Speakers
Frédéric Jung
Consul General of France in San Francisco
Rouzbeh Borhani
Head of Semiconductors, Plug and Play Tech Center
Michael Tchagaspanian
EVP Strategic Partnerships, CEA-Leti
Michael Tchagaspanian
EVP Strategic Partnerships, CEA-Leti
Nicolas Bedouin
VP Partnerships North America, CEA
Jean-Philippe Fricker
Chief System Architect and Co-Founder, Cerebras Systems
Jean-Philippe Fricker
Chief System Architect and Co-Founder, Cerebras Systems
Bio :
Jean-Philippe (J.P.) is Chief System Architect at Cerebras Systems. Before co-founding Cerebras, J.P. was Senior Hardware Architect at rack-scale flash array startup DSSD (acquired by EMC). Prior to DSSD, J.P. was Lead System Architect at SeaMicro where he designed three generations of fabric-based computer systems. Earlier in his career, J.P. was Director of Hardware Engineering at Alcatel-Lucent and Director of Hardware Engineering at Riverstone Networks. He holds an MS in Electrical Engineering from École Polytechnique Fédérale de Lausanne, Switzerland, and has authored 24 patents.
Abstract :
Cerebras Systems will present their cutting-edge AI hardware solutions designed to meet the growing demands of machine learning. This presentation will highlight the capabilities of the Cerebras Wafer-Scale Engine and its transformative impact on AI compute. J.P. Fricker, Cerebras Chief System Architect and Co-Founder, will discuss how Cerebras addressed key challenges across yield, lithography limitations, and thermal expansion. This session will also underscore Cerebras' success stories with prominent clients and their vision for scalable AI systems that make training the largest models fast and accessible.
Frédéric Morestin
VP Marketing Imaging, STMicroelectonics
Philippe Robert
CEO, NG.Sense
Philippe Robert
CEO, NG.Sense
Bio :
Philippe Robert is business development manager and senior expert at CEA-Leti for MEMS sensors and actuators activities. He is currently in the process of creating a spin-off from CEA-Leti to produce and commercialize a new generation of high-performance MEMS/NEMS sensors (including accelerometers, gyroscopes, and pressure sensors) for the automotive, consumer, and high-end markets.
After holding various positions in the sensor industry, he joined CEA-Leti in 2001 as a project manager for RF-MEMS research. He was promoted to manager of the MEMS Sensors Group from 2003 to 2013, and served as head of the Microsystems Department from 2013 to 2019.
He holds a PhD in Electrical Engineering and a M.Sc. degree in Optical Electronics from Grenoble-INP.
Abstract :
Introducing NG.Sense, a burgeoning startup poised to lead the market in high-performance MEMS sensors designed for inertial and pressure sensing applications. With a groundbreaking technological approach, NG.Sense aims to disrupt the sensor landscape across automotive, industrial, and defense sectors. Our mission is to deliver cost-effective, superior solutions to meet the demands of cutting-edge applications, such as autonomous navigation for vehicles, drones, robots… as well as for accurate activity tracking.
Jean-Philippe Polizzi
Micro & Nanosystems Project Manager, CEA-Leti
Marc Sansa Perna
Project Manager, CEA-Leti
Marc Sansa Perna
Project Manager, CEA-Leti
Bio:
Marc Sansa obtained his Ph.D. degree in electronic engineering from the Universitat Autònoma de Barcelona, Barcelona, Spain, in 2013. He is an expert in microelectromechanical system (MEMS) sensors, RF MEMS and optomechanics, having co-authored over 50 publications and several patents. He is currently a project manager at the Sensors and Actuators Laboratory of CEA-Leti.
Abstract :
Electrical microsensors (MEMS) have been gaining maturity and performance during the last 40 years, and they are nowadays ubiquitous in our everyday life. Recently, the combination of MEMS and silicon photonics has given birth to optomechanical MEMS (optically transduced microsensors), enabling a jump in performance in terms of readout sensitivity and frequency of operation.
In this talk I will present the advantages of optomechanics for high-efficiency sensing, and how CEA-Leti’s developments have enabled novel applications in the fields of biosensing, environment/biological monitoring, high-speed AFM and clocks.
Vincent Destefanis
Optical Sensors Industrial Partnerships Manager, CEA-Leti
Vincent Destefanis
Optical Sensors Industrial Partnerships Manager, CEA-Leti
Bio:
Vincent Destefanis received a Master’s and a Ph.D. degrees in Materials Science in 2009. During his PhD, Vincent worked for STMicroelectronics on advanced epitaxial techniques for SiGe alloys grown on alternative Si substrates, this for advanced CMOS devices.
