Bio:

Makoto Motoyoshi, Ph. D., is CEO of Tohoku-MicroTec Co., Ltd.

1982~1989, at Hitachi, Ltd.;  R&D of SRAM process integration

1989~1992, at Kawasaki Steel Corporation, R＆D of SRAM device and Logic process integration

1992~2005, at Sony Corporation, R&D of SRAM, BiCMOS SRAM and Cache SRAM process integration.

From 2001 to 2005, R&D of MRAM, STT-RAM, FeRAM, RRAM and 3D stacked Image Sensor

2005, at ZyCube(3D start up),

2010, Established T-Micro

Abstract:

T-Micro is a development-oriented foundry specializing in 3D-ICs. We are capable of prototyping 3D-ICs ranging from 12-inch wafer-level to chip-level. In this presentation, in addition to our existing technologies, we will introduce fine-pitch bump interconnects using gold bumps and our chip-level 3D integration services.