Speakers
Frédéric Jung
Consul General of France in San Francisco
Rouzbeh Borhani
Head of Semiconductors, Plug and Play Tech Center
Michael Tchagaspanian
EVP Strategic Partnership, CEA-Leti
Michael Tchagaspanian
EVP Strategic Partnership, CEA-Leti
Nicolas Bedouin
VP Partnerships North America, CEA
Jean-Philippe Fricker
Chief System Architect and Co-Founder, Cerebras Systems
Jean-Philippe Fricker
Chief System Architect and Co-Founder, Cerebras Systems
Bio :
Jean-Philippe (J.P.) is Chief System Architect at Cerebras Systems. Before co-founding Cerebras, J.P. was Senior Hardware Architect at rack-scale flash array startup DSSD (acquired by EMC). Prior to DSSD, J.P. was Lead System Architect at SeaMicro where he designed three generations of fabric-based computer systems. Earlier in his career, J.P. was Director of Hardware Engineering at Alcatel-Lucent and Director of Hardware Engineering at Riverstone Networks. He holds an MS in Electrical Engineering from École Polytechnique Fédérale de Lausanne, Switzerland, and has authored 24 patents.
Frédéric Morestin
VP Marketing Imaging, STMicroelectonics
Philippe Robert
CEO, iNGage
Philippe Robert
CEO, iNGage
Bio :
Philippe Robert is CEO and co-founder of iNGage, a deeptech startup developing a new generation of high-performance MEMS sensors. He holds a PhD in Microtechnologies and began his career at the startup SILMAG, developing advanced magnetic sensor technologies for data storage, before joining THALES to work on high-end MEMS inertial sensors for aerospace and defense applications.
He joined CEA-Leti in 2001, where he held successive leadership roles, including Head of the MEMS Sensors Laboratory and Head of the Microsystems Department (120+ people), before leading Business Development for Microsystems.
In 2025, he founded iNGage as CEO & CTO, leading corporate strategy, fundraising, and execution.
He has authored over 50 scientific publications and holds more than 60 patents, including more than 20 related to the M&NEMS architecture at the core of iNGage’s innovation.
Jean-Philippe Polizzi
Micro & Nanosystems Project Manager, CEA-Leti
Marc Sansa Perna
Project Manager, Optomechanical Sensors Expert, CEA-Leti
Marc Sansa Perna
Project Manager, Optomechanical Sensors Expert, CEA-Leti
Bio:
Marc Sansa obtained his Ph.D. degree in electronic engineering from the Universitat Autònoma de Barcelona, Barcelona, Spain, in 2013. He is an expert in microelectromechanical system (MEMS) sensors, RF MEMS and optomechanics, having co-authored over 50 publications and several patents. He is currently a project manager at the Sensors and Actuators Laboratory of CEA-Leti.
Vincent Destefanis
Optical Sensors Industrial Partnership Manager, CEA-Leti
Vincent Destefanis
Optical Sensors Industrial Partnership Manager, CEA-Leti
Bio:
Vincent Destefanis is a Partnership Manager for the Optics and Photonic division of CEA-Leti since 2023. Since 2006, he was successively a R&D engineer, a senior technical expert and a partnership manager, this for various leading-edge photonic and CMOS companies (Lynred, STMicroelectronics and IBM).
He holds Master's and Engineering degrees in Electronics, Physics and Materials Science. During his career, Vincent has been successful in creating long-term value in the CMOS and photonic industries, from various valuable contributions to industrial projects and partnerships.
Vincent is now dedicated to the development of industrial partnerships for the development and tech transfer to industry of beyond the state of the art photonic sensing solutions addressing a wide scope of applications.
Abstract:
Global demand for accurate non-invasive glucose monitoring remains unmet, because most wearable technologies fail to deliver the required clinical performance. CEA-Leti offers a device breakthrough with mid-infrared quantum cascade laser (QCL) photoacoustic technology on silicon. Operating in the mid-IR spectrum, it provides the specificity and sensitivity needed for real-time biomarker tracking without invasive sampling.
