Collaborative R&D Manager, Teledyne e2v
Chief Strategist, Chiplets & Advanced Packaging, IBM Research
Deputy Director—Clinical Innovation, CEA-Leti
Director Advanced Engineering, Bosch Sensortec GmbH
Professor, Tokyo Institute of Technology
President Quality, Manufacturing & Technology, STMicroelectronics
R&D Manager, STMicroelectronics
RFIC/PA Design Team Leader, CEA-Leti
Silicon Microfluidics Program Manager, X-FAB