Program

Greetings

Evelyne Etchebehere

Head of the CEA Tech office in Japan

Augustin Ranger

Strategic Partnership Manager, CEA Tech Office in Japan

Sébastien Dauvé

CEO, CEA-Leti

Celebrating 20 years of collaboration with Japan

Guest speaker to be announced

Sylvie Menezo

Founder and CTO, SCINTIL Photonics

Enabling scalable AI and datacenter interconnects through SCINTIL's heterogeneous photonic integration (SHIP).

Guest speaker to be announced

Guest speaker to be announced

Olivier Thomas

Deputy Head of the Digital Intraged Circuits and Systems Division, CEA-List

Bringing intelligence to the edge: embedded computing for the physical world

Tony Maindron

3D Integration & Packaging Technologies Industrial Partnership Manager, CEA-Leti

Beyond scaling: 3D integration connecting the AI ecosystem

Eléonore Hardy

Silicon Photonics Partnership Manager, CEA-Leti

Lighting the bridge: silicon photonics for the AI infrastructure era

Vygintas Jankus

MicroLED Partnership Manager, CEA-Leti

MicroLEDs enabling the next generation of data communications

Vincent Destefanis

Optical Sensors Industrial Partnership Manager, CEA-Leti

Capturing reality: optical sensors as the gateway to the physical world

Eric Mercier

Telecom Line Director, CEA-Leti

Connecting the physical world: next-generation wireless and telecom technologies

Maxime Rousseau

Partnership Manager for Systems Division, CEA-Leti

Powering the bridge: energy-efficient semiconductors for AI factories

Laurent Pain

Sustainable Electronics Program Director, CEA-Leti

Sustaining the bridge: semiconductor innovation for a responsible AI future

Bruno Paing

VP Europe & International Public Affairs, CEA-Leti

JASMINE EU project : Japan and EU semiconductors, mutual innovation & excellence

Michael Tchagaspanian

Executive Vice President, Strategic Partnership, CEA-Leti

20 years together, the journey continues: pushing the frontiers of innovation

More speakers to be announced soon