio:
Bernard Aspar, Partner of Silian Partners, contributes over 30 years of industry experience and is a recognized world expert in semiconductor materials. He entered Silian Partners coming from his COO position at Soitec which he joined in 2006 during the acquisition of Tracit Technologies, a company he founded in 2003. Tracit Technologies was a spin-off of CEA-Leti, where he spent 10 years in semiconductor research.
Abstract:
As the semiconductor industry enters an era defined by strategic sovereignty, the gap between European innovation and global scale remains a significant challenge. We will explore how Ardian Semiconductor bridges this gap to scale high-potential SMEs and mid-cap companies into global leaders. By integrating private equity best practices with deep sector expertise, we do more than just invest : we transform.
Our methodology is based on rigorous investment strategies combined with operational excellence implementation and market positioning. The objective is clear: identify promising European players and deploy the necessary value-creation levers to transform them into global leaders, capable of competing on the world stage.
Thomas Ferré
Private Equity Investor, EIC/EIB
Thomas Ferré
Private Equity Investor, EIC/EIB
Bio:
Thomas is a private equity investor with nearly 20 years of investing in companies across the world. Today he works at the European Investment Bank for one of the EU's largest venture fund with EUR 3.7bn, the EIC Fund, where he specializes in venture and growth investments in AI, semiconductors and quantum computing across Europe. He is a former award winning circular economy entrepreneur and an engineering graduate of the Arts et Metiers ParisTech and the University of Michigan.
Abstract:
Explore Europe's key role in financing deep tech startups through the EIC Fund (European Innovation Council Fund) and EIB (European Investment Bank) Venture Debt program. This keynote will cover their current financing offerings, strategic direction, and growth prospects in funding capacity, with a particular focus on the semiconductor sector. Attendees will discover how these institutions drive innovation and support Europe's economic growth.
Shaping What’s Next
Michael Tchagaspanian
EVP Strategic Partnership, CEA-Leti
Michael Tchagaspanian
EVP Strategic Partnership, CEA-Leti
François Legrand
Communication Manager, IRT Nanoelec
Makoto Motoyoshi
President & CEO, Tohoku-MicroTec
Makoto Motoyoshi
President & CEO, Tohoku-MicroTec
Bio:
Makoto Motoyoshi, Ph. D., is CEO of Tohoku-MicroTec Co., Ltd.
1982~1989, at Hitachi, Ltd.; R&D of SRAM process integration
1989~1992, at Kawasaki Steel Corporation, R＆D of SRAM device and Logic process integration
1992~2005, at Sony Corporation, R&D of SRAM, BiCMOS SRAM and Cache SRAM process integration.
From 2001 to 2005, R&D of MRAM, STT-RAM, FeRAM, RRAM and 3D stacked Image Sensor
2005, at ZyCube(3D start up),
2010, Established T-Micro
Abstract:
T-Micro is a development-oriented foundry specializing in 3D-ICs. We are capable of prototyping 3D-ICs ranging from 12-inch wafer-level to chip-level. In this presentation, in addition to our existing technologies, we will introduce fine-pitch bump interconnects using gold bumps and our chip-level 3D integration services.
Joost van Beek
CTO, XIVER
Joost van Beek
CTO, XIVER
Bio:
Joost van Beek has been active in Micro Systems technology for over 20 years. During his career, he held scientific positions related to these fields at the Massachusetts Institute of Technology, University of California at Berkeley, Philips Research Laboratories, and NXP Semiconductors.
Apart from his extensive research experience, he also had the opportunity at Philips and NXP to gain expertise in process and product release for volume manufacturing. Joost joined the Philips MEMS foundry in 2020 and was closely involved in the spin-out to XIVER in 2025. He has been a member of the leadership team since 2022. Currently, he is CTO of XIVER.
Joost received a MSc degree in Applied Physics from the Technical University Eindhoven, and a PhD degree in Electrical Engineering from the Catholic University Leuven. He is co-author of over 50 scientific papers and holds 25 granted patents.
Abstract:
Turning a breakthrough micro systems design into stable, high-yield production takes more than innovation—it demands an industrial partner with decades of expertise and the agility to adapt to your unique technology and evolving needs. At XIVER, we provide you exactly that.
