Bio:

Dr Yvan Morandini received the Degree in engineering from Grenoble Alpes University, France in electronics
and radiofrequencies in 2005 and the PhD degree from Lille University in 2008. After 3 years in
STMicroelectronics he then moved to IBM , Dolphin Integration and then to SOITEC. He is currently Senior Strategic Marketing Manager at SOITEC. He has 20 years of experience in
semiconductor industry including characterization, modeling and design. He has authored/co-authored over
15 papers in international, peer-reviewed journals and conferences, and is Member of Institute of Electrical
and Electronics Engineers (IEEE).

Abstract:

Wireless technologies are constantly evolving to meet the demands of new and emerging applications. The introduction of 5G and the forthcoming 6G wireless systems present significant challenges for the design and implementation of new RF front-end components. To keep pace with this evolution, it's crucial for semiconductor technologies to achieve the RF performance needed for the next-generation RF Front Ends (RFFE). In this presentation, we will discuss the RF technology roadmap, emphasizing engineered substrates that are key to designing the next generation of RFFE.