Bio:

Yvain Thonnart graduated from Ecole Polytechnique and Telecom Paris, France in 2005. He then joined the Technological Research Division of CEA, the French French Alternative Energies and Atomic Energy Commission, within the CEA-Leti institute until 2019, then within the CEA-List institute.
He has led the development of several large research projects for on-chip communications, focusing on the maturation of novel concepts towards industrial adoption, such as communication between multiple voltage and frequency domains, 3D-stacked circuits, and optical on-chip interconnects.
He is now a CEA fellow, and chief scientist for the digital ICs and systems division of CEA-List.

Abstract:

Today's optical interconnects are largely limited to static, point-to-point links, with initialization and training times ranging from microseconds to milliseconds. While suitable for board-level or rack-scale communication, those latencies prevent optical links from being used as a true networking fabric inside multi-die packages. We address this gap by integrating optical switching, routing control and high-speed logic directly with silicon photonics. The result is a dynamically routed optical interconnect that operates at nanosecond timescales, enabling optical communication across centimeter-scale interposers with responsiveness previously limited to short electrical links.