Bio:

Bastian Tröger is the Director of Product Marketing and Sales Support for Camtek's Metrology product range.
As a graduate engineer specializing in physical optics, he brings many years of experience in optical metrology. He began his career at Camtek Metrology (then FRT GmbH) in 2007 within the development department, later established the company's product management department, and ultimately advanced into senior management.

Abstract:

The semiconductor packaging industry is accelerating beyond 2026, driven by AI, automotive, and data center demands. Advanced packaging - interposers, chiplets, and FOPLP - is becoming essential for higher performance and power efficiency.
Camtek's metrology solutions support this shift with a flexible, modular metrology platform (SurfaceSens) that covers the full range from R&D to HVM and from front- to back-end.
Key applications include thickness and shape measurement, CD/overlay control, RDL analysis, TSV depth/CD, RST, and large-field (nano)topography for CMP and hybrid bonding.
Adaptable handling enables full automation for all wafer sizes and panel-level processing—ideal for future FO-PLP production.