Program

Greetings

Evelyne Etchebehere

Head of the CEA Tech office in Japan

Augustin Ranger

Strategic Partnership Manager, CEA Tech Office in Japan

Sébastien Dauvé

CEO, CEA-Leti

Celebrating 20 years of collaboration with Japan

Takaki Murata

Executive Vice President & Board Member, Murata

Silicon capacitors: a key enabler for next-generation data center power architectures

Sylvie Menezo

Founder and CTO, SCINTIL Photonics

Enabling scalable AI and datacenter interconnects through SCINTIL's heterogeneous photonic integration (SHIP).

Bruno Paing

VP Europe & International Public Affairs, CEA-Leti

JASMINE EU project: Japan and EU semiconductors, mutual innovation & excellence

Olivier Thomas

Deputy Head of the Digital Intraged Circuits and Systems Division, CEA-List

Bringing intelligence to the edge: embedded computing for the physical world

Tony Maindron

3D Integration & Packaging Technologies Industrial Partnership Manager, CEA-Leti

Thierry Mourier

Senior Process Engineer and Head of the Packaging For Photonics Lab, CEA-Leti

Beyond scaling: 3D integration connecting the AI ecosystem

Special testimony

Beyond technology: the power of human connection in a CEA-Leti assignment

Eléonore Hardy

Silicon Photonics Partnership Manager, CEA-Leti

Lighting the bridge: silicon photonics for the AI infrastructure era

Vygintas Jankus

MicroLED Partnership Manager, CEA-Leti

MicroLEDs enabling the next generation of data communications

Vincent Destefanis

Optical Sensors Industrial Partnership Manager, CEA-Leti

Capturing reality: optical sensors as the gateway to the physical world

Eric Mercier

Telecom Line Director, CEA-Leti

Connecting the physical world: next-generation wireless and telecom technologies

Maxime Rousseau

Partnership Manager for Systems Division, CEA-Leti

Powering the bridge: energy-efficient semiconductors for AI factories

Sami Oukassi

Head of Laboratory for RF and Energy devices, CEA-Leti

Bridging AI system performance and efficiency: the silicon capacitor ecosystem – advances and outlook

Laurent Pain

Sustainable Electronics Program Director, CEA-Leti

Sustaining the bridge: semiconductor innovation for a responsible AI future

Michael Tchagaspanian

Executive Vice President, Strategic Partnership, CEA-Leti

20 years together, the journey continues: pushing the frontiers of innovation