Whether you are industrializing disruptive concepts in Semicon Equipment, IR technologies, Optical Communication, or Ultrasound Imaging, we bring the highest-skilled specialists and our state-of-the-art 8-inch wafer fab to move your road map forward.
Cindy Liotard
Deputy Head of Sustainable Electronics Program, CEA-Leti
Cindy Liotard
Deputy Head of Sustainable Electronics Program, CEA-Leti
Bio:
Coming soon
Abstract:
The semiconductor industry underpins global digital transformation, with the ICT market expected to double by 2030 due to advances in AI, 5G, and cloud computing. A fundamental shift toward more resilient, sustainable, and circular manufacturing models is required to enable this growth. Key challenges include reducing water, gas, and metal consumption, minimizing PFAS dependence, and improving effluent circularity.
Attendees will hear how CEA-Leti’s comprehensive sustainability roadmap spanning the entire semiconductor value chain will integrate process innovation with system-level optimization to drive measurable environmental impact reduction. The SubFAB Labs initiative, developed in collaboration with International SubFAB Research Labs (ISRL), is a central pillar of the roadmap. This four-year program, which can be extended, will evaluate the subfab environment, from process to final waste treatment by improving material use, abatement strategy and global effluent? circularity. The aim is to reduce costs and global environmental impact.
Marc Engel
CEO, Agileo Automation
Marc Engel
CEO, Agileo Automation
Bio:
Marc ENGEL is the CEO and Co-Founder of Agileo Automation, a French software company specializing in equipment control and connectivity for the semiconductor industry. With over 25 years of experience in industrial automation, Marc started his career as an engineer working on robotics and tool control at such OEMs as RECIF Technologies. As company CEO since 2010, he has led and driven the development of A²ECF-SEMI, a modular equipment automation framework used by OEMs worldwide to integrate SECS/GEM, GEM300, OPC UA, EDA, and Industry 4.0 capabilities.
At the intersection of automation and digital transformation, Marc has been involved in research and innovation projects supporting the adoption of digital twins, model-driven development, and edge-to-cloud architectures for production equipment. He also supports start-ups and established OEMs in defining automation strategies and implementing SECS/GEM interfaces for successful fab deployment.
Abstract:
As tier-one fabs move toward sub-ångström nodes and complex 3D AI chip architectures, legacy protocols can no longer handle the required data velocity. This session explores why Equipment Data Acquisition (EDA / Interface A) has evolved from an optional feature to a mandatory requirement for both standard front-end and advanced packaging OEMs. We will highlight the transition from SOAP-based Freeze 2 to the high-performance gRPC Freeze 3, enabling the "zero-defect" precision and high-frequency sensor modeling essential for modern yield. Attendees will learn how standardized data structures transform equipment into AI-ready assets, ensuring seamless integration into the data-driven ecosystems of 2026.
Guillaume Granet
Microelectronics global account manager, Keysight Technologies
Guillaume Granet
Microelectronics global account manager, Keysight Technologies
Bio:
Guillaume Granet is a Senior Account Engineer with more than 12 years of experience in the RF and test & measurement industry. After seven years in R&D at Safran as an RF Engineer, he joined Keysight Technologies, where he spent five years supporting customers as a Support and Application Engineer. He now leverages strong technical expertise and hands‑on experience to help key accounts address complex measurement challenges and optimize their solutions.
Abstract:
The rapid acceleration of AI adoption is redefining infrastructure requirements across compute, memory, and networking. As AI models increase in scale and complexity, performance and reliability depend on holistic system validation. This inflection point extends beyond raw bandwidth: training and inference workloads are increasingly constrained by latency, synchronization, concurrent access to shared resources, and large scale data movement. In parallel, higher density silicon, advanced packaging, and heterogeneous integration introduce new design trade-offs and failure modes.
This talk explores key challenges shaping modern AI infrastructure, including scaling compute and memory architectures, sustaining predictable network performance, and managing multiple points of failure across complex systems. It examines the full life-cycle from pre-silicon architecture and modeling to packaging and post-silicon validation highlighting where bottlenecks emerge and how the industry is evolving to support AI systems.
Swan Gerome
RF & Telecommunications Industrial Partnership Manager, CEA-Leti
Swan Gerome
RF & Telecommunications Industrial Partnership Manager, CEA-Leti
Bio:
Swan GEROME is Technology Partnership Manager within the Systems Department, with a focus on RF and Telecommunications at CEA-Leti.