Engineered for large-scale semiconductor manufacturing, the system ensures cost-effectiveness and significant scalability. Its retunable architecture allows a single hardware design to detect diverse biomarkers across medical and industrial sectors. The institute aims to accelerate time-to-market through this multilateral industrial program.
This initiative reshapes non-invasive monitoring, enabling next-generation smart wearables like smartwatches for sport, wellness, and health. By translating this breakthrough into low-cost devices, CEA-Leti opens pathways for detecting crucial biomarkers and molecules beyond glucose, addressing global consumer demand, while overcoming previous technological limitations.
Olivier Fuchs
Healthtech Partnerships Manager, CEA-Leti
Bertrand Szelag
Integrated Photonics Program Manager, CEA-Leti
Umashankar Anandakumar
Senior Director, Intel Corp.
Baudoin Martineau
Head of RF Architecture & IC Design Lab, Senior Expert,CEA-Leti
Swan Gerome
RF & Telecommunications Industrial Partnership Manager, CEA-Leti
Swan Gerome
RF & Telecommunications Industrial Partnership Manager, CEA-Leti
Bio:
Swan GEROME is Technology Partnership Manager within the Systems Department, with a focus on RF and Telecommunications at CEA-Leti.
He holds a degree in Marketing and Sales Management from Grenoble IAE and has over 15 years of experience in the semiconductor industry across materials, design, and research companies.
From 2008 to 2014, he served as Sales Manager at Dolphin Integration, developing business for ASIC design, analog silicon IP, and libraries for foundries, fabless companies, design houses, and OEMs. He also managed a team of sales coordinators in Asia (Japan, South Korea, and Taiwan) as well as in Europe.
He joined CEA-Leti in 2015 as Industrial Partnership Manager for the Systems Department, covering sensor integration, energy management, embedded data processing, and RF telecommunications (antenna design and integration, protocols development, and RFIC design). In this role, he developed partnerships with national and international companies, ranging from startups to Big Tech.
Between 2022 and 2023, he was Product Marketing Manager for the Connect-SOI Business Unit at Soitec, where he developed the roadmap for engineered silicon substrates for RF applications and launched new products to address market requirements.
Abstract:
Harnessing dielectric permittivity the property that describes how electric fields propagate through matter CEA‑Leti researchers have built a non‑invasive, chip‑scale technology that maps the hidden electrical signatures of cells and materials.
The device emits radio‑frequency from 30KHz to 30GHz, captures transmitted and reflected signals, and decodes them with a silicon‑integrated vector network analyzer (VNA). This yields an ultra‑miniaturized, low‑cost, low‑power, wide‑band system that can be embedded in portable and wearable devices.
This session will show how CEA-Leti enables non-invasive detection across multiple sectors, such as health care, wellness, agri-food, and automotive by converting dielectric permittivity maps into actionable insights. The technology unlocks a world of applications ranging from cancerous-cell detection, hydration monitoring, process monitoring, and proximity detection.
Vygintas Jankus
MicroLED Partnership Manager, CEA-Leti
Vygintas Jankus
MicroLED Partnership Manager, CEA-Leti
Bio:
Vygintas Jankus is responsible for industrial partnership for MicroLED & OLED technologies at CEA-Leti in Grenoble. He helps partners to develop these technologies for optical & data communication, AR/VR, automotive, and other applications.
Abstract:
This program on microLED datalinks addresses the bandwidth‑energy bottleneck limiting AI‑driven supercomputers. By scaling microLED optical links, the project targets sub‑1 pJ/bit energy use and >10.5 Tbps/mm data density over distances up to 10 meters, enabling point‑to‑point interconnects for CPUs, GPUs and HBM stacks.
