Bio:

Dr. Hsiang-Hung Chang (Mike) received his Ph.D. degree in the Department of Power Mechanical Engineering from National Tsing Hua University. Since 2002, he has been with the Electronic and Optoelectronic System Research Laboratories (EOSL) at the Industrial Technology Research Institute (ITRI), where he serves as a member of the Advanced Packaging Technology Division. His research focuses on wafer bonding processes, thin-wafer handling technologies, process integration, and the development of advanced packaging technologies, including 3D IC, fan-out packaging, and co-packaged optics (CPO).