Bio:

Dr. Roy Pinhassi is a Metrology Director at Camtek,specializing in enabling high-yield manufacturing for HBM, chiplet architecture and heterogeneous integration through metrology-driven process control.
Previously, Dr. Pinhassi held senior business and product leadership roles at Nova Ltd and Applied Materials, where he led product strategy, customer engagements, and expansion of advanced process technologies into new markets.
He holds a Ph.D. from Technion and has published research in leading scientific journals. Dr. Pinhassi’s work focuses on bridging deep technology innovation with scalable, high-volume semiconductor manufacturing

Abstract :

The semiconductor packaging industry is accelerating beyond 2026, driven by AI, automotive, and data center demands. Advanced packaging - interposers, chiplets, and FOPLP - is becoming essential for higher performance and power efficiency.
Camtek's metrology solutions support this shift with a flexible, modular metrology platform (SurfaceSens) that covers the full range from R&D to HVM and from front- to back-end.
Key applications include thickness and shape measurement, CD/overlay control, RDL analysis, TSV depth/CD, RST, and large-field (nano)topography for CMP and hybrid bonding.
Adaptable handling enables full automation for all wafer sizes and panel-level processing—ideal for future FO-PLP production.