LID World
Summit
June 23-25, 2026 | Grenoble, France
CEA-Leti’s
flagship event
Discover sustainable semiconductor breakthroughs to guide your roadmap from lab-to-market and to tomorrow’s AI factory at LID World Summit 2026.
Join industry leaders to discover groundbreaking innovation that will help meet technological goals for the healthcare, automotive, industrial, defense, and consumer-electronics sectors. Leave with confidence in the possible.
8:30
9:30
10:00
12:00
12:30
2:30
3:30
4:30
5:00
6:00
Tuesday June, 23
Welcome Coffee
Exhibitions & business meetings
throughout the day
Plenary Session
CxOs Talks
Lunch
Exhibitions & business meetings
throughout the day
Plenary Session
CxOs Talks
Coffee break
Exhibitions & business meetings
throughout the day
starting at 6:30 p.m.
Evening Reception
Elixir & Gastronomy
Registration is mandatory
Wednesday June, 24
Welcome Coffee
Exhibitions & business meetings
throughout the day
Lunch
Exhibitions & business meetings
throughout the day
Coffee break
Exhibitions & business meetings
throughout the day
starting at 6:45 p.m.
Evening Reception
Château de Sassenage
Registration is mandatory
Thursday June, 25
Welcome Coffee
Exhibitions & business meetings
throughout the day
Lunch
Exhibitions & business meetings
throughout the day
Closure of the exhibitions at 04:00 p.m.
Plenary Session
Disruptive Digital Interfaces
Plenary Session
Special Guest Closure
Tuesday June, 23
Doors open at 8:30 a.m.
Welcome Coffee
Exhibitions & business meetings
throughout the day
10:00 a.m. – 12:30 p.m.
Plenary Session
CxOs Talks
Lunch
Exhibitions & business meetings
throughout the day
2:30 p.m. – 5:00 p.m.
Plenary Session
CxOs Talks
Coffee break
Exhibitions & business meetings
throughout the day
starting at 6:30 p.m.
Evening Reception
Elixir & Gastronomy
Registration is mandatory
Wednesday June, 24
Doors open at 8:30 a.m.
Welcome Coffee
Exhibitions & business meetings
throughout the day
9:30 a.m. – 12:00 p.m.
Data and Network
—
Cloud Convergence
9:30 a.m. – 12:00 p.m.
Semiconductors
for Defense
9:30 a.m. – 12:00 p.m.
ChipsAct 1
The Fames
Pilot Line
Lunch
Exhibitions & business meetings
throughout the day
2:30 p.m. – 4:30 p.m.
Semiconductors
for Computing
2:30 p.m. – 4:30 p.m.
Cybersecurity
2:30 p.m. – 4:30 p.m.
ChipsAct 2
Resolve
Initiative
Coffee break
Exhibitions & business meetings
throughout the day
starting at 6:45 p.m.
Evening Reception
Château de Sassenage
Registration is mandatory
Thursday June, 25
Doors open at 8:30 a.m.
Welcome Coffee
Exhibitions & business meetings
throughout the day
9:30 a.m. – 12:00 p.m.
Optical
Interconnects
9:30 a.m. – 12:00 p.m.
Tech Talks:
Shaping What’s Next
9:30 a.m. – 12:00 p.m.
Startups
& Investments
Lunch
Exhibitions & business meetings
throughout the day
2:30 p.m. – 3:30 p.m.
Plenary Session
Disruptive Digital Interfaces
3:30 p.m. – 4:30 p.m.
Plenary Session
Special Guest Closure
Closure of the exhibitions at 04:00 p.m.
Designed to bring you
maximum value
High-level speakers
Latest technologies
Business meetings
Networking
represented
partners, and exhibitors
Meet some of the keynote speakers
Tim Breen
Chief Executive Officer, GF
Tim Breen
Chief Executive Officer, GF
Bio:
Tim Breen is Chief Executive Officer (CEO) of GF, a position he was appointed to in 2025, having joined the company in 2018.
Prior to becoming CEO, Mr. Breen served as GF’s Chief Operating Officer (COO), overseeing the company’s global operations, including the manufacturing, quality, supply chain and digital transformation teams. Earlier in his tenure at GF he held various executive roles including leading strategy, business transformation and finance. Prior to joining GF, Mr. Breen served as a member of the senior leadership team of GF’s founding shareholder, Mubadala Investment Company (Mubadala). Earlier in his career, he was a partner with McKinsey & Company in Abu Dhabi.
