Plenary Session
Advanced semiconductors: the AI advantage from Edge to Cloud
Beyond algorithms, what will it take for AI to realize its full potential for businesses and society? Advanced semiconductors!
Join global semiconductor industry leaders at LID World Summit 2025 for inspiring keynotes, of what’s next in CEA-Leti’s lab-to-fab pipeline.
You’ll come away with concrete answers to your strategic questions about how to make your devices, components, and systems more efficient in today’s fast-paced AI landscape.
Welcome Coffee, Exhibitions & Networking
Chairman
Michael Tchagaspanian
EVP Strategic Partnerships, CEA-Leti
Speakers
Sébastien Dauvé
CEO, CEA-Leti
Sébastien Dauvé
CEO, CEA-Leti
Bio:
Sébastien Dauvé was named CEO of CEA-Leti effective on July 1, 2021, after more than twenty years of experience in microelectronics technologies and their applications, including clean mobility, medicine of the future, cybersecurity, and power electronics.
Sébastien Dauvé started his career at the French Armament Electronics Center, where he worked on developing synthetic-aperture radar. In 2003, he joined CEA-Leti as an industrial transfer manager and supervised several joint research laboratories, in particular with the multinational Michelin.
In 2007, Sébastien Dauvé became a laboratory manager, then head of an R&D department in the area of sensors applied to the Internet of things and electric mobility. During this time, he supported the dissemination of new technologies in industry, including the automotive industry (Renault), aeronautics, national defense (SAFRAN), and microchips with the industry leader Intel. He played an active role in the creation of start-ups in application fields ranging from health to infrastructure security, leading to dozens of new jobs. In 2016, he became Director of the CEA-Leti Systems Division.
From sensors to wireless communication, Sébastien Dauvé has played an active role in the digital transformation, focused on coupling energy frugality and performance. He has made cross-disciplinary approaches central to innovation by harnessing the expertise of talented teams with diverse backgrounds. Their goal is to provide technological tools for meeting the major societal challenges of the future.
Sébastien Dauvé is a graduate of the French Ecole Polytechnique and the National Higher French Institute of Aeronautics and Space (ISAE-SUPAERO).
Rudi De Winter
CEO, X-FAB
Rudi De Winter
CEO, X-FAB
Bio:
Rudi De Winter joined X-FAB in 2011 as Co-CEO and became CEO in 2014. Between 1996 and 2011 he served as the chief executive officer and managing director of Melexis NV. Prior to that date, Mr. De Winter served as a development engineer at Mietec Alcatel, Belgium, from 1984 to 1985 and as a development manager at Elmos GmbH, Germany, from 1985 to 1989. In 1990, Mr. De Winter became director of XTRION NV, the parent company of X-FAB. Mr. De Winter holds a Degree in Electronic Engineering from the University of Ghent.
Abstract:
Deirdre Hanford
CEO, NATCAST
Deirdre Hanford
CEO, NATCAST
Bio:
In January 2024, Deirdre Hanford was appointed Chief Executive Officer of Natcast, the operator of the National Semiconductor Technology Center (NSTC). Established by the U.S. CHIPS and Science Act, the NSTC is a public-private consortium driving U.S.-led semiconductor innovation and economic and national security.
Prior to Natcast, Hanford served as an executive at Synopsys in a career spanning over thirty-six years. She has served on many industry advisory boards, including being a leader in the Department of Commerce Industrial
Advisory Committee formed through the CHIPS Act.
Among her industry accolades, Hanford was selected to receive the 2025 IEEE Frederik Philips Award “for visionary leadership in electronic design automation
for secure and energy-efficient microelectronics” in July 2024.
Hanford earned a B.S. Engineering (electrical engineering) from Brown University and an M.S.E.E. from University of California, Berkeley.
Abstract:
Semiconductor R&D continues to present enormous opportunity in developing the technologies of tomorrow. Deirdre Hanford will discuss the need for cross-industry collaboration and innovation at all levels of the semiconductor stack, including the role of the recently established U.S. National Semiconductor Technology Center (NSTC) in convening stakeholders from across the ecosystem; fostering the development of a skilled workforce; and its exploration of semiconductor research in the AI era.
