Program

SUNDAY DECEMBER 8, 2024

From materials to system innovations, shaping the future of global connectivity

05:30 P.M. - 07:00 P.M.

Welcome & Workshop with:

Executive Vice President, Technology Planning & Strategic Programs, CEA-Leti

Thomas Signamarcheix

Executive Vice President, Technology Planning & Strategic Programs, CEA-Leti

Chairman & Master of Ceremony

Deputy Director, CEA-Leti

Jean-René Lèquepeys

Deputy Director, CEA-Leti

Explore, prototype, and test energy-saving chips for digital, analog, and RF at FAMES

Vice President - Product Management, GlobalFoundries

Jamie Schaeffer

Vice President - Product Management, GlobalFoundries

Future Directions and Applications of FD-SOI

Research Engineer, CEA-Leti

Xavier Garros

Research Engineer, CEA-Leti

Boosting connectivity with advanced 3D heterogeneous integration

Research Engineer, CEA-Leti

Daphnée Bosch

Research Engineer, CEA-Leti

3D sequential devices: from energy efficient computing to RFIC analogue stacking

Research Engineer, CEA-Leti

Luca Lucci

Research Engineer, CEA-Leti

CMOS compatible GaN integration for enhanced connectivity and sensing

CEA expert in mmw architecture and system design

Cédric Dehos

CEA expert in mmw architecture and system design

Key enabling technologies for the design of next generation wireless systems in the mmw/sub-THz bands

Head of Laboratory for RF and Energy devices, CEA-Leti

Sami Oukassi

Head of Laboratory for RF and Energy devices, CEA-Leti

Advanced RF filters for wireless communications

07:00 p.m. - 09:00 p.m.

Networking reception
with CEA-Leti’s management and experts