Franck Paris
Welcome & Introduction
Clark Tseng
Next Market Trends
Pierre Barnabé
Sustainability
Sébastien Dauvé
Innovating for Industry and Society's Challenge
Martin Gallezot
RF and Power Devices
Sylvie Joly
Heterogeneous Wafer-Level Technologies for Chiplet Integration
Benoit Charbonnier
Silicon Photonics
Tuo-Hung Alex Hou
Semiconductor Innovations
Olivier Thomas
Chiplet Design System & Accelerators
Michael Tchagaspanian
Keys to success for CEA-Leti partnerships
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