Bio :

Yacine Halioua holds a Ph.D. in Photonics from CNRS-C2N (Paris) and Ghent University (Photonics Research Group), where he researched hybrid III-V nano-lasers on silicon. He has since contributed to optical transceiver development for coherent communications at Oclaro (Lumentum) and Huawei (Caliopa), as well as development of hyperspectral imager for mobile applications at Spectricity. He currently serves as Head of Product at Ncodin, working on photonic solutions for die-to-die optical interconnects.

Abstract:

As AI accelerators push compute density to its physical limits, chiplet bandwidth has become the critical bottleneck. The
shoreline limit — the finite I/O capacity along a chip's edge — caps system throughput regardless of silicon progress, and
copper interconnects are running out of headroom in both reach and energy efficiency.
NcodiN's NConnect platform breaks this barrier by integrating the world's smallest nanolaser directly onto the interposer: a light source with a ~100 µm² footprint and sub-mW power consumption — 2 orders of magnitude below state-of-the-art laser sources. NConnect delivers the bandwidth density and power budget that next-generation chiplet architectures demand, on a path fully compatible with CMOS manufacturing.