He holds a degree in Marketing and Sales Management from Grenoble IAE and has over 15 years of experience in the semiconductor industry across materials, design, and research companies.
From 2008 to 2014, he served as Sales Manager at Dolphin Integration, developing business for ASIC design, analog silicon IP, and libraries for foundries, fabless companies, design houses, and OEMs. He also managed a team of sales coordinators in Asia (Japan, South Korea, and Taiwan) as well as in Europe.
He joined CEA-Leti in 2015 as Industrial Partnership Manager for the Systems Department, covering sensor integration, energy management, embedded data processing, and RF telecommunications (antenna design and integration, protocols development, and RFIC design). In this role, he developed partnerships with national and international companies, ranging from startups to Big Tech.
Between 2022 and 2023, he was Product Marketing Manager for the Connect-SOI Business Unit at Soitec, where he developed the roadmap for engineered silicon substrates for RF applications and launched new products to address market requirements.
Abstract:
Harnessing dielectric permittivity the property that describes how electric fields propagate through matter CEA‑Leti researchers have built a non‑invasive, chip‑scale technology that maps the hidden electrical signatures of cells and materials.
The device emits radio‑frequency from 30KHz to 30GHz, captures transmitted and reflected signals, and decodes them with a silicon‑integrated vector network analyzer (VNA). This yields an ultra‑miniaturized, low‑cost, low‑power, wide‑band system that can be embedded in portable and wearable devices.
This session will show how CEA-Leti enables non-invasive detection across multiple sectors, such as health care, wellness, agri-food, and automotive by converting dielectric permittivity maps into actionable insights. The technology unlocks a world of applications ranging from cancerous-cell detection, hydration monitoring, process monitoring, and proximity detection.
Jérôme Boutant
Senior Sales Account Manager, ACCRETECH Europe
Jérôme Boutant
Senior Sales Account Manager, ACCRETECH Europe
Bio:
ACCRETECH (Europe) GmbH Jerome Boutant has over 20 years of experience in the semiconductor industry, specializing in high-precision equipment and fully automated manufacturing solutions.
Throughout his career, Jerome has partnered with leading semiconductor and materials manufacturers across Europe.
He is known for bridging technical understanding with business strategy, leading multinational projects and managing key accounts.
Jerome holds an Engineer degree in Semiconductor Materials and technologies from INSA.
Abstract:
As the semiconductor industry advances toward smart manufacturing and supply chain resilience, backend automation is emerging as a key enabler of yield, flexibility, and competitiveness. This presentation shows how ACCRETECH supports this shift with wafer probing and dicing automation. We showcase real-world use cases of the fully automated AP3000 prober and AD3000T-Plus dicer, which eliminate manual handling, increase throughput, and enhance process stability, repeatability, and product quality, while also reducing errors, cycle times, and resource use.
Artem Shalimov
Senior Scientist, Rigaku Europe SE
Artem Shalimov
Senior Scientist, Rigaku Europe SE
Bio:
Dr. Artem Shalimov has been working at Rigaku Europe since 2012 and currently holds the position of Senior XRD Scientist. He received his MSc degree in Materials Science and Solid‑State Physics from Donetsk National University (Ukraine) and obtained his PhD from the Institute of Physics, Polish Academy of Sciences (Warsaw, Poland), specializing in the structural characterization of semiconductor layers with a strong focus on defect‑structure evaluation using X‑ray diffraction methods. His postdoctoral experience includes research work at the Group of Multifunctional Materials at Helmholtz‑Zentrum Dresden‑Rossendorf and a position as a beamline scientist at the European Synchrotron Radiation Facility (ESRF). Dr. Shalimov has extensive expertise in a broad range of X‑ray scattering techniques, with primary emphasis on semiconductor applications and XRD‑based metrology.
