Thursday, October 8, 2026
Head of the CEA Tech office in Japan
Strategic Partnership Manager, CEA Tech Office in Japan
Sébastien Dauvé
Celebrating 20 years of collaboration with Japan
Sylvie Menezo
Enabling scalable AI and datacenter interconnects through SCINTIL's heterogeneous photonic integration (SHIP).
Takaki Murata
Silicon capacitors: a key enabler for next-generation data center power architectures
Olivier Thomas
Bringing intelligence to the edge: embedded computing for the physical world
Tony Maindron
Beyond scaling: 3D integration connecting the AI ecosystem
Eléonore Hardy
Lighting the bridge: silicon photonics for the AI infrastructure era
Vygintas Jankus
MicroLEDs enabling the next generation of data communications
Vincent Destefanis
Capturing reality: optical sensors as the gateway to the physical world
Eric Mercier
Connecting the physical world: next-generation wireless and telecom technologies
Maxime Rousseau
Powering the bridge: energy-efficient semiconductors for AI factories
Sami Oukassi
Bridging AI system performance and efficiency: the silicon capacitor ecosystem – advances and outlook
Laurent Pain
Sustaining the bridge: semiconductor innovation for a responsible AI future
Bruno Paing
JASMINE EU project: Japan and EU semiconductors, mutual innovation & excellence
Michael Tchagaspanian
20 years together, the journey continues: pushing the frontiers of innovation
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