Director, Technology Scouting and R&D Partnerships, STMicroelectronics
Packaging Engineer, STMicroelectronics
Collaborative R&D Manager, Teledyne e2v
Chief Strategist, Chiplets & Advanced Packaging, IBM Research
Deputy DirectorâClinical Innovation, CEA-Leti
Director Advanced Engineering, Bosch Sensortec GmbH
Professor, Tokyo Institute of Technology
President Quality, Manufacturing & Technology, STMicroelectronics