Bio :

Tony Mastroianni has extensive engineering management experience in the global semiconductor industry. In recent years, he has focused significantly on advanced ASIC package design workflow development (2.5/3D). He currently leads development of Advanced Packaging Solutions for Siemens Digital Industries Software. Prior to joining Siemens, he served in IC, Operations and 3DIC engineering leadership positions at Inphi and eSilicon. He earned a bachelor’s degree in electrical engineering from Lehigh University and a master’s degree in electrical engineering at Rutgers University. He is the author of several technical articles and has presented at several industry conferences and has been interviewed in several technical publications. He is an active member in the OCP Chiplet Design Exchange (CDX) working group that is actively driving new and open 3D IC standards and workflows.