Speakers
Robert Chau
AMD, Technical Executive, Senior Fellow & Process Technology Architect
Jamie Schaeffer
Vice President - Product Management, Globalfoundries
Jamie Schaeffer
Vice President - Product Management, Globalfoundries
Bio:
Jamie Schaeffer is currently Vice President of Ultra-low Power CMOS Product Management at Globalfoundries. In this role he is responsible for business performance and product roadmap strategy for Globalfoundries' FDX (FD-SOI) and FinFET technologies, including embedded non-volatile memory and advanced packaging.
Sébastien Dauvé
CEO, CEA-Leti
Sébastien Dauvé
CEO, CEA-Leti
Bio:
Sébastien Dauvé was named CEO of CEA-Leti effective on July 1, 2021, after more than twenty years of experience in microelectronics technologies and their applications, including clean mobility, medicine of the future, cybersecurity, and power electronics.
Sébastien Dauvé started his career at the French Armament Electronics Center, where he worked on developing synthetic-aperture radar. In 2003, he joined CEA-Leti as an industrial transfer manager and supervised several joint research laboratories, in particular with the multinational Michelin.
In 2007, Sébastien Dauvé became a laboratory manager, then head of an R&D department in the area of sensors applied to the Internet of things and electric mobility. During this time, he supported the dissemination of new technologies in industry, including the automotive industry (Renault), aeronautics, national defense (SAFRAN), and microchips with the industry leader Intel. He played an active role in the creation of start-ups in application fields ranging from health to infrastructure security, leading to dozens of new jobs. In 2016, he became Director of the CEA-Leti Systems Division.
From sensors to wireless communication, Sébastien Dauvé has played an active role in the digital transformation, focused on coupling energy frugality and performance. He has made cross-disciplinary approaches central to innovation by harnessing the expertise of talented teams with diverse backgrounds. Their goal is to provide technological tools for meeting the major societal challenges of the future.
Sébastien Dauvé is a graduate of the French Ecole Polytechnique and the National Higher French Institute of Aeronautics and Space (ISAE-SUPAERO).
Eric Mercier
Telecom Line Director, CEA-Leti
Eric Mercier
Telecom Line Director, CEA-Leti
Vygintas Jankus
MicroLED Partnership Manager, CEA-Leti
Vygintas Jankus
MicroLED Partnership Manager, CEA-Leti
Bio:
Vygintas Jankus completed his PhD (funded by Kodak) and a Postdoc at Durham University (UK), where he investigated materials for OLED displays.
From 2014 to 2020, he worked at a multinational company (Samsung-SDI / Novaled, Germany) as well as a startup (Cynora, Germany). He contributed to the development of OLED material products as well as their implementation within the production lines of major display manufacturers in South Korea and China.
In 2021, he obtained an Advanced Master’s in Technology Innovation Management at Toulouse Business School and joined CEA-Leti (France) as MicroLED and OLED Partnership Manager. He is focused on gathering all of the relevant players in order for innovative microLED and OLED technology to move towards commercialization in markets such as optical communications, VR/AR, smartwatches and smartphones.
Martin Gallezot
Deputy Head Silicon Components Division, CEA-Leti
Martin Gallezot
Deputy Head Silicon Components Division, CEA-Leti
Bio:
Martin Gallezot graduated from Ecole Supérieure d’Electricité, Paris, France in 1993 with a Msc in Electrical Engineering. He is responsible for technology transfer in the Silicon Components Division at CEA-LETI. Before that he held several technical and business positions in semiconductor IP companies operating in the cybersecurity, high speed interconnect and flat panel display industries.
Olivier Thomas
Deputy Head of the Digital IC Division, CEA-List
Olivier Thomas
Deputy Head of the Digital IC Division, CEA-List
Bio:
Olivier THOMAS is the deputy head of the Digital IC & System Design Division at CEA-List. He is in charge of partnership strategies and ecosystem growth, leveraging his background in system/design-to-technology co-optimization and product engineering within the field of embedded systems innovation. He is author and co-author of 25 patents and 77 publications. He was a pioneer and co-inventor of multi-VT technology utilizing back biasing for FD-SOI, as well as single p-well SRAM. He got is PhD in 2004 from the doctoral school of Computer Science, Telecommunications, and Electronics of Paris.
Laurent Pain
Sustainable Electronics Program Director, CEA-Leti
Laurent Pain
Sustainable Electronics Program Director, CEA-Leti
Bio:
Laurent Pain is graduated from the Ecole Nationale Supérieure de Physique de Grenoble in 1992. He received his Ph D after his work on DUV resists study. He joined CEA-Leti in 1996 to work on infra-red technology, and then came back to STmicroelectronics in 1999 working on 193nm and e-beam lithography technologies.
From 2008 to 2014, Laurent Pain leaded the lithography laboratory of the silicon technology division of CEA-Leti. He was also managing in parallel the industrial consortium IMAGINE dedicated to the development of multibeam lithography with MAPPER lithography BV.
Since July 2014, within the CEA-Leti Silicon Technology Division, he is now in charge of the business and the partnerships developments of the Silicon Technologies Platform Division.
Michael Tchagaspanian
EVP Strategic Partnerships, CEA-Leti
Michael Tchagaspanian
EVP Strategic Partnerships, CEA-Leti
Frederic Seve
VP North America Strategic Partnership Manager, CEA
