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Sylvie Joly

3D Integration and Packaging Partnerships Manager, CEA-Leti

BIO:

Sylvie Joly is currently working as 3D integration and packaging Partnerships Manager at CEA-Leti. Sylvie received M.Sc. in Microelectronics from ISEP "Institut Supérieur d'Electronique de Paris" in 1989. She completed her education with a Master in Marketing and Innovation at the Grenoble Ecole de Management (GEM) in 2001. Prior to this position, she worked for more than 8 years as display business developer at CEA-Leti. In 2004 as Sr. Marketing Engineer in the CEA's Technology Transfer Department, she built a strong experience in setting up and managing technical marketing surveys. Before joining CEA, she spent 10 years in the industry as an R&D engineer, and 8 years as Sales engineer in several companies including Hewlett Packard and Ericsson.

[2024] Tech Day USA

3D Integration & Bonding Division, CEA-Leti

Advanced packaging and 3D integration

[2024] LID Taiwan

Partnership Manager, 3D integration & advanced packaging, CEA-Leti

Heterogeneous Wafer-Level Technologies for Chiplet Integration