Bio:

Agnieszka has over 23 years of digital transformation and product innovation experience. Recognized as a thought leader in emerging technologies and trends, she has a strong track record of managing and aligning global high performance multicultural teams to deliver strategic value.

Over the past 16 years she has held multiple technical and management roles across HP businesses. As Senior Engineering Director, she drove the delivery of full stack software on devices and to Enterprise customers. As Head of Innovation Partnerships, she gathered and led cross-industry, multidisciplinary research experts to create open collaboration models that unleashed impactful innovation. Her breadth of knowledge ranges from electronics and communication systems to digital manufacturing and complex cyber-physical architectures.

Fluent in four languages, she holds a MSc in Communication Systems Engineering from the University of the Basque Country in Spain.

Abstract:

Since Bill Hewlett and Dave Packard created HP, we have been committed to the advancement of science, industry, and human welfare. Strongly grounded in fundamental scientific principles, our contributions began with audio oscillators and brightest light emitting diodes, then evolved to computing and printing spaces, and extended to microfluidics and voxel manufacturing capabilities enabling our 3D printers.

Today's increasing compute requirements are fueled by artificial intelligence and constrained by Moore's law slow-down and scarcity of natural resources. The growth of highly heterogeneous architectures and devices require new innovative approaches to design and development with a holistic and integrated perspective.

As more software and embedded intelligence are integrated into industrial products and systems, the cyber-physical solutions must be designed with a systemic approach. HP's cyber-physical stack drives this hardware-software co-design and optimization from the application, through the algorithms, and down to the electronic components of our devices.

I will share two examples of our work applied to Compute and Digital Manufacturing.