Abstract:
Rigaku introduces the TFXRD Series, a new generation of high‑precision, non‑destructive XRD metrology tools for 200 mm and 300 mm wafers, enabling fast full‑wafer mapping of thin‑film and epitaxial structures. With a high‑precision θ–2θ goniometer, large‑area XY stage, and high-flux X‑ray source, the system delivers accurate measurements of thickness, composition, strain, and crystallographic orientation. Advanced optics and fast 1D/2D detectors provide excellent data quality and throughput. TFXRD enables rapid, automated characterization of HEMT structures, power‑device materials, and multilayer quantum‑technology films. Combining lab‑grade precision with manufacturing‑ready performance, the TFXRD Series accelerates process optimization and elevates wafer‑level metrology for next‑generation semiconductor development.
Roy Pinhassi
Metrology Director, Camtek Metrology
Roy Pinhassi
Metrology Director, Camtek Metrology
Bio:
Dr. Roy Pinhassi is a Metrology Director at Camtek,specializing in enabling high-yield manufacturing for HBM, chiplet architecture and heterogeneous integration through metrology-driven process control.
Previously, Dr. Pinhassi held senior business and product leadership roles at Nova Ltd and Applied Materials, where he led product strategy, customer engagements, and expansion of advanced process technologies into new markets.
He holds a Ph.D. from Technion and has published research in leading scientific journals. Dr. Pinhassi’s work focuses on bridging deep technology innovation with scalable, high-volume semiconductor manufacturing
Abstract :
The semiconductor packaging industry is accelerating beyond 2026, driven by AI, automotive, and data center demands. Advanced packaging - interposers, chiplets, and FOPLP - is becoming essential for higher performance and power efficiency.
Camtek's metrology solutions support this shift with a flexible, modular metrology platform (SurfaceSens) that covers the full range from R&D to HVM and from front- to back-end.
Key applications include thickness and shape measurement, CD/overlay control, RDL analysis, TSV depth/CD, RST, and large-field (nano)topography for CMP and hybrid bonding.
Adaptable handling enables full automation for all wafer sizes and panel-level processing—ideal for future FO-PLP production.
Andres Fayt
Director, Semiconductor Sales, Thermo Fisher Scientific
Andres Fayt
Director, Semiconductor Sales, Thermo Fisher Scientific
Bio:
Andreas Fayt is Director EMEA Semiconductor Sales at Thermo Fisher Scientific, where he works with customers across the semiconductor, automotive, and clean energy industries throughout Europe. With a background in electrical engineering and an MBA from HHL Leipzig Graduate School of Management, he combines technical expertise with international business leadership. Over the course of his career, he has held roles in engineering, strategic sales, and key account management, with a strong focus on semiconductor technologies, sensor systems, and clean energy applications. Prior to joining Thermo Fisher Scientific, Andreas held positions at Kulicke & Soffa and Oxford Instruments, supporting technology-driven markets across Europe.
Abstract:
As AI-driven semiconductor technologies advance, the shift to complex 2.5D and 3D packaging architectures is introducing new challenges in integration, reliability, and scalability. Traditional characterization and failure analysis approaches are no longer sufficient to address the speed and complexity of modern AI devices.
This session explores emerging failure mechanisms and analysis challenges in advanced packaging, and how innovations in materials characterization and failure analysis are enabling faster root-cause identification and improved yield. Attendees will gain insight into how end-to-end, data-driven approaches are helping transform semiconductor workflows and support more reliable AI systems.
Vincent Destefanis
Optical Sensors Industrial Partnership Manager, CEA-Leti
Vincent Destefanis
Optical Sensors Industrial Partnership Manager, CEA-Leti
Bio:
Vincent Destefanis is a Partnership Manager for the Optics and Photonic division of CEA-Leti since 2023. Since 2006, he was successively a R&D engineer, a senior technical expert and a partnership manager, this for various leading-edge photonic and CMOS companies (Lynred, STMicroelectronics and IBM).
He holds Master's and Engineering degrees in Electronics, Physics and Materials Science. During his career, Vincent has been successful in creating long-term value in the CMOS and photonic industries, from various valuable contributions to industrial projects and partnerships.
Vincent is now dedicated to the development of industrial partnerships for the development and tech transfer to industry of beyond the state of the art photonic sensing solutions addressing a wide scope of applications.
Abstract:
Global demand for accurate non-invasive glucose monitoring remains unmet, because most wearable technologies fail to deliver the required clinical performance. CEA-Leti offers a device breakthrough with mid-infrared quantum cascade laser (QCL) photoacoustic technology on silicon. Operating in the mid-IR spectrum, it provides the specificity and sensitivity needed for real-time biomarker tracking without invasive sampling.
