Bio:

Andreas Fayt is Director EMEA Semiconductor Sales at Thermo Fisher Scientific, where he works with customers across the semiconductor, automotive, and clean energy industries throughout Europe. With a background in electrical engineering and an MBA from HHL Leipzig Graduate School of Management, he combines technical expertise with international business leadership. Over the course of his career, he has held roles in engineering, strategic sales, and key account management, with a strong focus on semiconductor technologies, sensor systems, and clean energy applications. Prior to joining Thermo Fisher Scientific, Andreas held positions at Kulicke & Soffa and Oxford Instruments, supporting technology-driven markets across Europe.

Abstract:

As AI-driven semiconductor technologies advance, the shift to complex 2.5D and 3D packaging architectures is introducing new challenges in integration, reliability, and scalability. Traditional characterization and failure analysis approaches are no longer sufficient to address the speed and complexity of modern AI devices.
This session explores emerging failure mechanisms and analysis challenges in advanced packaging, and how innovations in materials characterization and failure analysis are enabling faster root-cause identification and improved yield. Attendees will gain insight into how end-to-end, data-driven approaches are helping transform semiconductor workflows and support more reliable AI systems.