Dr. Ahmad Bahai
SVP & CTO, Texas Instruments
Dr. Ahmad Bahai
SVP & CTO, Texas Instruments
Bio:
Dr. Ahmad Bahai is the Senior Vice President and Chief Technology Officer (CTO) at Texas Instruments, where he leads groundbreaking innovation, corporate research, and Kilby Labs.
He also serves as a Professor of the Practice at the Massachusetts Institute of Technology (MIT), is an IEEE Fellow, and is a member of the Industrial Advisory Committee for the CHIPS Act. Previously, Dr. Bahai contributed to the President’s Council of Advisors on Science and Technology’s semiconductor working group. From 2017 to 2022, he was an Adjunct Professor at Stanford University and, from 2001 to 2010, a Professor in Residence at UC Berkeley.
Dr. Bahai’s technology leadership experience includes roles as Director of Research Labs and CTO at National Semiconductor, Technical Manager of a research group at Bell Laboratories, and Founder of Algorex, a communications and acoustic IC and systems company acquired by National Semiconductor.
He has authored over 80 publications in IEEE/IEE journals and holds more than 40 patents related to systems and circuits. Dr. Bahai earned a Master of Science in Electrical Engineering from Imperial College, University of London, and a Ph.D. in Electrical Engineering from the University of California, Berkeley.
Abstract:
Advancements in semiconductor technology, along with improvements in analog and digital signal processing, connectivity, battery technology, and security, have accelerated the deployment of intelligent sensing and actuation across diverse applications. However, nature often offers more efficient edge computing solutions by leveraging hierarchical signal processing to enhance performance and minimize energy consumption in intelligent sensory systems.
In this talk, we explore cutting-edge examples of low-power machine learning at the extreme edge, including bio-inspired sensor fusion. We will examine how innovations in devices, circuits, and machine learning systems are converging to drive the next generation of intelligent, energy-efficient sensing and actuation technologies.
Kaïs Mnif
CEO, Trixell
Kaïs Mnif
CEO, Trixell
Bio:
Kaïs Serves as CEO to Trixell, a joint venture between Thales, Siemens, and Philips specialized in X-ray flat panel detectors. He's also Head of the Radiology business at Thales.
Kaïs joined Thales in 2014 in Singapore as Business Development Director covering Asia. He then led the air traffic navigation aids Business of Thales, based in Milan.
Before joining Thales, he spent 18 years in the Automotive then the Railway industry where he held several management positions around the world.
Kais holds an engineering degree in automation and electronics from INSA Toulouse, a Master degree in enterprise administration from IAE Toulouse, and an MBA from INSEAD.
He's occasionally a guest lecturer in decision sciences, and multicultural leadership.
Abstract:
A bit like the concept of 'terroir' in wine making defines the unique combination of environmental factors and human practices in a specific location, industrial clusters are sometimes born from similar unique combinations.
Trixell was born from such favorable combinations of environmental factors : proximity with CEA and top universities, facilitated access to a large local talent pool, and a rich regional supply chain, to mention a few.
My presentation will quickly describe how about 30 years ago the flat panel detector was invented here, and why the next innovations in X-Ray imaging will continue to be invented here and what we're doing about it together with the CEA.
Barbara De Salvo
Director of Research, META
Jean-René Lèquepeys
CTO, CEA-Leti
Jean-René Lèquepeys
CTO, CEA-Leti
Bio:
Jean-René Lèquepeys received an engineering degree in 1983 from CentraleSupélec, a top French graduate engineering school at Paris-Saclay University, France. He taught physics during 2 years in Ouarzazate, Morocco.
He joined CEA, a French Research and Technology Office focusing on applied research, in Paris Saclay in 1985. He first worked at the laboratory of the Central Security Office, on the evaluation of means of detection and intrusion. Two years later, he was promoted head of this laboratory.