Engineered for large-scale semiconductor manufacturing, the system ensures cost-effectiveness and significant scalability. Its retunable architecture allows a single hardware design to detect diverse biomarkers across medical and industrial sectors. The institute aims to accelerate time-to-market through this multilateral industrial program.
This initiative reshapes non-invasive monitoring, enabling next-generation smart wearables like smartwatches for sport, wellness, and health. By translating this breakthrough into low-cost devices, CEA-Leti opens pathways for detecting crucial biomarkers and molecules beyond glucose, addressing global consumer demand, while overcoming previous technological limitations.
Optical Interconnects
Eléonore Hardy
Silicon Photonics Partnership Manager, CEA-Leti
Eléonore Hardy
Silicon Photonics Partnership Manager, CEA-Leti
Éléonore Hardy joined CEA-Leti in 2018 as a partnership manager specializing in silicon photonics. She holds a Master’s degree in Engineering and has completed a Master of Science in Management & Innovation. With over 20 years of experience in the optics and photonics industry, Éléonore has held key positions at Philips in the Netherlands and Varioptic, a business unit of Corning, in China.
Throughout her career, Éléonore has demonstrated a proven track record of creating long-term value. She successfully developed laser technologies in France, China, and India for Quantel (now Lumibird) and advanced spectrometer solutions in Europe and Asia for Resolution Spectra Systems (now part of Merck).
Currently, Éléonore is focused on identifying and developing new business opportunities in silicon photonics, with a particular emphasis on high-speed optical interconnects, high-performance computing (HPC), 3D sensing, and advanced computing technologies such as neuromorphic computing and quantum photonics.
Frédéric Hameau
Research Engineer & Project Manager, CEA-Leti
Frédéric Hameau
Research Engineer & Project Manager, CEA-Leti
Bio:
Frédéric Hameau received the M.S. degree from ENSEIRB, Bordeaux, France, in 2001. He joined CEA-LETI, Grenoble, France, as a radio-frequency research engineer. Over the past 23 years, he has contributed to the development of radio-frequency system-on-chip (SoC) technologies, covering ultra-low-power, ultra-wideband, and millimeter-wave applications. In this field, he is the author or coauthor of more than 28 conference papers, four IEEE journal articles, and 12 patents. He currently leads the optical-link activity within the CEA Radio-Frequency Laboratory, where he contributes to the development of application-specific integrated circuits (ASICs) for high-speed, low-power optical communications.
Sylvie Gellida
General Manager, Optical and RF Foundry Division, STMicroelectronics
Sylvie Gellida
General Manager, Optical and RF Foundry Division, STMicroelectronics
Bio:
Sylvie Gellida is STMicroelectronics’ General Manager, responsible for the Optical and RF Foundry Division, belonging to RF and Optical Communication product sub-group since January 2025.
Sylvie Gellida started her career as RF design engineer in Dolphin before joining ST Grenoble in 2000. In 2006, she joined the Foundry team as technical support and program manager, extended to marketing next, to sell ST differentiated RF silicon technologies. In 2021, she took the leadership of the mmW products Business Unit, as well as the RF technologies strategy position, encompassing the Silicon Photonics technology and business development from 2023. Since January 2025, Sylvie has been leading the Optical and RF Foundry Division, covering optical interconnects, LEO satellites communications and mmW markets.
Abstract:
Enabling energy-efficient data centers requires a fundamental shift from copper-based electrical links to high-bandwidth, low-loss optical connectivity. This talk will present ST’s silicon photonics strategy and the role of the PIC100 platform in replacing copper with integrated SiPho solutions for next-generation data center and AI interconnects. By combining differentiated Silicon Photonics, BiCMOS platforms in advanced packaging technologies, ST overcome the challenges of power efficient optical interconnects.
Yvain Thonnart
Chief Scientist, Digital Integrated Circuits and Systems Division, CEA-List
Yvain Thonnart
Chief Scientist, Digital Integrated Circuits and Systems Division, CEA-List
Bio:
Yvain Thonnart graduated from Ecole Polytechnique and Telecom Paris, France in 2005. He then joined the Technological Research Division of CEA, the French French Alternative Energies and Atomic Energy Commission, within the CEA-Leti institute until 2019, then within the CEA-List institute.
