Bio:

Mark Fuselier is senior vice president of Technology and Product Engineering al AMD. He is responsible for silicon and packaging technology development and new product introduction engineering. He played a central raie in the development and productization of computing solutions such as 2nm, multi-core CPU and GPU Soc integration, heterogenous APUs, 2.5D and 3D chip-packaging, and chiplet System in Package (SiP) integration. Fuselier holds a Master of Science degree in electrical engineering and Master of Business Administration from the University of Texas al Austin. He is a member of IEEE and the Electron Devices Society.