Bio:

Coming soon

Abstract:

The semiconductor industry underpins global digital transformation, with the ICT market expected to double by 2030 due to advances in AI, 5G, and cloud computing. A fundamental shift toward more resilient, sustainable, and circular manufacturing models is required to enable this growth. Key challenges include reducing water, gas, and metal consumption, minimizing PFAS dependence, and improving effluent circularity.

Attendees will hear how CEA-Leti’s comprehensive sustainability roadmap spanning the entire semiconductor value chain will integrate process innovation with system-level optimization to drive measurable environmental impact reduction. The SubFAB Labs initiative, developed in collaboration with International SubFAB Research Labs (ISRL), is a central pillar of the roadmap. This four-year program, which can be extended, will evaluate the subfab environment, from process to final waste treatment by improving material use, abatement strategy and global effluent? circularity. The aim is to reduce costs and global environmental impact.