Hardware at the Heart of AI

Wednesday, June 18, 2025
Home » LID World Summit 2025 – Hardware at the heart of AI

Toward revolutionary architectures

Advances in hardware are helping democratize AI. However, for widespread AI deployment and adoption to become a reality, disruptive architectures that enable low-power systems will be needed. Learn how living organisms, with their remarkable ability to complete complex tasks using very little energy, are inspiring tomorrow’s AI hardware.

02:30 p.m. - 04:30 p.m. | Afternoon Session

Welcome & Introduction

Co-chairs

Elisa Vianello

Edge IA Program Manager, CEA-Leti

Louis Hutin

Research Engineer, CEA-Leti

02:30 p.m. - 02:45 p.m.
CEO&Founder, SiPearl

Philippe Notton

CEO&Founder, SiPearl

AI: European hardware, the key to Europe's technological sovereignty... more info

02:45 p.m. - 03:00p.m.
Vice President—Product Management, Globalfoundries

Jamie Schaeffer

Vice President—Product Management, Globalfoundries

Coming soon

03:00 p.m. - 03:15 p.m.
Company Fellow, Senior Director of Artificial Intelligence & Embedded Architectures, STMicroelectronics

Giuseppe Desoli

Company Fellow, Senior Director of Artificial Intelligence & Embedded Architectures, STMicroelectronics

Harnessing the power of IMC: transforming edge and generative AI applications ... more info

03:15 p.m. - 03:30 p.m.
Research Engineer, CEA-List

Ivan Miro-Panades

Research Engineer, CEA-List

Pushing the boundaries of embedded AI architectures... more info

03:30 p.m. - 03:45 p.m.
CEA Fellow, Head of Memory and Computing Laboratory, CEA-Leti

François Andrieu

CEA Fellow, Head of Memory and Computing Laboratory, CEA-Leti

Advanced memory technologies for AI at the edge ... more info

03:45 p.m. - 04:00 p.m.
CEO, Weebit Nano

Coby Hanoch

CEO, Weebit Nano

 ... more info

04:00p.m. - 04:15 p.m.
Corporate Vice President and GM, Systems to Materials, Applied Materials

Subi Kengeri

Corporate Vice President and GM, Systems to Materials, Applied Materials

System technology co-optimization in the AI era... more info

04:15 p.m. - 04:20 p.m.

Get some fresh ideas: 180-second pitch by a talented young scientist

04:20 p.m. - 04:35 p.m.
Business Development Manager, EVG

Dr. Bernd Dielacher

Business Development Manager, EVG

3D bonding solutions: Enabling current and next-gen AI devices... more info

Bonus: Attendees will receive the conference proceedings after the event