Speakers

Sébastien Dauvé

Chief Executive Officer, CEA-Leti

Bio:

Sébastien Dauvé was named CEO of CEA-Leti effective on July 1, 2021, after more than twenty years of experience in microelectronics technologies and their applications, including clean mobility, medicine of the future, cybersecurity, and power electronics.

Sébastien Dauvé started his career at the French Armament Electronics Center, where he worked on developing synthetic-aperture radar. In 2003, he joined CEA-Leti as an industrial transfer manager and supervised several joint research laboratories, in particular with the multinational Michelin.

In 2007, Sébastien Dauvé became a laboratory manager, then head of an R&D department in the area of sensors applied to the Internet of things and electric mobility. During this time, he supported the dissemination of new technologies in industry, including the automotive industry (Renault), aeronautics, national defense (SAFRAN), and microchips with the industry leader Intel. He played an active role in the creation of start-ups in application fields ranging from health to infrastructure security, leading to dozens of new jobs. In 2016, he became Director of the CEA-Leti Systems Division.

From sensors to wireless communication, Sébastien Dauvé has played an active role in the digital transformation, focused on coupling energy frugality and performance. He has made cross-disciplinary approaches central to innovation by harnessing the expertise of talented teams with diverse backgrounds. Their goal is to provide technological tools for meeting the major societal challenges of the future.

Sébastien Dauvé is a graduate of the French Ecole Polytechnique and the National Higher French Institute of Aeronautics and Space (ISAE-SUPAERO).

Pierre Laboisse

President & CEO, Aledia

Pierre-Damien Berger

MEMS Industrial Partnership Manager, CEA-Leti

Yann Lamy

Head of Power Devices Lab, CEA-Leti

Marion Andrillat

Cybersecurity Strategic Partnership Manager, CEA-Leti

Eric Mercier

Telecom Line Director, CEA-Leti

Vygintas Jankus

MicroLED Partnership Manager, CEA-Leti

Vygintas Jankus

MicroLED Partnership Manager, CEA-Leti

Bio:

Vygintas Jankus is responsible for industrial partnership for MicroLED & OLED technologies at CEA-Leti in Grenoble. He helps partners to develop these technologies for optical & data communication, AR/VR, automotive, and other applications.

Abstract:

This program on microLED datalinks addresses the bandwidth‑energy bottleneck limiting AI‑driven supercomputers. By scaling microLED optical links, the project targets sub‑1 pJ/bit energy use and >10.5 Tbps/mm data density over distances up to 10 meters, enabling point‑to‑point interconnects for CPUs, GPUs and HBM stacks.

Combining device, circuit and 3‑D integration expertise hybrid bonding and high‑density TSVs the consortium will manufacture microLEDs on 200 mm wafers using standard foundry technology, with a clear path to 300 mm scalability.

Why it matters: MicroLEDs offer a mature, low‑power alternative to copper or laser‑based interconnects that can deliver orders‑of‑magnitude speed gains, while sharply reducing power draw. Attendees will see the microLED-for-datacom roadmap, learn how the technology can accelerate AI workloads, lower data-center expenses, and open new opportunities for chipmakers, optical‑component suppliers and hyperscalers.

Laurent Fulbert

Deputy Head of Optics and Photonics division, CEA-Leti

Laurent Pain

Sustainable Electronics Program Director, CEA-Leti

Laurent Pain

Sustainable Electronics Program Director, CEA-Leti

Bio:

Laurent Pain is graduated from the Ecole Nationale Supérieure de Physique de Grenoble in 1992. He received his Ph D after his work on DUV resists study. He joined CEA-Leti in 1996 to work on infra-red technology, and then came back to STmicroelectronics in 1999 working on 193nm and e-beam lithography technologies.

From 2008 to 2014, Laurent Pain leaded the lithography laboratory of the silicon technology division of CEA-Leti. He was also managing in parallel the industrial consortium IMAGINE dedicated to the development of multibeam lithography with MAPPER lithography BV.

Since July 2014, within the CEA-Leti Silicon Technology Division, he is now in charge of the business and the partnerships developments of the Silicon Technologies Platform Division.

Abstract:

The semiconductor industry underpins global digital transformation, with the ICT market expected to double by 2030 due to advances in AI, 5G, and cloud computing. A fundamental shift toward more resilient, sustainable, and circular manufacturing models is required to enable this growth. Key challenges include reducing water, gas, and metal consumption, minimizing PFAS dependence, and improving effluent circularity.

Attendees will hear how CEA-Leti’s comprehensive sustainability roadmap spanning the entire semiconductor value chain will integrate process innovation with system-level optimization to drive measurable environmental impact reduction. The SubFAB Labs initiative, developed in collaboration with International SubFAB Research Labs (ISRL), is a central pillar of the roadmap. This four-year program, which can be extended, will evaluate the subfab environment, from process to final waste treatment by improving material use, abatement strategy and global effluent? circularity. The aim is to reduce costs and global environmental impact.