Plenary Session
Advanced semiconductors: the AI advantage from Edge to Cloud
Beyond algorithms, what will it take for AI to realize its full potential for businesses and society? Advanced semiconductors!
Join global semiconductor industry leaders at Leti Innovation Days 2025 for inspiring keynotes, of what’s next in CEA-Leti’s lab-to-fab pipeline.
You’ll come away with concrete answers to your strategic questions about how to make your devices, components, and systems more efficient in today’s fast-paced AI landscape.
Welcome Coffee, Exhibition & Networking
Chairman
Michael Tchagaspanian
EVP Strategic Partnerships, CEA-Leti
Speakers
Sébastien Dauvé
CEO, CEA-Leti
Sébastien Dauvé
CEO, CEA-Leti
Bio:
Sébastien Dauvé was named CEO of CEA-Leti effective on July 1, 2021, after more than twenty years of experience in microelectronics technologies and their applications, including clean mobility, medicine of the future, cybersecurity, and power electronics.
Sébastien Dauvé started his career at the French Armament Electronics Center, where he worked on developing synthetic-aperture radar. In 2003, he joined CEA-Leti as an industrial transfer manager and supervised several joint research laboratories, in particular with the multinational Michelin.
In 2007, Sébastien Dauvé became a laboratory manager, then head of an R&D department in the area of sensors applied to the Internet of things and electric mobility. During this time, he supported the dissemination of new technologies in industry, including the automotive industry (Renault), aeronautics, national defense (SAFRAN), and microchips with the industry leader Intel. He played an active role in the creation of start-ups in application fields ranging from health to infrastructure security, leading to dozens of new jobs. In 2016, he became Director of the CEA-Leti Systems Division.
From sensors to wireless communication, Sébastien Dauvé has played an active role in the digital transformation, focused on coupling energy frugality and performance. He has made cross-disciplinary approaches central to innovation by harnessing the expertise of talented teams with diverse backgrounds. Their goal is to provide technological tools for meeting the major societal challenges of the future.
Sébastien Dauvé is a graduate of the French Ecole Polytechnique and the National Higher French Institute of Aeronautics and Space (ISAE-SUPAERO).
Jean-René Lèquepeys
CTO, CEA-Leti
Jean-René Lèquepeys
CTO, CEA-Leti
Bio:
Jean-René Lèquepeys received an engineering degree in 1983 from CentraleSupélec, a top French graduate engineering school at Paris-Saclay University, France. He taught physics during 2 years in Ouarzazate, Morocco.
He joined CEA, a French Research and Technology Office focusing on applied research, in Paris Saclay in 1985. He first worked at the laboratory of the Central Security Office, on the evaluation of means of detection and intrusion. Two years later, he was promoted head of this laboratory.
In 1993, he moved to Grenoble, France, and joined the System Division of CEA-Leti. He worked on different projects in the field of image processing and telecommunication technologies. In particular, he was responsible for the "Telecom, Communicating Objects and Smart Card" programs from 1999 to 2004.
In 2005, he took the responsibility of the Circuits Design Division at CEA-Leti (200 people). He launched new research activities at CEA such as a new laboratory in Aix-en-Provence, France, on the development of secured chips. In 2000, Jean-René Lèquepeys received the prestigious award from the french Société de l'Electricité, de l'Electronique et des technologies de l'information et de la communication (SEE) "Grand Prix de l'électronique Général Ferrié" for his work in the telecommunications field (he holds 15 patents).
In 2010, he launched a new division at CEA focusing on Electronic Architectures, Integrated Circuit Design and Embedded Software. He established the structure on two sites (Paris and Grenoble) and led the division twice in his career.
He rapidly got involved in the creation of the Silicon Components Division at CEA-Leti, and took the lead of it in 2011 managing 350 people. Division encompasses micro and nanoelectronics (SOI, nanodots, quantum, memories, 3D technologies, substrates), Micro Systems (sensor, actuator, radiofrequency components) and Power Components. He established the French Nano2022 Program for research funding in microelectronics.
