Program

Franck Paris

Director of the French Office in Taipei

Opening Remarks & Strategic Introduction

Sébastien Dauvé

CEO, CEA-Leti

AI: the Semiconductor Industry Workhorse. Energy efficiency, innovative components and smart computing are our best enablers

Jen-Ming Wu

Director of Next-Generation Communications Research Center, Foxconn

Challenges and Trends for the New Space LEO Satellite and Next Generation Non-Terrestrial Network Communications

Sylvie Joly

3D Integration and Packaging Partnership Manager, CEA-Leti

3D & Heterogeneous Integration: Pioneering Advanced Solutions with CEA-Leti

Eléonore Hardy

Silicon Photonics Partnership Manager, CEA-Leti

Silicon Photonics: Shaping the Future of Advanced Computing and Sensing

Chih Tsung Shih

Technical Manager, TSMC

Silicon Photonics, next challenges and solutions

Martin Gallezot

Deputy Head Silicon Components Division, CEA-Leti

Power Electronic solutions, key enabling technologies for AI and Datacenters 

Olivier Thomas

Deputy Head of the Digital IC Division, CEA-List

Co-Optimizing Design and Technology: Bridging Development and System Integration

Vygintas Jankus

MicroLED Partnership Manager, CEA-Leti

MicroLED Technologies at CEA-Leti: a New Era for High-Speed Interconnect and Displays

Panel Session

Semiconductor Disruptions: Building the Future Through Collaboration
Hear from key Taiwanese semiconductor industry players, learn how to strengthen partnerships, and prepare for changes in future business demands & models

Jen-Ming Wu, Director of Next-Generation Communications Research Center, Foxconn; Leroy Liu, CSO, CEO & President’s Office, Realtek; Cheryl Liu, Field Application Engineering Manager, Aledia; Sébastien Dauvé, CEO, CEA-Leti

Michael Tchagaspanian

EVP, Strategic Partnership, CEA-Leti

How does a partnership with CEA-Leti work?