Heiko Dudek
Technical Account Manager, 3D-IC & Heterogeneous IC Packaging, Siemens EDA
Bio:
Heiko Dudek joined Siemens in 2021, M.Sc. Electrical Engineering, 26 years in EDA in various positions, including application engineering, R&D, services and technical sales, looking after solutions around advanced IC Packaging and signal and power integrity analysis.
03:00 p.m. - 03:15 p.m.
Thursday [2024][LID-WORLD] 3D Heterogeneous Integration (après-midi)
Technical Account Manager, 3D-IC & Heterogeneous IC Packaging, Siemens EDA
Accelerating 2.5D/3D heterogeneous packaging... more info
