Philippe Garnier

Senior Member of Technical Staff – Wet & Bonding R&D, STMicroelectronics

Noora Tuomisto

Project Manager, Murata Finland

Cheryl Liu

Field Application Engineering Manager, Aledia

Jean-Philippe Bourgoin

Deputy Executive Director of the Technological Research Division, CEA

Stéphanie Robinet

Head of Analog and Mixed-IC Design Lab, CEA-Leti

Michel Bommer

UPS Technology Director, Legrand

Sylvain Bacquet

Head of Power Electronics and Energy Management lab, CEA-Leti

Yoshinami Takahashi

COO & Head of Global Solution Business Group, Fujitsu

Ashkan Seyedi

Director, Optical Interconnect Products, NVIDIA

Raphael Levy

Head of the Sensors & Micro/Nano Technology Unit, Onera