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Tony Maindron

3D Integration & Packaging Technologies Industrial Partnership Manager, CEA-Leti

Bio:

Tony Maindron received his PhD in semiconductor science from INRS Energie, Matériaux et Télécommunications, in 2002, in Montréal (Canada). He used to work for Technicolor in Rennes, France, (former Thomson R&D centre in France) where he was an engineer for the development of displays incorporating OLED technology. He joined the CEA-LETI Photonics Department in 2007 where he developed thin film encapsulation, based on Atomic Layer Deposition technology, and color filter technology for OLED-based microdisplays. He moved to Minalogic, a French Innovation cluster based in Grenoble, for 3 three years between 2021 and 2024, as director of micro, nano and quantum technologies. Since 2025 he is back at CEA as an industrial partnership officer in 3D integration and advanced packaging technologies.

[2026] LID Japan

3D Integration & Packaging Technologies Industrial Partnership Manager, CEA-Leti

Beyond scaling: 3D integration connecting the AI ecosystem