June 27-29, 2023 | Grenoble, France
ABOUT THE EVENT
The semiconductor industry is at the center of the technological advances transforming society. It is an exciting time rich with opportunities to make a positive impact on your future products and tomorrow’s world.
Join global semiconductor-industry executives, opinion leaders, and decision makers in redefining what it means to develop fair, sustainable, and trusted technologies—and come away with deep tech solutions for your future products.
This three-day event will offer inspiring keynotes, solutions-oriented workshops, an exhibition showcasing the latest demos and startups, plus business meetings and focused networking, all in one place and all designed to bring you maximum value.
CEO, Intel
Bio:
Patrick (Pat) Gelsinger is chief executive officer of Intel Corporation and serves on its board of directors. He has more than four decades of technology leadership and experience driving innovation, with 30 of those years serving in Intel engineering and executive roles.
Before rejoining Intel in February 2021, Gelsinger was CEO of VMware. In that role, he transformed VMware into a recognized global leader in cloud infrastructure, enterprise mobility and cybersecurity – almost tripling the company’s annual revenues. Gelsinger was also ranked the top CEO in America in 2019 in Glassdoor’s annual employee survey. Prior to joining VMware in 2012, Gelsinger was president and chief operating officer of EMC’s Information Infrastructure Products business, overseeing engineering and operations for information storage, data computing, backup and recovery, RSA security and enterprise solutions.
Gelsinger began his career in 1979 at Intel, becoming its first chief technology officer and serving as senior vice president and the general manager of the Digital Enterprise Group. He managed the creation of key industry technologies like USB and Wi-Fi. He was the architect of the original 80486 processor, led 14 microprocessor programs and played key roles in the Intel® Core™ and Intel® Xeon® processor families, leading to Intel becoming the world’s preeminent microprocessor supplier.
Gelsinger earned degrees in electrical engineering: an associate degree from Lincoln Technical Institute, a bachelor’s degree from Santa Clara University and a master’s degree from Stanford University. He was elected a member of the National Academy of Engineering in February 2023. Gelsinger holds eight patents in the areas of VLSI design, computer architecture and communications, is an IEEE Fellow, and serves as a member of the National Security Telecommunications Advisory Committee. He also sits on the Business Council, Business Roundtable, CEO Council, CEO Forum, Global Semi Alliance, Tech Council CEO and U.S. Chamber China Center Advisory Board.
CTO, GlobalFoundries
Bio:
Gregg Bartlett is Chief Technology Officer for GF, a position he was appointed to in 2022. He leads the execution and delivery of the company’s differentiated technology roadmap, including partnering with key universities and institutions to drive innovation, and accelerating development and delivery of GF’s differentiated technology. Mr. Bartlett oversees technology development, design enablement, GF Labs and global reliability and technology solutions.
Prior to his current role, Mr. Bartlett was Senior Vice President of Technology, Engineering and Quality at GF from 2019 to 2022. Before that, he served in various senior executive roles at GF including Head of Technology Development, Chief Technology Officer and Head of the CMOS (complementary metal-oxide-semiconductor) business from 2009 to 2019. Before joining GF, Mr. Bartlett spent 25 years in technical and management positions at Freescale Semiconductor and its predecessor, Semiconductor Products Sector at Motorola. Mr. Bartlett currently serves as a member of the board directors of Carbice Corporation.
Mr. Bartlett holds a bachelor’s degree in Chemical Engineering from Kansas State University.
Abstract:
The IoT/Edge Compute Era has ushered in an order of magnitude increase in connected devices each year compared to
smart mobile devices. With this comes great challenges in processing data at the edge with connected devices, the need
for intelligence and security in those devices, all with an eye toward sustainability. These formidable challenges create great
opportunities for innovation. For semiconductor foundries, this is the first compute era not dominated by single digit
nanometer technology, rather by creating compelling features on existing technologies to enable this connected, intelligent
and power efficient ecosystem. Building that ecosystem requires great R&D partnerships to deliver on the promise of this
future world
CTO, Stellantis
Bio:
Ned Curic was appointed Chief Technology Officer and a member of Stellantis’ Top Executive Team on August 30, 2021. From June 2017, Ned Curic was Vice President, Alexa Automotive at Amazon spearheading Amazon’s efforts in the Automotive industry. Ned Curic started his career in 1996 in the field of Engineering Systems at Northrop Grumman, an American multinational aerospace and defense technology company. After a short stint in the financial industry, in 2000 he joined Microsoft where he held various roles in Consulting, Product, Security and Advisory. He entered the automotive sector in 2013, as Group Vice President & Chief Technology Officer at Toyota Motor North America and, in 2015, became Co-founder and Executive Vice-President, Technical Director and Board Member at Toyota Connected. Ned Curic studied Informatics and Computer Science, and received a Master’s in Business Administration (Pepperdine University, George L. Graziadio School of Business and Management) in 2012.