In 2019, he was appointed Chief Technology Officer of CEA-Leti, overseeing Science, relations with the European Commission, Industrial Partnership and Strategic Program Management in the scope of the institute (2,000 people, ~€350m budget). He took the responsibility of the Microelectronic Program at CEA level, spearheading technological and upstream research in the field of semiconductor technologies. For the past 2 years, he has been strongly involved in the CEA-Leti Next Gen FD-SOI project in the frame of France2030 and has played a key role in European chips Act pilot line promoting FD-SOI and Gate All Around technologies.
Having dedicated his career to applied research, he is regularly invited as a keynote speaker in international semiconductor conferences.
Jean-René is also Vice President of ACSIEL, a professional trade union gathering industrial companies in the French electronic value chain, member of the Board of EPOSS, the European Technology Platform on Smart Systems Integration, a member of the Board of AENEAS, the Association for Europoean NanoElectronics Activities, and an expert consultant for the European Commission and French Research Agency
Michael Tchagaspanian
EVP Strategic Partnerships, CEA-Leti
Michael Tchagaspanian
EVP Strategic Partnerships, CEA-Leti
Kaïs Mnif
Trixell, CEO
Kaïs Mnif
Trixell, CEO
Bio:
Kaïs Serves as CEO to Trixell, a joint venture between Thales, Siemens, and Philips specialized in X-ray flat panel detectors. He's also Head of the Radiology business at Thales.
Kaïs joined Thales in 2014 in Singapore as Business Development Director covering Asia. He then led the air traffic navigation aids Business of Thales, based in Milan.
Before joining Thales, he spent 18 years in the Automotive then the Railway industry where he held several management positions around the world.
Kais holds an engineering degree in automation and electronics from INSA Toulouse, a Master degree in enterprise administration from IAE Toulouse, and an MBA from INSEAD.
He's occasionally a guest lecturer in decision sciences, and multicultural leadership.
Abstract:
A bit like the concept of 'terroir' in wine making defines the unique combination of environmental factors and human practices in a specific location, industrial clusters are sometimes born from similar unique combinations.
Trixell was born from such favorable combinations of environmental factors : proximity with CEA and top universities, facilitated access to a large local talent pool, and a rich regional supply chain, to mention a few.
My presentation will quickly describe how about 30 years ago the flat panel detector was invented here, and why the next innovations in X-Ray imaging will continue to be invented here and what we're doing about it together with the CEA.
Hervé Bouaziz
President, Lynred
Hervé Bouaziz
President, Lynred
Bio:
Hervé Bouaziz was appointed executive President of LYNRED, a world leader in Infrared detectors, in December 2023. Prior to that he held various positions of responsibility within SAFRAN Group, as Director of Strategy and M&A within Safran Electronics and Defense, and as Director of Military Engines Programs within Safran Aircraft Engines. He also worked 20 years in Aerospace at DGA, the Defense Armament Procurement Agency of the French Ministry of Defense, on military aircraft Programs and as an Armament Attaché in Washington DC. Hervé is a graduate of Ecole Polytechnique, SupAéro, and the Industrial Colllege of the Armed Forces (USA). He also earned his wings as a military pilot in the Armée de l'Air et de l'Espace.
Abstract:
Infrared sensing and imaging is a fast expanding market due to its inherent unique characeritics
Trend is clearly toward high resolution, miniaturization, low power consumption and agile image correction with AI
Anticipation of high demand in mobility, industrial control, environment, Robotics, with applications involving the use of AI
Generalization of usage will draw a strong requirement for better competitivity, and high volume production capacity
LYNRED is gearing up to meet this challenge with its partners and its brand new CAMPUS manufacturing capability
Barbara De Salvo
Director of Research, META
Herman Boom
EVP Deep Business Line DUV, ASML
Thibault Basquin
Executive Board Co-Head, ARDIAN Buyout
Emmanuel De Gabory
General Manager Head of Research Lab, NEC
Erik Hadland
Director of Technology Policy, SIA