In 1993, he moved to Grenoble, France, and joined the System Division of CEA-Leti. He worked on different projects in the field of image processing and telecommunication technologies. In particular, he was responsible for the "Telecom, Communicating Objects and Smart Card" programs from 1999 to 2004.
In 2005, he took the responsibility of the Circuits Design Division at CEA-Leti (200 people). He launched new research activities at CEA such as a new laboratory in Aix-en-Provence, France, on the development of secured chips. In 2000, Jean-René Lèquepeys received the prestigious award from the french Société de l'Electricité, de l'Electronique et des technologies de l'information et de la communication (SEE) "Grand Prix de l'électronique Général Ferrié" for his work in the telecommunications field (he holds 15 patents).
In 2010, he launched a new division at CEA focusing on Electronic Architectures, Integrated Circuit Design and Embedded Software. He established the structure on two sites (Paris and Grenoble) and led the division twice in his career.
He rapidly got involved in the creation of the Silicon Components Division at CEA-Leti, and took the lead of it in 2011 managing 350 people. Division encompasses micro and nanoelectronics (SOI, nanodots, quantum, memories, 3D technologies, substrates), Micro Systems (sensor, actuator, radiofrequency components) and Power Components. He established the French Nano2022 Program for research funding in microelectronics.
In 2019, he was appointed Chief Technology Officer of CEA-Leti, overseeing Science, relations with the European Commission, Industrial Partnership and Strategic Program Management in the scope of the institute (2,000 people, ~€350m budget). He took the responsibility of the Microelectronic Program at CEA level, spearheading technological and upstream research in the field of semiconductor technologies. For the past 2 years, he has been strongly involved in the CEA-Leti Next Gen FD-SOI project in the frame of France2030 and has played a key role in European chips Act pilot line promoting FD-SOI and Gate All Around technologies.
Having dedicated his career to applied research, he is regularly invited as a keynote speaker in international semiconductor conferences.
Jean-René is also Vice President of ACSIEL, a professional trade union gathering industrial companies in the French electronic value chain, member of the Board of EPOSS, the European Technology Platform on Smart Systems Integration, a member of the Board of AENEAS, the Association for Europoean NanoElectronics Activities, and an expert consultant for the European Commission and French Research Agency
Hervé Bouaziz
President, Lynred
Hervé Bouaziz
President, Lynred
Bio:
Hervé Bouaziz was appointed executive President of LYNRED, a world leader in Infrared detectors, in December 2023. Prior to that he held various positions of responsibility within SAFRAN Group, as Director of Strategy and M&A within Safran Electronics and Defense, and as Director of Military Engines Programs within Safran Aircraft Engines. He also worked 20 years in Aerospace at DGA, the Defense Armament Procurement Agency of the French Ministry of Defense, on military aircraft Programs and as an Armament Attaché in Washington DC. Hervé is a graduate of Ecole Polytechnique, SupAéro, and the Industrial Colllege of the Armed Forces (USA). He also earned his wings as a military pilot in the Armée de l'Air et de l'Espace.
Abstract:
Infrared sensing and imaging is a fast expanding market due to its inherent unique characeritics
Trend is clearly toward high resolution, miniaturization, low power consumption and agile image correction with AI
Anticipation of high demand in mobility, industrial control, environment, Robotics, with applications involving the use of AI
Generalization of usage will draw a strong requirement for better competitivity, and high volume production capacity
LYNRED is gearing up to meet this challenge with its partners and its brand new CAMPUS manufacturing capability
Herman Boom
Executive Vice President Business Line DUV, ASML
Herman Boom
Executive Vice President Business Line DUV, ASML
Bio:
Herman was appointed as Executive Vice President in September 2018, leading Development and Engineering. On April 1st 2022 he was appointed Head of Business Line DUV
He joined ASML as from February 1997. He held various positions from engineering, project management, product development and program management for EUV programs, Twinscan-, DUV-, and immersion programs.