Abstract:
Technologies have the power to reshape the auto industry, change the way we experience mobility and, ultimately, transform our life and our society. In guiding this transformation, we need to make sure that we don’t develop tech for tech’s sake but rather a tech made for real people, designed around their needs, delightful and easy to enjoy, whose impact is also fair, respectful of the environment and sustainable.
Chief Science Officer, Google X
Bio:
Dave is a scientist, inventor, and entrepreneur whose work emphasizes the role of machine learning and AI, especially with respect to time-series data, search and optimization in program space, and decision making under uncertainty. He is Chief Science Officer at X and runs a team of mathematicians and machine learning experts working on early stage projects. He co-founded several companies, including Cerebellum Capital, which was an asset management company powered by an auto-ML system that discovered trading strategies. He also invested in and advised a number of startups in the data science and wearables space. He previously worked at Bodymedia, where he ran the machine learning team and several advanced development projects. Over the years, he’s helped start a number of other businesses. Personally, he’s a husband, father, snowboarder, passionate player of soccer and bridge, a puzzle nerd, a burner, and a travel-lover. He runs robot & programming clubs for his two kids to help them & friends get a deeper tech education. He got started down his path at Stanford University (1994: BS Symbolic Systems, BA Psychology) and completed his official education at UC Berkeley (2003: PhD EECS with a focus on Artificial Intelligence). He feels very lucky to have been interested in AI & ML well before it was cool.
Abstract:
The field of artificial intelligence is changing at a breakneck pace, revolutionizing many industries along the way, including software engineering and many elements of artistic creation. In addition to briefly introducing X (formerly Google X), this talk will discuss these trends and implications for hardware design, both in terms of how AI can fit into the design process as well as what changes could supercharge these coming applications.
EVP & Power Systems and Services, Schneider Electric
Bio:
Frederic Godemel joined Schneider Electric in 1990. Since then, his career has developed mostly around the power business in both low and medium voltage. Frederic has held operational functions in France, China and more recently in Dubai, he is now back in France. He was appointed Executive VP for Global Field Services back in 2018, EVP for Power Systems in January 2019 and more recently in July 2020 Executive VP for Power Systems and Services. Frederic is participating in speaking and panel opportunities on behalf of Schneider Electric, the most recent were TAQA in Abu Dhabi, TSIA in Orlando, CERA Week Houston and Reuters London. Frederic graduated from the Ecole Centrale Nantes in electrical engineering and holds an MBA from ESSEC Business School.
Abstract:
A more electric and digital world, which we call Electricity 4.0, is key to addressing the climate and energy crises and unocking a sustainable and resilient future. Electricity is the most efficient energy and the best vector of decarbonization, and with digital innovation it unleashes huge potential to eliminate energy waste. Only by disrupting the way we manage energy can we deliver a net zero carbon world.
The semiconductor industry also has the responsibility to transform its energy use for a net-zero future. The good news is that semiconductor companies have made many commitments to decarbonize their operations, especially their fabs. But how are they delivering on their green promises?
Join this inspiring talk from energy and automation leader Schneider Electric to explore the value of digital energy technology and meaningful partnerships that help ensure a bright and sustainable future for semiconductor companies.
Distinguished Technologist, HP Technology Strategy
Bio:
Agnieszka has over 23 years of digital transformation and product innovation experience. Recognized as a thought leader in emerging technologies and trends, she has a strong track record of managing and aligning global high performance multicultural teams to deliver strategic value.
Over the past 16 years she has held multiple technical and management roles across HP businesses. As Senior Engineering Director, she drove the delivery of full stack software on devices and to Enterprise customers. As Head of Innovation Partnerships, she gathered and led cross-industry, multidisciplinary research experts to create open collaboration models that unleashed impactful innovation. Her breadth of knowledge ranges from electronics and communication systems to digital manufacturing and complex cyber-physical architectures.
Fluent in four languages, she holds a MSc in Communication Systems Engineering from the University of the Basque Country in Spain.
Abstract:
Since Bill Hewlett and Dave Packard created HP, we have been committed to the advancement of science, industry, and human welfare. Strongly grounded in fundamental scientific principles, our contributions began with audio oscillators and brightest light emitting diodes, then evolved to computing and printing spaces, and extended to microfluidics and voxel manufacturing capabilities enabling our 3D printers.
Today's increasing compute requirements are fueled by artificial intelligence and constrained by Moore's law slow-down and scarcity of natural resources. The growth of highly heterogeneous architectures and devices require new innovative approaches to design and development with a holistic and integrated perspective.
As more software and embedded intelligence are integrated into industrial products and systems, the cyber-physical solutions must be designed with a systemic approach. HP's cyber-physical stack drives this hardware-software co-design and optimization from the application, through the algorithms, and down to the electronic components of our devices.
