Plenary Session

Tuesday, June 23, 2026

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Tuesday, June 23, 2026

Discover sustainable semiconductor breakthroughs to guide your roadmap from lab-to-market and to tomorrow’s AI factory at LID World Summit 2026.

Expect a front-row look at the materials and technologies that will enable tomorrow’s devices, systems, and markets.

Join industry leaders to discover groundbreaking innovation that will help meet technological goals for the healthcare, automotive, industrial, defense, and consumer-electronics sectors.

Leave with confidence in the possible.

09:00 a.m. - 10:00 a.m.

Welcome Coffee, Exhibitions & Networking

10:00 a.m. - 12:00 p.m. | Morning Session

Welcome & Introduction

Chairman

Michael Tchagaspanian

EVP Strategic Partnership, CEA-Leti

Chief Executive Officer, CEA-Leti

Sébastien Dauvé

Chief Executive Officer, CEA-Leti

Technical Advisor, Sabi Tech Advisory LLC

Babak Sabi

Technical Advisor, Sabi Tech Advisory LLC

AI data center landscape and advanced packaging challenges... more info

Senior Vice President & Executive Board member, MURATA

Takaki Murata

Senior Vice President & Executive Board member, MURATA

Chief Executive Officer, GF

Tim Breen

Chief Executive Officer, GF

Executive Officer, General Manager of Transmission Devices Laboratory, Sumitomo Electric Industries

Hajime Shoji

Executive Officer, General Manager of Transmission Devices Laboratory, Sumitomo Electric Industries

Optical device technologies toward photonics-electronics convergence... more info

SVP Corporate Strategy & Advanced Packaging; President, Lam Capital

Audrey Charles

SVP Corporate Strategy & Advanced Packaging; President, Lam Capital

Chief Executive Officer, FMC

Thomas Rueckes

Chief Executive Officer, FMC

Chief Technology Officer & Founder, Density AI

Bill Chang

Chief Technology Officer & Founder, Density AI

Senior Executive Director, PSMC

Len Koh

Senior Executive Director, PSMC

Vice President & Senior Expert, ITRI

Chih-I-Wu

Vice President & Senior Expert, ITRI

The strategy of ITRI’s international collaboration: from the perspective of semiconductor ecosystem resilience... more info

SVP & Head of the 3D DUV, ASML

Elliot Mc Namera

SVP & Head of the 3D DUV, ASML

Corporate Executive Officer & President, HORIBA UK

Stuart Knight

Corporate Executive Officer & President, HORIBA UK

Director of Technology Policy, SIA

Erik Hadland

Director of Technology Policy, SIA

Chief Executive Officer, Soitec (appointed on April 1, 2026)

Laurent Rémont

Chief Executive Officer, Soitec (appointed on April 1, 2026)

Chief Executive Officer, Rapidus corporation

Dr. Atsuyoshi Koike

Chief Executive Officer, Rapidus corporation

VP of Engineering, SKYWORKS

Alexandre Shirakawa

VP of Engineering, SKYWORKS

Deputy Director and Chief Technology Officer, CEA-Leti

Jean-René Lèquepeys

Deputy Director and Chief Technology Officer, CEA-Leti

12:00 p.m. - 02:30 p.m.

Lunch, Exhibitions & Networking

  • Latest Demos: Discover more than 30 live demos and network with potential partners.
  • Startups Corner: Don’t miss out on the startups corner to learn about the latest tech offers.
  • Business Meetings: Book meetings with experts to discuss your innovation project.
  • Partners Corner: Explore partners’ booth showcasing their technologies.

02:30 p.m. - 05:00 p.m. | Afternoon Session

05:00 p.m. - 06:00 p.m.

Coffee Break, Exhibition & Networking

Bonus: Attendees will receive the conference proceedings after the event