Mr. Breen holds a Master of Business Administration degree from London Business School and is based in New York.
Audrey Charles
SVP Corporate Strategy & President, Lam Capital
Audrey Charles
SVP Corporate Strategy & President, Lam Capital
Bio:
Audrey Charles is senior vice president of corporate strategy and advanced packaging, and president of Lam Capital at Lam Research. In this position, she is responsible for leading the executive management team in the development of strategic priorities and key initiatives that support the company’s long-term profitable growth. She is also responsible for accelerating the company’s market-leading position in advanced packaging to deliver differentiated technology and support to customers. Additionally, Audrey oversees Lam’s Corporate Development team and investment arm, Lam Capital, which invests in disruptive companies that advance the semiconductor ecosystem through next generation industrial automation, technology and product innovation, and new market opportunities. She brings a broad base of experience to her role, including engineering, customer technology management and investor relations. Since joining Lam in 1995, she has served in a range of leadership positions including senior vice president of Global Human Resources and vice president of corporate initiatives. Audrey earned an M.B.A. from the MIT Sloan School of Management and a B.S. in applied physics from Dublin City University.
Takaki Murata
Senior Vice President & Executive Board member, MURATA
Takaki Murata
Senior Vice President & Executive Board member, MURATA
Bio:
Takaki Murata has been involved in technology development, accounting, planning, and business management at the Company and its group companies for many years and corporate management as a chief officer at business companies in the United States, accumulating a wealth of experience and a solid record of achievement. He has been elected as a Member of the Board of Directors because the Company expects that he will continue to strengthen the decision-making and supervisory functions of the Board of Directors.
Agnieszka Thonet
Senior Director of Technology, HP
Agnieszka Thonet
Senior Director of Technology, HP
Bio:
Agnieszka has over 23 years of digital transformation and product innovation experience. Recognized as a thought leader in emerging technologies and trends, she has a strong track record of managing and aligning global high performance multicultural teams to deliver strategic value.
Over the past 16 years she has held multiple technical and management roles across HP businesses. As Senior Engineering Director, she drove the delivery of full stack software on devices and to Enterprise customers. As Head of Innovation Partnerships, she gathered and led cross-industry, multidisciplinary research experts to create open collaboration models that unleashed impactful innovation. Her breadth of knowledge ranges from electronics and communication systems to digital manufacturing and complex cyber-physical architectures.
Fluent in four languages, she holds a MSc in Communication Systems Engineering from the University of the Basque Country in Spain.
Chih-I-Wu
President of Taiwan Semiconductor Association & VP, ITRI
Chih-I-Wu
President of Taiwan Semiconductor Association & VP, ITRI
Bio:
Dr. Chih-I Wu is President of Taiwan Semiconductor Association (TSIA). He is also the VP and Senior Technology Expert at Industrial Technology Research Institute (ITRI), as well as a professor in Graduate Institute of Photonics and Optoelectronics and Department of Electrical Engineering of National Taiwan University. He was the General Director of Electronic and Optoelectronic System Research Laboratories, ITRI, from 2015 to 2022. His research is mainly on 2D material and devices, organic optoelectronics, metal-semiconductor interfaces, and heterojunctions. Prior to joining NTU, he worked at Component Research Lab of Intel in the US from 2000 to 2004. His work at Intel was mainly on developing the advanced VLSI process technology, such as Cu and low k interconnects, metal gate materials, and atomic layer deposition process.
Dr. Wu got his B.S. degree from National Taiwan University and M.S. degree from Northwestern University, both in Physics. He received his Ph.D. from Princeton University in Electrical Engineering. Dr. Wu has published more than 200 journal papers, which have been cited for over ten thousand times.
Hajime Shoji
Corporate Executive Officer, Sumitomo Electric Group
Hajime Shoji
Corporate Executive Officer, Sumitomo Electric Group
Bio:
Hajime Shoji received the Ph.D. degree in electronic engineering from the University of Tokyo, and joined Fujitsu Laboratories in 1990. He moved to Eudyna Devices, a joint venture of Fujitsu and Sumitomo Electric in 2004, then after the change in organization, moved to Sumitomo Electric Industries, LTD. in 2009. He has been consistently leading the development of compound semiconductor materials and devices for photonic and microwave communications. Currently, he is serving as a general manager of the Transmission Devices Laboratories, and also as an executive officer of Sumitomo Electric.
Dr. Shoji is a senior member of the IEEE/Photonics Society, and a member of the Japan Society of Applied Physics (JSAP) and the Institute of Electronics, Information and Communication Engineers (IEICE). He has been also engaged in the management of many domestic and international conferences as a chair and a member of program/organization committees.