I will share two examples of our work applied to Compute and Digital Manufacturing.
CEO, Soitec
Bio:
Pierre Barnabé was nominated as Soitec CEO in January 2022 and joined the company four months later.
He was previously Executive Vice-President in charge of Big Data & Cybersecurity at technology group Atos (2015-2021), where he also led the Public Sector & Defense division and manufacturing operations before serving as interim Group CEO in 2021.
Prior to its acquisition by Atos in 2014, Pierre Barnabé was Deputy CEO of Bull. He then served as Bull’s Chairman & CEO from 2015 to 2021, spearheading the company’s evolution into a global leader in cybersecurity services and supercomputing.
From 2011 to 2013, he was Managing Director of the Enterprise branch of SFR, the French telecoms operator, where he launched cloud computing and very high-speed broadband activities.
That followed a 13-year stint during which he held various positions at Alcatel and Alcatel-Lucent, first in sales and later as Chairman & Managing Director of Alcatel-Lucent France (formerly Alcatel CIT) and Group Deputy Managing Director for Human Resources and Transformation.
A graduate of the NEOMA Business School and Ecole Centrale in Paris, Pierre Barnabé began his career in 1994 in Silicon Valley, developing corporate venture capital and capital risk activities for Thales Group. He then moved to Thales headquarters in Paris, where he was in charge of strategy and acquisitions for the Communication and Command division.
A member of the board of the multinational market firm Ipsos, he also served as Chairman of the Board of ENSIMAG Grenoble, the prestigious Grande École specializing in computer science, applied mathematics and telecommunications (2016-2022) and on the board of France’s National Institute for Research in Digital Science and Technology (INRIA) from 2021 to 2022. Pierre Barnabé is a Knight of the French National Order of Merit.
Abstract:
Our industry is expected to reach $1T by 2030. By then, our society will be more connected, more energy efficient, and more intelligent than ever. As a global leader in semiconductor materials, Soitec is driving sustainability across the whole semiconductor value chain, thanks to engineered wafers that drive significant energy savings and superior performance all the way to the end user. In this talk, we will present how innovative semiconductor materials are the foundations of eco-design and why a strong global ecosystem collaboration is key to reach a sustainable future.
CEO, CEA-Leti
Bio:
Sébastien Dauvé was named CEO of CEA-Leti effective on July 1, 2021, after more than twenty years of experience in microelectronics technologies and their applications, including clean mobility, medicine of the future, cybersecurity, and power electronics.
Sébastien Dauvé started his career at the French Armament Electronics Center, where he worked on developing synthetic-aperture radar. In 2003, he joined CEA-Leti as an industrial transfer manager and supervised several joint research laboratories, in particular with the multinational Michelin.
In 2007, Sébastien Dauvé became a laboratory manager, then head of an R&D department in the area of sensors applied to the Internet of things and electric mobility. During this time, he supported the dissemination of new technologies in industry, including the automotive industry (Renault), aeronautics, national defense (SAFRAN), and microchips with the industry leader Intel. He played an active role in the creation of start-ups in application fields ranging from health to infrastructure security, leading to dozens of new jobs. In 2016, he became Director of the CEA-Leti Systems Division.
From sensors to wireless communication, Sébastien Dauvé has played an active role in the digital transformation, focused on coupling energy frugality and performance. He has made cross-disciplinary approaches central to innovation by harnessing the expertise of talented teams with diverse backgrounds. Their goal is to provide technological tools for meeting the major societal challenges of the future.
Sébastien Dauvé is a graduate of the French Ecole Polytechnique and the National Higher French Institute of Aeronautics and Space (ISAE-SUPAERO).
A three-day event
The first “Modern Art & Gastronomy” reception at the Musée de Grenoble, privatized for the event, will feature a cocktail bar and cooking demonstration highlighting the region’s traditional ingredients, with musical entertainment by a violin duo. Don’t miss the guided tour (in English) of selected works.
The second reception, a “Garden Party à la française”, will be an outdoor affair at the historic Château de Sassenage against the breathtaking backdrop of the Vercors mountains. Step back in time during a tour led by period-costumed guides and dig into barbecue and local cheeses.
See product technology demonstrations and prototypes and network with potential technology providers and partners. The best way to get a handle on what’s next in technology.
ContinueVIDEO
Leti Innovation Days was back in person in 2022, with more than 750 people attending. Did you miss the event? Relive the highlights in video while you wait for the event to kick off!
CEA-Leti, a technology research institute at CEA, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry.
For inquiries, please contact the event team at
+33 438 784 996
or send us an email at letiinnovationsdays@cea.fr
CEA-Leti©Copyright 2024 – Design & implementation : Fx-Com’unik
Ceci est un logo de sponsor