Herman graduated from TU Eindhoven Applied Physics after finalizing a master projects on semi-conductor optics in cooperation with Semiconductor physics group of RWTH Aachen.
Abstract:
AI is everywhere, requiring more data ingestion and compute than ever, driving a breath of applications and semicon requirements – both in leading edge and mainstream.
Core challenges for the ecosystem are energy efficiency, affordability, and scalability of the periphery.
ASML aims to address these in our innovations & product roadmap, as well as by architecting More than Moore solutions.
On the other side of the spectrum, ASML is also deploying AI across the company & operation. Herman will share the landscape of ASML AI domains, as well as concrete examples and their progression over time.
Thibault Basquin
Member of the Executive Committee & Co-Head of Buyout, ARDIAN
Thibault Basquin
Member of the Executive Committee & Co-Head of Buyout, ARDIAN
Bio:
Thibault is Member of the Executive Committee of Ardian and Co-Head of Ardian Buyout. He also oversees the recently launched Ardian Semiconductor platform initiative.
He joined Ardian in 2001 and has led many successful transactions. In 2018, he moved to New York to launch the US Buyout group. In 2010, Thibault contributed strongly to the launch of the Ardian Foundation. He began his career in 2000 at Arthur Andersen as an auditor.
Thibault graduated from ESCP Europe in Paris with a master's degree in Finance.
Since 2020, he is a also a member of the Board of Trustees of L'Alliance New York, as well as the ESCP Foundation Inclusion & Diversity Committee in Paris.
His family is based in New York since 2018 and he splits his time between New York and Paris.
Abstract:
Emmanuel Le Taillandier de Gabory
General Manager, NEC Corporation
Emmanuel Le Taillandier de Gabory
General Manager, NEC Corporation
Bio:
Emmanuel Le Taillandier de Gabory was born in Libourne, France, in 1975. He received a MSc from the École Supérieure d’Optique, Orsay, France, in 1999 and an EMBA from Waseda University in 2018. From 2000 to 2007, he worked with Fujitsu Quantum Device Ltd., Yamanashi, Japan. In 2007, he joined NEC Corporation, Kanagawa, Japan, where he is currently the General Manager heading Advanced Network Research Laboratories. The research activities of his laboratories cover high capacity optical transport systems, digital signal processing for communication, quantum cryptography, space communication, beyond 5G mobile communication and applied sensing.
He has authored and coauthored more than 80 papers and 30 patent applications. He is a senior member of the IEICE (Japan) and he has been serving in technical committees of major conferences in the communication field.
Abstract:
In this talk, we will explore the transformative potential of AI technologies, including generative AI, for communication networks. We will discuss how these technologies can drive growth, enhance efficiency, improve performance, and transform communication infrastructure. Additionally, we will address the critical challenges posed by AI infrastructure requirements for communication technologies.
Erik Hadland
Director of Technology Policy, SIA
Erik Hadland
Director of Technology Policy, SIA
Bio:
Erik Hadland is the Director of Technology Policy at the Semiconductor Industry Association (SIA), where he is responsible for the association’s research, development, and technology activities as well as its education and workforce development efforts. In this role, he works with the White House, Federal agencies, and Congress to inform policymakers about the needs and functions of the diverse segments of the semiconductor industry.
Prior to SIA, Erik was a AAAS Science and Technology Policy Fellow at the U.S. Department of Energy, where he served as Advisor to the Director of the Office of Science—the Nation’s largest supporter of fundamental physical science research and stewarding office of 10 of the Department’s National Laboratories. In this capacity, Erik project managed briefings to the Congress on critical and emergent technologies, advised on matters of place-based innovation and technology transfer, and co-facilitated the Department’s Microelectronics Working Group. Prior to the DOE, Erik was a Senior Logic Technology Development Engineer at Intel, piloting first-of-a-kind annealing modules and processing conditions for Intel’s next generation logic products.
Erik earned his PhD in Solid State Chemistry from the University of Oregon, where he studied novel synthesis schemes for metastable 2D semiconductor compounds.
