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Philippe Garnier

Senior Member of Technical Staff – Wet & Bonding R&D, STMicroelectronics

Bio :

With 25 years of experience in wet process technology for semiconductor manufacturing, Philippe is an R&D senior expert in materials and surface preparation at STMicroelectronics.

He has developed pioneering wet single wafer tools and gate oxide patterning techniques. His innovations have improved manufacturing efficiency, reduced costs, and enhanced product quality. In addition, Philippe supervises PhD studies on topics such as wetting, acoustics, wet chemistry infiltration, and particle removal.

Senior Member of the ST Technical Staff, Philippe has an MS in Chemistry from ENSIACET, Toulouse. He has published over 60 papers at international conferences.

10.25 a.m. - 10.40 a.m.

[2025][LID-WORLD] The keys to sustainable ICs (matin)

Senior Member of Technical Staff Wet / Bonding R&D, STMicroelectronics

From inception to industrialization: Challenges in developing new chemical formulations for semiconductors... more info