Dr. Atsuyoshi Koike
CEO, Rapidus corporation
Dr. Atsuyoshi Koike
CEO, Rapidus corporation
Bio:
ATSUYOSHI KOIKE established Rapidus Corporation, a Japanese advanced logic semiconductor company in August 2022. Prior to this role, Koike had served as President of Western Digital Japan since April 2018. Prior to joining Western Digital, he held the position of president and chief executive officer at Trecenti Technologies, Inc., as well as served as corporate chief engineer for Renesas Technology Corporation. Prior to that, he held senior manufacturing management and executive leadership positions at Hitachi, Ltd. Koike received the B.S. and M.S. in Materials Science and Engineering from Waseda University and Ph.D. in Electronic Engineering from Tohoku University.
Bill Chang
Co-founder, President & CTO, Density AI
Bill Chang
Co-founder, President & CTO, Density AI
Bio:
Bill Chang is the Co-founder, President, and Chief Technology Officer of DensityAI, a company focused on making AI infrastructure radically more efficient and sustainably scalable, by building the world's densest AI compute platform, integrating innovations across technology, chip and system architecture, software, and datacenter infrastructure.
Prior to founding DensityAI, Chang served as Chief System Architect at Tesla, where he was responsible for the design and architecture of the Dojo supercomputer, a vertically integrated high-performance AI training system. He led the development of the first production wafer-scale package technology, enabling machine learning training to scale to exaFLOP levels.
Before Tesla, Chang was at Apple, where he managed the transition of the Mac platform to Apple Silicon. Earlier in his career, he held various technical leadership roles at IBM Microelectronics spanning DRAM, CMOS technology development, and manufacturing, building deep expertise in silicon design and semiconductor process engineering.
Sébastien Dauvé
CEO, CEA-Leti
Sébastien Dauvé
CEO, CEA-Leti
Bio:
Sébastien Dauvé was named CEO of CEA-Leti effective on July 1, 2021, after more than twenty years of experience in microelectronics technologies and their applications, including clean mobility, medicine of the future, cybersecurity, and power electronics.
Sébastien Dauvé started his career at the French Armament Electronics Center, where he worked on developing synthetic-aperture radar. In 2003, he joined CEA-Leti as an industrial transfer manager and supervised several joint research laboratories, in particular with the multinational Michelin.
In 2007, Sébastien Dauvé became a laboratory manager, then head of an R&D department in the area of sensors applied to the Internet of things and electric mobility. During this time, he supported the dissemination of new technologies in industry, including the automotive industry (Renault), aeronautics, national defense (SAFRAN), and microchips with the industry leader Intel. He played an active role in the creation of start-ups in application fields ranging from health to infrastructure security, leading to dozens of new jobs. In 2016, he became Director of the CEA-Leti Systems Division.
From sensors to wireless communication, Sébastien Dauvé has played an active role in the digital transformation, focused on coupling energy frugality and performance. He has made cross-disciplinary approaches central to innovation by harnessing the expertise of talented teams with diverse backgrounds. Their goal is to provide technological tools for meeting the major societal challenges of the future.
Sébastien Dauvé is a graduate of the French Ecole Polytechnique and the National Higher French Institute of Aeronautics and Space (ISAE-SUPAERO).
Andrea Le Vot
Quantum Computing, Group Leader, Crédit Agricole
Elliot Mc Namera
SVP & Head of the 3D DUV, ASML
Sylvie Gellida
Optical and RF Foundry Division General Manager, STMicroelectronics
Jean-René Lèquepeys
Deputy Director and Chief Technology Officer, CEA-Leti
Jean-René Lèquepeys
Deputy Director and Chief Technology Officer, CEA-Leti
Bio:
Jean-René Lèquepeys received an engineering degree in 1983 from CentraleSupélec, a top French graduate engineering school at Paris-Saclay University, France. He taught physics during 2 years in Ouarzazate, Morocco.
He joined CEA, a French Research and Technology Office focusing on applied research, in Paris Saclay in 1985. He first worked at the laboratory of the Central Security Office, on the evaluation of means of detection and intrusion. Two years later, he was promoted head of this laboratory.
In 1993, he moved to Grenoble, France, and joined the System Division of CEA-Leti. He worked on different projects in the field of image processing and telecommunication technologies. In particular, he was responsible for the "Telecom, Communicating Objects and Smart Card" programs from 1999 to 2004.
