Speakers
Olivier Faynot
EVP, Head of Silicon Component Division, CEA-Leti
Olivier Faynot
EVP, Head of Silicon Component Division, CEA-Leti
Bio :
Olivier Faynot received the M.Sc and Ph.D. degrees from the Institut National Polytechnique de Grenoble, France in 1991 and 1995, respectively. His doctoral research was related to the characterization and modeling of deep submicron Fully Depleted SOI devices fabricated on ultrathin SIMOX wafers.
He joined CEA (CEA-Grenoble, France) in 1995, working on Partially Depleted and Fully Depleted SOI technologies development in the frame of Industrial Partnerships.
From 2008 to 2017, he managed various teams focussed on advanced CMOS, memories and 3D technology integration and was assigned on manufacturing sites to implement FDSOI technologies.
During that period, he was engaged in the transfer to production of 28nm and 22nm FDSOI technologies with industrial partners. Those technologies are now available in production.
From 2017 to 2019, he managed the Patterning department at CEA-LETI, within the Silicon Technology division.
Since 2019, he is managing the whole Silicon Component division at CEA-LETI.
He is author and co-author of more than 400 scientific publications in journals and international conferences, and was successively in the committees of the main international Semiconductors conferences like International Electron Device Meeting (IEDM), the symposium on VLSI Technology, the IEEE International SOI conference, the EUROSOI network, the Solid State Device and Materials (SSDM) conference and the International S3S conference.
He received the ‘Général Férié’ award in 2012 and the ‘Electron d’Or’ award with CEA-Leti, ST Microelectronics and SOITEC in 2017.
He has been elected as an IEEE Fellow in 2024 for leadership in CMOS technology development.
Emma Abel
Mobility Electronics - Vice President Engineering Sensors (ME-SE/NE) , Bosch
Emma Abel
Mobility Electronics - Vice President Engineering Sensors (ME-SE/NE) , Bosch
Bio :
Biographie : Emma is VP Engineering at Robert Bosch GmbH in Reutlingen Germany and heads R&D for MEMS Sensors there. She joined the Bosch Group in 2002, and has since held various positions in field of MEMS, semiconductors and sensor R&D within various business units within Bosch
She is a MEMS enthusiast, with previous roles including inertial sensor development, functional safety and MEMS Sensor industrialization for consumer electronics. Her current focus is on diversification in MEMS Sensors and their use in intelligent systems.
Emma received her Masters Degree in Electronic and Electrical Engineering from the University of Strathclyde, in UK.
Marc Sansa Perna
Project Manager, Optomechanical Sensors Expert, CEA-Leti
Marc Sansa Perna
Project Manager, Optomechanical Sensors Expert, CEA-Leti
Bio:
Marc Sansa obtained his Ph.D. degree in electronic engineering from the Universitat Autònoma de Barcelona, Barcelona, Spain, in 2013. He is an expert in microelectromechanical system (MEMS) sensors, RF MEMS and optomechanics, having co-authored over 50 publications and several patents. He is currently a project manager at the Sensors and Actuators Laboratory of CEA-Leti.
Caroline Coutier
Electrical Characterization and Reliability Lab Manager, CEA-Leti
Philippe Robert
CEO, iNGage
Philippe Robert
CEO, iNGage
Bio :
Philippe Robert is CEO and co-founder of iNGage, a deeptech startup developing a new generation of high-performance MEMS sensors. He holds a PhD in Microtechnologies and began his career at the startup SILMAG, developing advanced magnetic sensor technologies for data storage, before joining THALES to work on high-end MEMS inertial sensors for aerospace and defense applications.
He joined CEA-Leti in 2001, where he held successive leadership roles, including Head of the MEMS Sensors Laboratory and Head of the Microsystems Department (120+ people), before leading Business Development for Microsystems.
In 2025, he founded iNGage as CEO & CTO, leading corporate strategy, fundraising, and execution.
He has authored over 50 scientific publications and holds more than 60 patents, including more than 20 related to the M&NEMS architecture at the core of iNGage’s innovation.
Pierre-Damien Berger
MEMS Industrial Partnership Manager, CEA-Leti
Pierre-Damien Berger
MEMS Industrial Partnership Manager, CEA-Leti
Bio:
Pierre Damien Berger is MEMS Industrial Partnerships Manager at CEA LETI.
CEA LETI is a leading MEMS R&D lab working for industry, with more than 150 people working on these topics – world’s largest MEMS R&D institute.
Pierre-Damien was previously the MinaSmart (European Digital Innovation Hub) director at Minalogic. He worked before as CPS European projects manager, Head of Smart Devices Program, Industrial Partnership Manager and VP Business Development & Communication at CEA-Leti.
With more than 25 years of experience, 10 years in industry, 15 years in R&D serving industry, his experience has allowed him to master the right balance between business and innovation - Understand and listen to needs, identify and select innovative solutions, enhance the functions that meet expectations, communicate to radiate.
