Join us in Dresden, Germany from June 17-19 for the SEMI 3D & Systems Summit 2026, themed Enabling Next-Gen Heterogeneous Systems Integration, the Summit brings together semiconductor packaging leaders to explore the strategies and technologies driving next-generation heterogeneous systems integration.
Join us in Grenoble, France, on June 22, 2026 for the FerroFutures Workshop to uncover the game-changing potential of HZO, a new ferroelectric material, for memory and beyond. Hear from experts at every stage (materials, devices, and applications) in talks and a lively roundtable debate.
In the wake of the LID World Summit 2026, the Quantum Technologies Deep Dive event takes the conversation further into quantum innovation. Organized by the quantum Hub, the innovation player of Maison du Quantique Alpes, this event will bring an overview of the different paths forward to building a quantum computer.