3D Heterogeneous Integration
WEDNESDAY, JUNE 26, 2024
Any wafer from any foundry
for your needs
With HPC, quantum, RF, and imagers driving demand, 3D heterogeneous integration is here to stay. Modular chiplets give you the freedom to choose the most appropriate technology for each subcomponent and achieve the most powerful, efficient, cost-effective system. This satellite conference will answer your questions about applications, architectures, design, technology, and impacts on existing ecosystems.
Welcome Coffee, Exhibition & Networking
09:30 a.m. - 11:30 a.m. | Morning Session
Co-chairs
Sylvie Joly
Partnerships Manager 3D Integration and Packaging, CEA-Leti
Pascal Vivet
Scientific Director, CEA-List
Chiplets for advanced computing
Jean-Philippe Fricker
Founder & Chief System Architect, Cerebras Systems
Hyperscaling connectivity with the Cerebras Wafer-Scale Engine... more info
Dale McHerron
Chief Strategist, Chiplets & Advanced Packaging, IBM Research
Chiplet and advanced packaging technologies for HPC and AI... more info
Denis Dutoit
Program Manager, CEA-List
Chiplet-based architecture for automotive centralized computing platform... more info
Jean Charbonnier
Expert in 3D Integration, CEA-Leti
Through silicon via and hybrid bonding synergy for new 3D systems enablers... more info
Emilie Bourjot
Project Manager in 3D & BEOL Integration, CEA-Leti
Through-silicon via and hybrid bonding synergy for new 3D systems enablers... more info
Get some Fresh Ideas: 180 secs Pitch by a talented young scientist
Darius Bunandar
Chief Scientist, Lightmatter
Passage: a wafer-scale, programmable photonic interconnect... more info
Panel Session
How close are we to a mature chiplet ecosystem for heterogenous integration?
Heiko Dudek, Siemens EDA; Jean-Philippe Fricker, Cerebras Systems; Denis Dutoit, CEA-List; Jean Charbonnier, CEA-Leti; Emilie Bourjot, CEA-Leti; Dale McHerron, IBM; Darius Bunandar, Lightmatter (from left to right)
Lunch, Exhibition & Networking
- Latest Demos: Discover more than 50 live demos and network with potential partners.
- Startups Corner: Don’t miss out on the startup corner to learn about the latest tech offers.
- Business Meetings: Book meetings with experts to discuss your innovation project.
02:30 p.m. - 04:30 p.m. | Afternoon Session
Heterogenous integration: the challenge of diversity
Heiko Dudek
Technical Account Manager, 3D-IC & Heterogeneous IC Packaging, Siemens EDA
Accelerating 2.5D/3D heterogeneous packaging... more info
Michael Campbell
Senior Engineer—Collaboration Spokesperson, CERN
How 3D interconnects can enable large area single photon sensitive X-ray imaging... more info
Mate Jenei
Tech Lead, 3D integration and wiring, IQM Finland Oy
Fabrication of Quantum Processing Units (QPUs) at IQM Quantum Computers: overview and achievements... more info
CEA ecosystem pitches
Romain Coffy, STMicroelectronics; Frederic Devriere, Teledyne e2v; Jean-Stéphane Mottet, SET Corporation; Julien Schmitt, VSORA; Dmitriy Gusev, Menta (from left to right)
Coffee Break, Exhibition & Networking
