Bio:

Dr. Artem Shalimov has been working at Rigaku Europe since 2012 and currently holds the position of Senior XRD Scientist. He received his MSc degree in Materials Science and Solid‑State Physics from Donetsk National University (Ukraine) and obtained his PhD from the Institute of Physics, Polish Academy of Sciences (Warsaw, Poland), specializing in the structural characterization of semiconductor layers with a strong focus on defect‑structure evaluation using X‑ray diffraction methods. His postdoctoral experience includes research work at the Group of Multifunctional Materials at Helmholtz‑Zentrum Dresden‑Rossendorf and a position as a beamline scientist at the European Synchrotron Radiation Facility (ESRF). Dr. Shalimov has extensive expertise in a broad range of X‑ray scattering techniques, with primary emphasis on semiconductor applications and XRD‑based metrology.

Abstract:

Rigaku introduces the TFXRD Series, a new generation of high‑precision, non‑destructive XRD metrology tools for 200 mm and 300 mm wafers, enabling fast full‑wafer mapping of thin‑film and epitaxial structures. With a high‑precision θ–2θ goniometer, large‑area XY stage, and high-flux X‑ray source, the system delivers accurate measurements of thickness, composition, strain, and crystallographic orientation. Advanced optics and fast 1D/2D detectors provide excellent data quality and throughput. TFXRD enables rapid, automated characterization of HEMT structures, power‑device materials, and multilayer quantum‑technology films. Combining lab‑grade precision with manufacturing‑ready performance, the TFXRD Series accelerates process optimization and elevates wafer‑level metrology for next‑generation semiconductor development.