He has led the development of several large research projects for on-chip communications, focusing on the maturation of novel concepts towards industrial adoption, such as communication between multiple voltage and frequency domains, 3D-stacked circuits, and optical on-chip interconnects.
He is now a CEA fellow, and chief scientist for the digital ICs and systems division of CEA-List.
Abstract:
Today's optical interconnects are largely limited to static, point-to-point links, with initialization and training times ranging from microseconds to milliseconds. While suitable for board-level or rack-scale communication, those latencies prevent optical links from being used as a true networking fabric inside multi-die packages. We address this gap by integrating optical switching, routing control and high-speed logic directly with silicon photonics. The result is a dynamically routed optical interconnect that operates at nanosecond timescales, enabling optical communication across centimeter-scale interposers with responsiveness previously limited to short electrical links.
Yacine Halioua
Head of Product, NcodiN
Yacine Halioua
Head of Product, NcodiN
Bio :
Yacine Halioua holds a Ph.D. in Photonics from CNRS-C2N (Paris) and Ghent University (Photonics Research Group), where he researched hybrid III-V nano-lasers on silicon. He has since contributed to optical transceiver development for coherent communications at Oclaro (Lumentum) and Huawei (Caliopa), as well as development of hyperspectral imager for mobile applications at Spectricity. He currently serves as Head of Product at Ncodin, working on photonic solutions for die-to-die optical interconnects.
Abstract:
As AI accelerators push compute density to its physical limits, chiplet bandwidth has become the critical bottleneck. The
shoreline limit — the finite I/O capacity along a chip's edge — caps system throughput regardless of silicon progress, and
copper interconnects are running out of headroom in both reach and energy efficiency.
NcodiN's NConnect platform breaks this barrier by integrating the world's smallest nanolaser directly onto the interposer: a light source with a ~100 µm² footprint and sub-mW power consumption — 2 orders of magnitude below state-of-the-art laser sources. NConnect delivers the bandwidth density and power budget that next-generation chiplet architectures demand, on a path fully compatible with CMOS manufacturing.
Mark Fuselier
SVP, Technology and Product Engineering, AMD
Mark Fuselier
SVP, Technology and Product Engineering, AMD
Bio:
Mark Fuselier is senior vice president of Technology and Product Engineering al AMD. He is responsible for silicon and packaging technology development and new product introduction engineering. He played a central raie in the development and productization of computing solutions such as 2nm, multi-core CPU and GPU Soc integration, heterogenous APUs, 2.5D and 3D chip-packaging, and chiplet System in Package (SiP) integration. Fuselier holds a Master of Science degree in electrical engineering and Master of Business Administration from the University of Texas al Austin. He is a member of IEEE and the Electron Devices Society.
Abstract:
Fuselier will walk the audience through a systems-level cc-design approach that treats optics as a first-class element of advanced stacked and chipie! architectures (hybrid-bond 3D, 2.5D interposers, panel scaling). He will demonstrate the practical tradeoffs - thermal paths, power delivery (IVR), die-ta-die pitch and test strategies - and real examples of how tighter locality + optical offload reduces data-movement energy by orders of magnitude.
Patrick Le Maitre
Research Engineer, CEA-Leti
Patrick Le Maitre
Research Engineer, CEA-Leti
Bio:
Patrick Le Maitre received his engineering degree from CentraleSupélec in 2000 and a Master of Engineering from the Tokyo Institute of Technology in 2001. He began his career at Renesas Technology, where he focused on semiconductor design and development. He then joined NXP Semiconductors, contributing to RF transceiver design. In 2010, he moved to STMicroelectronics and worked on the development of a silicon photonics platform Since 2019, he has been a research engineer at CEA-LETI, specializing in the development of GaN-based emissive devices for microdisplay and optical communication applications.
Abstract:
We present a development pathway for short-range optical chip-to-chip communication using GaN-on-Si microLED and microPD arrays integrated with CMOS. The approach combines device and circuit optimization, hybrid bonding, and system modeling, enabling scalable, energy-efficient interconnects for next-generation computing architectures.
