Bio:

Alexandre Shirakawa is Vice President of Engineering at Skyworks Solutions, where he leads the acoustic RF filter technologies. His work spans bulk acoustic wave (BAW) and surface acoustic wave (SAW) platforms, with a focus on enabling future connectivity applications. With over two decades of experience in RF and acoustic technologies, Alexandre has held senior engineering leadership roles at Skyworks, Qualcomm, and Broadcom (Avago Technologies), driving technology roadmaps from early research through high volume manufacturing. He began his career at CEA Leti, working at the intersection of device physics and system integration.

Abstract:

RF front-end innovation sits on both sides of the AI factory transformation: it enables the robust, low-latency, energy-efficient connectivity required by sensor-rich, automated manufacturing environments, while also benefiting from AI factories as learning engines for semiconductor commercialization. As AI factories scale, dense networks of tools, robots, sensors, edge devices, and control systems will place new demands on RF front-end performance, integration, coexistence, and reliability. At the same time, RF front-end products must move rapidly from lab breakthroughs in materials, processes, design, and packaging to high-volume manufacturing, especially in mobile markets where product lifecycles are compressed and much of the lifetime volume is produced early in the ramp. This keynote will explore how AI-enabled data loops across design, simulation, process, equipment telemetry, metrology, test, reliability, and failure analysis can steepen the RF yield-learning curve, reduce scrap, shorten qualification cycles, and improve the sustainability of semiconductor commercialization