Bio:

After graduating from the Department of Applied Chemistry (majoring in inorganic structural chemistry) at Nagoya University's School of Engineering in 1989, Yasushi Araki joined Fujitsu Limited and worked in the Electronic Devices Division, where he gained extensive knowledge of semiconductor packaging (IC assembly technology), including the development of co-fired multilayer ceramic substrates for supercomputers and MCMs for mobile phones based on organic multilayer substrates.

In 2000, he transferred to Shinko Electric Industries Co., Ltd. and worked in the IC Assembly Division, primarily focused on flip-chip packaging, developing narrow-pitch thermocompression bonding methods, and developing and mass-producing the MCeP® device-embedded package.

In 2021, he was appointed Corporate Officer and General Manager of the Research and Development Division, overseeing the company's R&D activities. He is currently engaged in a wide range of R&D activities aimed at contributing to solving social issues, including digital transformation(DX) and green transformation(GX).