Abstract:
Pierre Barnabé
CEO, Soitec
Pierre Barnabé
CEO, Soitec
Bio:
Pierre Barnabé was nominated as Soitec CEO in January 2022 and joined the company four months later.
He was previously Executive Vice-President in charge of Big Data & Cybersecurity at technology group Atos (2015-2021), where he also led the Public Sector & Defense division and manufacturing operations before serving as interim Group CEO in 2021.
Prior to its acquisition by Atos in 2014, Pierre Barnabé was Deputy CEO of Bull. He then served as Bull’s Chairman & CEO from 2015 to 2021, spearheading the company’s evolution into a global leader in cybersecurity services and supercomputing.
From 2011 to 2013, he was Managing Director of the Enterprise branch of SFR, the French telecoms operator, where he launched cloud computing and very high-speed broadband activities.
That followed a 13-year stint during which he held various positions at Alcatel and Alcatel-Lucent, first in sales and later as Chairman & Managing Director of Alcatel-Lucent France (formerly Alcatel CIT) and Group Deputy Managing Director for Human Resources and Transformation.
A graduate of the NEOMA Business School and Ecole Centrale in Paris, Pierre Barnabé began his career in 1994 in Silicon Valley, developing corporate venture capital and capital risk activities for Thales Group. He then moved to Thales headquarters in Paris, where he was in charge of strategy and acquisitions for the Communication and Command division.
A member of the board of the multinational market firm Ipsos, he also served as Chairman of the Board of ENSIMAG Grenoble, the prestigious Grande École specializing in computer science, applied mathematics and telecommunications (2016-2022) and on the board of France’s National Institute for Research in Digital Science and Technology (INRIA) from 2021 to 2022. Pierre Barnabé is a Knight of the French National Order of Merit.
Ashkan Seyedi
Director, Optical Interconnect Products, NVIDIA
Ashkan Seyedi
Director, Optical Interconnect Products, NVIDIA
Bio:
As the Director of Silicon Photonics Products at NVIDIA, Ashkan Seyedi is at the vanguard of merging photonics with cutting-edge computing architectures, particularly in the spheres of generative AI and machine learning. Seyedi's expertise in silicon photonics is pivotal to the advancement of hardware technologies that underpin large language models and AI computations.
Since June 2023, he has spearheaded the integration of multidisciplinary teams to create interconnect solutions for next-generation GPU and CPU products. Prior to this, Seyedi served as a Silicon Photonics Product Architect at NVIDIA, where he played a crucial role in developing interconnect technologies over two years.
Before joining NVIDIA, Seyedi was a Senior Research Scientist at Hewlett Packard Labs, where he led a team in developing a commercial process design kit (PDK) for silicon photonics. His tenure there, spanning nearly seven years, included managing projects funded by various US Government agencies and collaborating with external companies on new products and software tools for electronic design automation.
Seyedi holds a Ph.D. from the University of Southern California, where he conducted groundbreaking research in nanowire photodetectors, solar cells, and LEDs, contributing significantly to the field of photonics. His early career also includes a stint as a Testing Intern at Intel Labs, where he worked on silicon modulators and integrated III-V lasers, achieving milestones in high-speed optical communications.
Abstract:
Yoshinami Takahashi
COO & Head of Global Solution Business Group, Fujitsu
Yoshinami Takahashi
COO & Head of Global Solution Business Group, Fujitsu
Bio:
Yoshinami Takahashi joined Sony Corporation in 1987 and was involved in overseas business in the consumer division, including postings in North America and Europe, and served as an officer at overseas bases. He joined Microsoft Japan Corporation in 2014, leading the cloud market, partner collaboration, and DX support for enterprise customers. Since June 2021, he has been leading the Fujitsu Uvance business as Managing Executive Officer.
Abstract:
Michael Tchagaspanian
EVP Strategic Partnerships, CEA-Leti
Michael Tchagaspanian
EVP Strategic Partnerships, CEA-Leti