Combining device, circuit and 3‑D integration expertise hybrid bonding and high‑density TSVs the consortium will manufacture microLEDs on 200 mm wafers using standard foundry technology, with a clear path to 300 mm scalability.
Why it matters: MicroLEDs offer a mature, low‑power alternative to copper or laser‑based interconnects that can deliver orders‑of‑magnitude speed gains, while sharply reducing power draw. Attendees will see the microLED-for-datacom roadmap, learn how the technology can accelerate AI workloads, lower data-center expenses, and open new opportunities for chipmakers, optical‑component suppliers and hyperscalers.
Philippe Rodriguez
Head of Laboratory, CEA-Leti
Philippe Rodriguez
Head of Laboratory, CEA-Leti
Bio:
Philippe Rodriguez is a research engineer and laboratory manager at CEA-Leti in the Semiconductor Platforms Division.
He received his Ph.D. in 2007 from the University of Lyon 1 in Materials Chemistry for his work on metal organic vapor phase epitaxy growth of B(In)GaAs epilayers. From 2007 to 2009, he worked at the CNRS (French National Center for Scientific Research) developing deposition methods on structured substrates for process intensification applications. In 2009, he started his career at the CEA (French Alternative Energies and Atomic Energy Commission). First, he worked on the coating and fluidization of dense powders by fluidized bed metal-organic chemical vapor deposition for the development of new nuclear fuels (2009 - 2011). Then, he developed silica permeation barriers by magnetron sputtering for laser megajoule gas targets (2011 - 2013). Finally, he joined CEA-Leti in Oct. 2013. His research activity is mainly focused on advanced contact technologies for electronics and photonics applications. He develops contact metallization for advanced CMOS and photonics devices (Si, Ge(Sn), III-V and GaN materials) and also deals with surface preparation and interface modulation prior to metallization. He led the contact team at CEA-Leti between 2017 and 2020 and became head of the Advanced Materials Deposition Laboratory in February 2020. In Sept. 2022, he joined the Surface and Interface Science and Engineering Department and since Jan. 2023, he is in charge of the Laboratory of Wet Surface Preparation, Epitaxy and Thermal Treatment Processes.
He is the author and co-author of approximately 100 peer-reviewed journal articles, 115 international conference papers, 2 book chapters, and 15 patents.
Sylvie Joly
Partnerships Manager 3D integration & Packaging, CEA-Leti
Sylvie Joly
Partnerships Manager 3D integration & Packaging, CEA-Leti
BIO:
Sylvie Joly is currently working as 3D integration and packaging Partnerships Manager at CEA-Leti. Sylvie received M.Sc. in Microelectronics from ISEP "Institut Supérieur d'Electronique de Paris" in 1989. She completed her education with a Master in Marketing and Innovation at the Grenoble Ecole de Management (GEM) in 2001. Prior to this position, she worked for more than 8 years as display business developer at CEA-Leti. In 2004 as Sr. Marketing Engineer in the CEA's Technology Transfer Department, she built a strong experience in setting up and managing technical marketing surveys. Before joining CEA, she spent 10 years in the industry as an R&D engineer, and 8 years as Sales engineer in several companies including Hewlett Packard and Ericsson.
William Guicquero
PhD Senior Research Engineer, CEA-Leti
Olivier Thomas
Deputy Head of the Digital IC Division, CEA-List
Olivier Thomas
Deputy Head of the Digital IC Division, CEA-List
Bio:
Olivier THOMAS is the deputy head of the Digital IC & System Design Division at CEA-List. He is in charge of partnership strategies and ecosystem growth, leveraging his background in system/design-to-technology co-optimization and product engineering within the field of embedded systems innovation. He is author and co-author of 25 patents and 77 publications. He was a pioneer and co-inventor of multi-VT technology utilizing back biasing for FD-SOI, as well as single p-well SRAM. He got is PhD in 2004 from the doctoral school of Computer Science, Telecommunications, and Electronics of Paris.