Henri van Helleputte
Head of Business Development Europe and Unites States, ASML
Henri van Helleputte
Head of Business Development Europe and Unites States, ASML
Bio:
Henri is part of ASML’s Customer Team EU/US technology organization, focusing on technology strategy and business development for mainstream TWINSCAN lithography systems. In this role, he partners with customers across Europe and the United States on future technology roadmaps, application challenges, and operational requirements, working with the broader ASML organization to translate customer needs into improvements in products and services.
Since 2019, Henri has led business development for ASML’s dry TWINSCAN systems, building on earlier contributions across different business line —including significant growth in the 200 mm TWINSCAN business.
Prior to ASML, Henri spent 18 years at Philips in the Netherlands and the United States, holding management roles in Research, Design & Engineering, and Sales. He joined ASML in 2006 and has worked on PAS5500 and TWINSCAN platforms.
Henri obtained an MSc in Physics (Drs.) from Utrecht Rijks University (the Netherlands).
Abstract:
The rapid growth of AI workloads is pushing data‑center energy consumption to its limits, accelerating the transition from electrical to optical interconnects. Silicon photonics, integrated lasers, and emerging microLED‑based communication architectures are key to sustaining bandwidth scaling while improving energy efficiency. As these technologies mature, lithography variability—rather than resolution—has become a dominant factor in optical loss, yield, and system‑level power efficiency. This keynote presents an optical-lithography‑centric view of optical interconnect scaling, framed by the ASML holistic triangle of scanner capability, process optimization, and design co‑optimization. Through concrete examples, the talk illustrates how resist selection and imaging conditions influence line‑edge roughness (LER) in critical photonic layers, and how LER directly impacts optical performance and energy efficiency. It further discusses practical methods to quantify LER and pattern variability using high‑throughput HMI metrology, enabling tighter process control. Finally, the use of curvilinear OPC is demonstrated as an effective design‑technology co‑optimization approach to mitigate LER‑induced variability without pushing resolution limits. Together, these examples highlight lithography as a system‑level enabler for energy‑efficient optical interconnects in AI data centers.
Paul Slaby
Managing Director, Canada’s Semiconductor Council & Leader in Canada’s Semiconductor and Photonics Ecosystem
Paul Slaby
Managing Director, Canada’s Semiconductor Council & Leader in Canada’s Semiconductor and Photonics Ecosystem
Disruptive Digital Interfaces
Philippe Caillol
Innovation Director, CEA
Philippe Caillol
Innovation Director, CEA
Bio:
Philippe Caillol is a professional in innovation and technological foresight with over 20 years of experience. After several years in the construction and media sectors within the Bouygues Group developing new products and services, he joined the CEA (A French Research and Technology Organisation) in 2012 to lead technology exploration teams. Since 2024, he has been the Director of Innovation within the CEA's Technological Research Division, where he oversees a team conducting multidisciplinary prospective studies and innovation projects exploring future uses of advanced technologies.
Laurent Filhol
Deputy Innovation Director, CEA
Laurent Filhol
Deputy Innovation Director, CEA
Bio:
Laurent FILHOL has been Deputy Director of the Innovation Division within the CEA's Technology Research Department for three years. Prior to this, he worked for various international companies in the field of information technology and data centers before joining the CEA in 2016 to work on IT and digital projects.
Johannes Zellner
Head of Roadmap Technology, ZEISS SMT
Johannes Zellner
Head of Roadmap Technology, ZEISS SMT
Bio:
Dr. Johannes Zellner is Head of Roadmap Technology at ZEISS Semiconductor Manufacturing Technology (SMT). Since joining ZEISS in 2002, he has progressed from optical design and simulation of lithography lenses to leadership roles across ZEISS, including Team Lead Optical Design (SMT), Director Design Engineering (SMT Laser Optics), Director System Design Illumination (SMT), and Director Systems Design (Consumer Products). In his current role (since 2024), he drives research, early technology development and strategic innovation programs and contributes to shaping the ZEISS SMT strategy. He holds a PhD in Physics from the Karlsruhe University (now KIT).
Abstract:
The acceleration of AI is redefining what semiconductor technologies must deliver, from scaling to system‑level integration. As computational architectures evolve, shaping and controlling light becomes increasingly central to enabling further progress. Advances in patterning, metrology, and integration are now essential not only for continued density gains but also for supporting new three‑dimensional approaches. At the same time, the growing pressure of the I/O wall highlights the need for fundamental changes in interface concepts. This talk outlines how optical innovation across these layers contributes to shaping the next era of AI.
