Program

Tuesday May 14, 2024

Semiconductor Deep Tech Day

08:30 A.M. - 02:30 P.M.

Explore a spectrum of topics through engaging presentations:

Opening Keynotes

Managing Partner, Plug and Play

Amir Amidi

Managing Partner, Plug and Play

Consul General of France in San Francisco

Frédéric Jung

Consul General of France in San Francisco

CEO, SEMI

Ajit Manocha

CEO, SEMI

Head of Semiconductors, Plug and Play Tech Center

Rouzbeh Borhani

Head of Semiconductors, Plug and Play Tech Center

EVP Strategic Partnerships, CEA-Leti

Michael Tchagaspanian

EVP Strategic Partnerships, CEA-Leti

VP Partnerships North America, CEA

Nicolas Bedouin

VP Partnerships North America, CEA

Testimonies and Semiconductor Industry Corporate Keynotes

Founder & Chief System Architect, Cerebras Systems

Jean-Philippe Fricker

Founder & Chief System Architect, Cerebras Systems

VP Marketing Imaging, STMicroelectonics

Frédéric Morestin

VP Marketing Imaging, STMicroelectonics

Semiconductor Deep Tech Devices and startups

​MEMS Partnerships Manage​r, CEA-Leti

Philippe Robert

​MEMS Partnerships Manage​r, CEA-Leti

NEMS-based detection for high-performance inertial & pressure sensors

Micro & Nanosystems Project Manager, CEA-Leti

Jean-Philippe Polizzi

Micro & Nanosystems Project Manager, CEA-Leti

PMUT

Microsensors & Actuators ​Project Manager, CEA-Leti

Marc Sansa Perna

Microsensors & Actuators ​Project Manager, CEA-Leti

Enabling high efficiency sensing with optomechanical devices

Optical Sensors Industrial Partnerships Manager, CEA-Leti

Vincent Destefanis

Optical Sensors Industrial Partnerships Manager, CEA-Leti

Mid-Infrared Photoacoustic Sensing

Healthtech Partnerships Manager, CEA-Leti

Olivier Fuchs

Healthtech Partnerships Manager, CEA-Leti

Non invasive medical devices

Integrated Photonics Program Manager, CEA-Leti

Bertrand Szelag

Integrated Photonics Program Manager, CEA-Leti

Silicon Photonics Activities at CEA-Leti

Testimonies and Semiconductor Industry Corporate Keynotes

VP AI Models, HPinc

Albert Orriols Puig

VP AI Models, HPinc

Senior Director, Intel Corp.

Umashankar Anandakumar

Senior Director, Intel Corp.

Semiconductor Deep Tech Devices and Startups

Head of RF Architecture & IC Design Lab, Senior Expert,CEA-Leti

Baudoin Martineau

Head of RF Architecture & IC Design Lab, Senior Expert,CEA-Leti

Addressing the future challenges of wireless communications

Industrial Partnerships Manager, CEA-Leti

Swan Gerome

Industrial Partnerships Manager, CEA-Leti

Addressing the future challenges of wireless communications

MicroLED Parterships Manager, CEA-Leti

Vygintas Jankus

MicroLED Parterships Manager, CEA-Leti

MicroLED for Data Com

Head of Memory & Computing Laboratory, CEA-Leti

Philippe Rodriguez

Head of Memory & Computing Laboratory, CEA-Leti

Tools & Process, from lab to fab

3D Integration & Bonding Division, CEA-Leti

Sylvie Joly

3D Integration & Bonding Division, CEA-Leti

Advanced packaging and 3D integration

PhD Senior Research Engineer, CEA-Leti

William Guicquero

PhD Senior Research Engineer, CEA-Leti

Smart imaging

Deputy Head of the Integrated Circuit & System Division, CEA-List​

Olivier Thomas

Deputy Head of the Integrated Circuit & System Division, CEA-List​

Chiplet Design System & Accelerators

02:30 p.m. - 03:30 p.m.

Closing Remarks and Networking