In 2005, he took the responsibility of the Circuits Design Division at CEA-Leti (200 people). He launched new research activities at CEA such as a new laboratory in Aix-en-Provence, France, on the development of secured chips. In 2000, Jean-René Lèquepeys received the prestigious award from the french Société de l'Electricité, de l'Electronique et des technologies de l'information et de la communication (SEE) "Grand Prix de l'électronique Général Ferrié" for his work in the telecommunications field (he holds 15 patents).
In 2010, he launched a new division at CEA focusing on Electronic Architectures, Integrated Circuit Design and Embedded Software. He established the structure on two sites (Paris and Grenoble) and led the division twice in his career.
He rapidly got involved in the creation of the Silicon Components Division at CEA-Leti, and took the lead of it in 2011 managing 350 people. Division encompasses micro and nanoelectronics (SOI, nanodots, quantum, memories, 3D technologies, substrates), Micro Systems (sensor, actuator, radiofrequency components) and Power Components. He established the French Nano2022 Program for research funding in microelectronics.
In 2019, he was appointed Chief Technology Officer of CEA-Leti, overseeing Science, relations with the European Commission, Industrial Partnership and Strategic Program Management in the scope of the institute (2,000 people, ~€350m budget). He took the responsibility of the Microelectronic Program at CEA level, spearheading technological and upstream research in the field of semiconductor technologies. For the past 2 years, he has been strongly involved in the CEA-Leti Next Gen FD-SOI project in the frame of France2030 and has played a key role in European chips Act pilot line promoting FD-SOI and Gate All Around technologies.
Having dedicated his career to applied research, he is regularly invited as a keynote speaker in international semiconductor conferences.
Jean-René is also Vice President of ACSIEL, a professional trade union gathering industrial companies in the French electronic value chain, member of the Board of EPOSS, the European Technology Platform on Smart Systems Integration, a member of the Board of AENEAS, the Association for Europoean NanoElectronics Activities, and an expert consultant for the European Commission and French Research Agency
Juan Rey
CTO, Siemens EDA
Juan Rey
CTO, Siemens EDA
Bio:
Juan C. Rey returned to the Calibre Segment and was appointed as Sr. Vice President, Segment Leader/General Manager for Siemens EDA in April of 2025. Prior to his appointment as GM, Juan led the Central Engineering Solutions Team as part of a government program focused on 3D flows. He Transitioned to Central Engineering Solutions Team after serving as Vice President of Government Programs for Siemens EDA where he was responsible for defining technical programs to support government initiatives since 2023. Prior to his work with Government Programs, Juan held the roll of Vice President of Calibre Engineering. He joined Mentor Graphics in 2001 as Senior Engineering Director for Mentor?s industry-leading Calibre product line, directing all development activities for Calibre products, a role he performed until December 2021. Prior to his time at Mentor Graphics, Juan was Vice President of Engineering at Exend Corporation, managing all software development and quality activities. He joined Extend after serving as Engineering Director of Physical Verification at Cadence Design Systems. Earlier positions include Manager/Developer for Process Modeling and Parasitic Extraction at Technology Modeling Associates, Visiting Scholar/Science and Engineering Associate at Stanford University, Senior Research Engineer at INVAP, Argentina, and Associate Professor at Universidad Nacional del Comahue, Argentina. Juan holds a degree in Nuclear Engineering from Universidad Nacional de Cuyo, Argentina. The author or co-author of numerous papers and conference presentations, he serves on the Executive Technology Advisory Board of Semiconductor Research Corporation (SRC) and the UCLA Center for Domain-Specific Computing.
Stuart Knight
Corporate Executive Officer & President, HORIBA UK
Stuart Knight
Corporate Executive Officer & President, HORIBA UK
Bio:
Stuart Knight is President of HORIBA UK Ltd and a HORIBA Group Executive Corporate Officer, with more than three decades of experience in the global semiconductor industry. He began his career in 1992 in Hong Kong, working for a back‑end semiconductor equipment manufacturer, gaining first‑hand experience of high‑volume manufacturing environments in South East Asia.
After returning to Europe in 1998, Stuart joined HORIBA, where he helped establish and grow the company’s semiconductor portfolio, delivering process monitoring and control solutions for semiconductor process optimisation to customers across Europe and globally. He spent many years building HORIBA’s presence in the semiconductor segment before moving into senior executive leadership.
Today, Stuart contributes actively to European and global semiconductor strategy for the HORIBA Group, bringing a practical, manufacturing‑led perspective to industry discussions.
