Program

Thursday, October 8, 2026

From Data Centers to the Physical World: Semiconductors as the Bridge

Explore a spectrum of topics through engaging presentations:

Greetings

Evelyne Etchebehere

Head of the CEA Tech office in Japan

Augustin Ranger

Strategic Partnership Manager, CEA Tech Office in Japan

 

CEO, CEA-Leti

Sébastien Dauvé

CEO, CEA-Leti

Celebrating 20 years of collaboration with Japan

Japan's semiconductor strategy and prospects for international collaboration

Speaker to be announced

Founder and CTO, SCINTIL Photonics

Sylvie Menezo

Founder and CTO, SCINTIL Photonics

Overcoming the AI data bottleneck: next-generation silicon photonics with integrated lasers

Powering and enabling AI data centers: the critical role of sensors and power devices

Speaker to be announced

Silicon Capacitors : a key enabler for next-generation data center power architectures

Speaker to be announced

Deputy Head of the Digital Intraged Circuits and Systems Division, CEA-List

Olivier Thomas

Deputy Head of the Digital Intraged Circuits and Systems Division, CEA-List

Bringing intelligence to the edge: embedded computing for the physical world

3D Integration & Packaging Technologies Industrial Partnership Manager, CEA-Leti

Tony Maindron

3D Integration & Packaging Technologies Industrial Partnership Manager, CEA-Leti

Beyond scaling: 3D integration connecting the AI ecosystem

Silicon Photonics Partnership Manager, CEA-Leti

Eléonore Hardy

Silicon Photonics Partnership Manager, CEA-Leti

Lighting the bridge: silicon photonics for the AI infrastructure era

MicroLED Partnership Manager, CEA-Leti

Vygintas Jankus

MicroLED Partnership Manager, CEA-Leti

LEDs enabling the next generation of data communications

Optical Sensors Industrial Partnership Manager, CEA-Leti

Vincent Destefanis

Optical Sensors Industrial Partnership Manager, CEA-Leti

Capturing reality: optical sensors as the gateway to the physical world

Telecom Line Director, CEA-Leti

Eric Mercier

Telecom Line Director, CEA-Leti

Connecting the physical world: next-generation wireless and telecom technologies

Partnership Manager for Systems Division, CEA-Leti

Maxime Rousseau

Partnership Manager for Systems Division, CEA-Leti

Powering the bridge: energy-efficient semiconductors for AI factories

Sustainable Electronics Program Director, CEA-Leti

Laurent Pain

Sustainable Electronics Program Director, CEA-Leti

Sustaining the bridge: semiconductor innovation for a responsible AI future

VP Europe & International Public Affairs, CEA-Leti

Bruno Paing

VP Europe & International Public Affairs, CEA-Leti

Coming Soon

Executive Vice President, Strategic Partnership, CEA-Leti

Michael Tchagaspanian

Executive Vice President, Strategic Partnership, CEA-Leti

20 years together, the journey continues: pushing the frontiers of innovation

More speakers to be announced soon

6:30 p.m. - 8:30 p.m..

Networking reception with senior experts and top leaders