Edgar Auslander
Senior Director, Strategic Partnerships, Wearables, AR, AI, Meta
Edgar Auslander
Senior Director, Strategic Partnerships, Wearables, AR, AI, Meta
Bio:
Edgar Auslander has more 35 years of experience serving at company Boards, startups, a VC, and Fortune 100 companies. As Senior Director of Strategic Partnerships at Meta, he initiated and drove the partnership with EssilorLuxottica resulting in Ray-Ban Meta smart glasses. He is the Founding Managing Partner at Menlo Business Partners and was one of the founders of Texas Instruments' Wireless Business, bringing it from scratch to $5B/year. A former Faculty Member at Stanford University and the EDHEC Business School, he teaches Management of Change and Business Negotiation classes at UC Berkeley Extension. A Senior Member of IEEE, he is a Kauffman Fellow and holds an MBA from Columbia University, and an MEEng. from Cornell University.
Agnieszka Thonet
Senior Director of Technology, HP
Agnieszka Thonet
Senior Director of Technology, HP
Bio:
Agnieszka has over 23 years of digital transformation and product innovation experience. Recognized as a thought leader in emerging technologies and trends, she has a strong track record of managing and aligning global high performance multicultural teams to deliver strategic value.
Over the past 16 years she has held multiple technical and management roles across HP businesses. As Senior Engineering Director, she drove the delivery of full stack software on devices and to Enterprise customers. As Head of Innovation Partnerships, she gathered and led cross-industry, multidisciplinary research experts to create open collaboration models that unleashed impactful innovation. Her breadth of knowledge ranges from electronics and communication systems to digital manufacturing and complex cyber-physical architectures.
Fluent in four languages, she holds a MSc in Communication Systems Engineering from the University of the Basque Country in Spain.
Thimothée Silvestre
Foresight Expert, CEA
Thimothée Silvestre
Foresight Expert, CEA
Bio:
After studying Biotechnology Engineering, Timothée SILVESTRE worked as a biologist at the Swiss Institute for Experimental Cancer Research (ISREC) in Lausanne, and then as a research engineer at the Lyon Bioinformatics Center (CNRS), after obtaining a degree in Computer Engineering. After working on genetic sequence alignment algorithms as part of the European DATAGRID computing grid project led by CERN, he earned an MBA at IAE Lyon3. After serving as an innovation expert in sustainable construction at ARIST (Burgundy Chamber of Commerce), he led the SPORALTEC cluster specializing in sports innovation. He joined CEA in 2015 as head of the Ideas Laboratory, which he directed for 4 years, and is currently focusing on technology monitoring and foresight missions within CEA Y spot.
Abstract:
At Y SPOT, the open innovation center of CEA Grenoble, we believe that true disruption occurs at the crossroads of sectors. By leveraging the collective intelligence of CEA’s experts in digital, energy, and health, we have developed a unique 'Wide-Angle' approach to identify the technologies that will redefine our society. This presentation invites you to broaden your peripheral vision and embrace serendipity by exploring a landscape where Physical AI and robotics, the evolution of Datacenters, the rise of OpenHardware, and the frontier of Bio-computing intersect. Whether these shifts are already impacting our industries or shaping a long-term future, our goal is to provoke a shift in perspective, allowing you to think differently and anticipate the next wave of transformation
Bertrand Piccard
Serial explorer, psychiatrist, and pioneer of efficient technologies, Solar Impulse Foundation
Bertrand Piccard
Serial explorer, psychiatrist, and pioneer of efficient technologies, Solar Impulse Foundation
Abstract:
Born and raised to challenge common assumptions and to achieve the impossible, Bertrand Piccardcomes from a legendary family of explorers and scientists who reached both the stratosphere and the abyss. He made history by achieving two pioneering firsts in aviation: around-the-world non-stop in a balloon, and more recently, in a the solar-powered airplane without fuel.
To further promote efficient energy solutions and clean technologies, he is now preparing the first non-stop, zero-emission circumnavigation aboard a green hydrogen-powered aircraft.
With his unique dual identity as a psychiatrist and an explorer, Bertrand Piccard is today a trusted voice for major institutions, recognised as a thought leader on innovation