He then worked in the US as a CEA-Leti assignee at IBM, NY, working on sub-22 nm CMOS technologies. Vincent has been working in the photonics industry since 2010, first as a R&D Engineer, then as a technical expert on infrared imaging manufacturing technologies for SOFRADIR. He moved to a project and partnership manager position at LYNRED in 2020. During in career, Vincent was involved in several national, industrial and collaborative projects (H2020, Horizon Europe, CNES, IPCEIs…) as a technical expert and a project manager.
He recently joined the CEA-Leti in 2023 and is now dedicated to developing new partnerships and business opportunities in optical and photonics technologies, especially for sensing applications.
Olivier Fuchs
Healthtech Partnerships Manager, CEA-Leti
Bertrand Szelag
Integrated Photonics Program Manager, CEA-Leti
Umashankar Anandakumar
Senior Director, Intel Corp.
Baudoin Martineau
Head of RF Architecture & IC Design Lab, Senior Expert,CEA-Leti
Swan Gerome
Industrial Partnerships Manager, CEA-Leti
Swan Gerome
Industrial Partnerships Manager, CEA-Leti
Bio:
Swan GEROME is Industrial Partnership Manager for the System Department, specialized in RF and Telecommunication at CEA-Leti.
He hold a degree in Marketing and Sales Management at Grenoble IAE and has more than 15 years experience in the semiconductor industry in various companies, from materials, design and research.
He was successively Sales Manager for Dolphin Integration from 2008 to 2014 in charge of Business Development for ASIC Design, Analog Silicon IP and libraries towards Foundries, Fabless, Design Houses and OEM. He also managed a team of 3 sales coordinators in Asia (Japan, South Korea and Taiwan) then Europe. He joined CEA-Leti in 2015 as Industrial Parnership Manager for the System Departement in the fields of sensors integration, energy management, embedded data processing and RF Telecommunications (antennas designa and integration, specific protocols and RFIC design), developping partnership with national and international companies from Start-up to Big Tech.
Between 2022 and 2023, he was Product Marketing Manager for Connect-SOI Business Unit at SOITEC, developping the Roadmap of engineering silicon substrate for RF applications and launching new product to answer market requirement.
Vygintas Jankus
Display Partnership Manager, CEA-Leti
Philippe Rodriguez
Head of Laboratory, CEA-Leti
Philippe Rodriguez
Head of Laboratory, CEA-Leti
Bio:
Philippe Rodriguez is a research engineer and laboratory manager at CEA-Leti in the Semiconductor Platforms Division.
He received his Ph.D. in 2007 from the University of Lyon 1 in Materials Chemistry for his work on metal organic vapor phase epitaxy growth of B(In)GaAs epilayers. From 2007 to 2009, he worked at the CNRS (French National Center for Scientific Research) developing deposition methods on structured substrates for process intensification applications. In 2009, he started his career at the CEA (French Alternative Energies and Atomic Energy Commission). First, he worked on the coating and fluidization of dense powders by fluidized bed metal-organic chemical vapor deposition for the development of new nuclear fuels (2009 - 2011). Then, he developed silica permeation barriers by magnetron sputtering for laser megajoule gas targets (2011 - 2013). Finally, he joined CEA-Leti in Oct. 2013. His research activity is mainly focused on advanced contact technologies for electronics and photonics applications. He develops contact metallization for advanced CMOS and photonics devices (Si, Ge(Sn), III-V and GaN materials) and also deals with surface preparation and interface modulation prior to metallization. He led the contact team at CEA-Leti between 2017 and 2020 and became head of the Advanced Materials Deposition Laboratory in February 2020. In Sept. 2022, he joined the Surface and Interface Science and Engineering Department and since Jan. 2023, he is in charge of the Laboratory of Wet Surface Preparation, Epitaxy and Thermal Treatment Processes.
He is the author and co-author of approximately 100 peer-reviewed journal articles, 115 international conference papers, 2 book chapters, and 15 patents.
Sylvie Joly
3D Integration and Packaging Partnerships Manager, CEA-Leti
Sylvie Joly
3D Integration and Packaging Partnerships Manager, CEA-Leti
BIO:
Sylvie Joly is currently working as 3D integration and packaging Partnerships Manager at CEA-Leti. Sylvie received M.Sc. in Microelectronics from ISEP "Institut Supérieur d'Electronique de Paris" in 1989. She completed her education with a Master in Marketing and Innovation at the Grenoble Ecole de Management (GEM) in 2001. Prior to this position, she worked for more than 8 years as display business developer at CEA-Leti. In 2004 as Sr. Marketing Engineer in the CEA's Technology Transfer Department, she built a strong experience in setting up and managing technical marketing surveys. Before joining CEA, she spent 10 years in the industry as an R&D engineer, and 8 years as Sales engineer in several companies including Hewlett Packard and Ericsson.
William Guicquero
PhD Senior Research Engineer, CEA-Leti
Olivier Thomas
Deputy Head of the Integrated Circuit & System Division, CEA-List
