Program
WEDNESDAY OCTOBER 8, 2025
The AI-Chip Revolution: Scaling Innovation in Semiconductors
Explore a spectrum of topics through engaging presentations:
[2025] LID Tokyo
Greetings
Sebastien Dauvé
CEO, CEA-Leti
Evelyne Etchebehere
Head of Japan Office, CEA Tech
Advanced semiconductor technologies powering AI and future industry challenges ... more info
Speaker coming soon
Keynote speaker
Coming soon
Eléonore Hardy
Silicon Photonics Partnership Manager, CEA-Leti
Moving data with light: silicon photonics advances to meet demands for data processing, storage and computing ... more info
Sylvie Joly
3D Integration and Packaging Partnership Manager, CEA-Leti
3D integration and Packaging, simplifying the use of co-packaged optics with chiplets ... more info
Olivier Thomas
Deputy Head of the Digital IC Division, CEA-List
Pushing the boundaries of new architectures to enable widespread AI deployment ... more info
Martin Gallezot
Deputy Head Silicon Components Division, CEA-Leti
Advanced memory technologies for AI at the Edge ... more info
Martin Gallezot
Deputy Head Silicon Components Division, CEA-Leti
Wide band gap semiconductor devices for efficient data centers ... more info
Eric Mercier
Telecom Line Director, CEA-Leti
Advances in radar, radio-frequency and sensing technologies in the connected era ... more info
Vincent Destefanis
Optical Sensors Industrial Partnerships Manager, CEA-Leti
Optical technologies for future communications and sensing ... more info
Laurent Pain
Sustainable Electronics Program Director, CEA-Leti
The key to sustainable ICs: new solutions from manufacturing to systems ... more info
Panel Session
Roundtable talk with a selection of special guests
Coming soon
Conclusion
Michael Tchagaspanian
EVP, Strategic Partnerships, CEA-Leti
